1. 伺服器BIOS軟體開發及維護 2. 客戶規格審閱 3. 專案問題分析及解決

1.BIOS development engineering feasility estimation 2.BIOS product specification definition 3.BIOS engineering specification creation 4.BIOS development 5.BIOS debug and mantainance

1.System BOM 2.System Spec 3.System Assembly SOP 4.System Component Approval Sheet 5.System NPI Support (系統階設計、BOM規劃、組裝規劃、Label 規劃、FRU規劃、Cable設計)

Hardware circuit design, layout, pilot run and debug of telecomm / datacomm products. (Router / Switch / Server)

Owner of the Mobile Broadband (5G) Product Line. As the manager of all Mobile Broadband Product Managers, you drive the the creation and execution of an enticing solutions roadmap based on end user needs, market & technology trends. Our 5G solutions range from Mobile Routers and Indoor Gateways to Outdoor Modems and 5G Cameras. As the head of Mobile Broadband Product Management, you target a winning combination of customer satisfaction and profitability.

1.Experience in signal integrity simulation of system boards and lab instruments, including VNA and TDR. 2.Experience with PDN characterization and trade off performance & cost. 3.Excellent communication and presentations skills are mandatory

1. PCB疊構與阻抗設計 2. Signal Integrity與Power Integrity 的模擬與分析 3. PCB Layout的Rule制定與審核 4. 訊號量測的審核與除錯 5. TDR/VNA量測

1、根據硬體工程師設計的原理圖，完成PCBLayout工作 2、檢查原理圖和Layout的正確性，生成gerber檔，並跟蹤PCB生產 3、熟悉板廠HDI及SMT製程，獨立完成板廠及SMT廠相關EQ，並協助產品線完成PCB及SMT不良分析及改善 4、加分項：瞭解高速光模塊的EMC SIPI 高速模擬，能從layout方面對高速光模組的EMC SIPI及高速性能提出合理化建議

〝• Support execution of Channel revenue plans to agreed metrics and targets • Drive improvement in customer satisfaction through the enablement of strategic account planning, timely issue resolution and internal support • Take active role in operational sales processes, understanding how to operate as one to win in the marketplace • • Build Channel sales strategy utilizing industry knowledge and trends, channel partner insights and High Performance Computing & AI understanding to drive Channel growth and accelerate business model transformation〝

1. PCB Layout 2. 板廠工程問題回覆 3. 產線DFx問題解決

1. 新專案規劃、執行、掌控、成本控制及資源協調。 2. 跨部門溝通協調、 問題追蹤及解決 3. 專案開發會議召集、記錄及進度跟催 4. 客戶溝通協調專案進度 5. 驗證問題追蹤及解決方案時程控管 6. 產品品質問題協調及改善

1. 智慧園區能力：網際網路、BIM、智慧城市、智慧園區、智慧樓宇等場景的Saas服務平台經驗、AI、雲端計算 2. 解決方案設計：需求分析與評估，確定方案思路與規劃，解決方案設計與交流 3. NPDP產品經理認證：新產品開發策略，產品生命週期、競品分析 4. 具備產品銷售模式規劃能力、熟悉公司產品銷售流程 5. 對產業及產品的未來趨勢有清晰的定位與了解，具備產品整體未來規劃及市場落地預期規劃的能力

1、負責400G 、800G及以上速率產品的光引擎光學結構設計，包括概念、設計、供應商選擇、元件評估和研發sample制作 2、負責與供應商溝通光器件指標以及光學結構件的加工，對光機械結構進行公差分析，以及新物料效能評估 3、指導進行熱模擬，以確定熱阻、功耗以及機械效能 4、制定及開發產品前期製程，並對過程開發指導

1. 伺服器BMC韌體設計開發 2. 既有專案維護 3. 跨單位技術上的溝通探討 4. 了解客戶需求與熟悉產品規格

1. 負責Server / Storage 產品的電源開發設計 2. 可承接並獨立完成客戶新機種開發 3. 掌握設計成本並可與客戶討論產品規格 4. 協助工程問題與解決對策

1. Manage team 2. BIOS development planning and management 3. Across function teams communication 4. Customer relationship maintain 5. Cultivate talents

1. 高/低速訊號完整性測試計畫 2. 訊號問題分析 3. 客戶溝通 4. 訊號量測技術研究與導入 1. High/Low speed signal validation 2. System HW validaion 3. High speed bus length review 4. System margin test 5. PCB impedance/insertion loss test

1. Work with engineering team for new product introduction quality issue resolution. 2. Facilitate the 8D resolution for Sl/field quality issues to ensure containments, develop and validate CAs and preventive actions. 3. Verify the quality and performance of products and conduct periodic quality status reporting and review with customers. 4. Convert the lessons learnt into internal process improvements.

1. Profiling 2. Performance analysis & optimization (mainly focus on CPU/GPU/Memory) 3. Network performance analysis & optimization

1.系統設計： 參與整個硬體系統的設計階段，理解系統需求，確定硬體組件的配置和連接方式––＞系統Cable設計與routing，解決硬體集成過程中的問題。 2.BOM建置 : 板廠TLA BOM設置.系統L6/L10 BOM設置。 3.主板組裝生產SOP.生產SOP.L6/L10系統組裝。 4.標籤設計 : 主板.系統.包材Label設計規劃。 5.包材設計與驗證 : 包材設計與驗證過程中確認問題與Debug。 6.系統物件料號申請 : 系統組裝物料設計.尋找.以及PN申請。 7.文件撰寫 : Design Proposal / Design Drawing / Packaging Test Plan / Packaging Test Report / Screw List / Label Plan/ Cable List / Cable Plan / Cable 2D drawing / Cable Report。 8.以系統角度確認並反饋各單位設計問題，與其他團隊成員，如硬體工程師、測試工程師和專案經理等協作，確保整個開發過程的順利進行。