CSR專區

1.協助廚房食材準備與保存，確保新鮮與質量。 2.熟悉菜單內容，提升點餐效率與顧客服務品質。 3.操作點餐系統與收銀，確保交易迅速準確。 4.遵從餐飲衛生與安全規範，維護環境清潔。 5.具備良好溝通能力，促進團隊合作與和諧。 6.靈活應對多任務挑戰，具抗壓能力與時間管理。 7.解決顧客問題與需求，提供優質服務與體驗。 8.協助餐桌禮儀服務，提升顧客用餐滿意度。

✨喜歡與人互動嗎？ ✨想學一技之長嗎？ ✨想挑戰高收入嗎？ 黎芮絲美容團隊正在擴大徵才，歡迎充滿熱忱、願意學習的你加入我們！ 【工作內容】 ✔ 接待來店顧客與服務安排 ✔ 協助顧客進行肌膚與身體保養諮詢 ✔ 美容課程與居家保養商品介紹 ✔ 顧客關係維護與定期追蹤 ✔ 學習美容專業知識與銷售技巧 ✔ 維護店內環境整潔與服務品質 ✔ 協助完成團隊目標與活動推廣 ⸻ 我們希望你具備 ✅ 喜歡與人互動及服務 ✅ 對美容保養產業有興趣 ✅ 願意學習新事物 ✅ 具責任感與企圖心 ✅ 有服務業、業務或銷售經驗者佳 ✅ 無經驗可，公司提供完整培訓 ⸻ 薪資福利 💰 月薪32,500元～65,000元以上 💰 業績獎金另計 💰 定期教育訓練 💰 完整升遷制度 💰 員工購物優惠 💰 不定期聚餐與員工活動 ⸻ 發展願景 在黎芮絲，我們重視每位夥伴的成長與發展。 從美容顧問開始，透過完整教育培訓與實戰學習，未來可晉升資深美容顧問、店主管及營運管理職位。 只要願意學習、願意努力，公司願意提供舞台讓你發揮價值，創造屬於自己的高收入與成就感。 ✨歡迎想改變現況、挑戰高收入的你加入我們，一起成長、一起成功！

1. 負責客人用餐時，桌邊服務之工作。 2. 於客人用餐完畢後，負責收拾碗盤與清理環境。 3. 負責結帳、收銀之工作。

1. 負責客人用餐時，桌邊服務之工作。 2. 於客人用餐完畢後，負責收拾碗盤與清理環境。 3. 負責結帳、收銀工作。

1. 負責客人用餐時，桌邊服務之工作。 2. 於客人用餐完畢後，負責收拾碗盤與清理環境。 3. 負責結帳、收銀之工作。

1.製作吧台等飲品(如咖啡、果汁、茶等飲品調製) 2.負責清洗餐具、吧台設備以及周遭工作環境整理

1. 負責客人用餐時，桌邊服務之工作。 2. 於客人用餐完畢後，負責收拾碗盤與清理環境。 3. 負責結帳、收銀之工作。

1. 負責客人用餐時，桌邊服務之工作。 2. 於客人用餐完畢後，負責收拾碗盤與清理環境。 3. 負責結帳、收銀工作。

1. 負責客人用餐時，桌邊服務之工作。 2. 於客人用餐完畢後，負責收拾碗盤與清理環境。 3. 負責結帳、收銀之工作。

1. 負責客人用餐時，桌邊服務之工作。 2. 於客人用餐完畢後，負責收拾碗盤與清理環境。 3. 負責結帳、收銀工作。

職掌: 1.掌握產品市場新趨勢，掌握並提升產品的競爭力，提供內部人員專業諮詢與建議。 2.規劃產品策略、藍圖以及管理產品生命週期。 3.管理產品開發與量產之相關協調工作或技術移轉專案(包括專案規劃、專案組織成立以及開發時程、成本、品質等之控管等)。 4.採購核價、議價、下單、成本掌控及交期控制、進行驗收作業。 5.建立、更新供應商資料（如：貨品價格、規格和到貨時間），以選擇最佳供應商。 6.供應商維護及管理，與良好供應商維持良好關係。 7.開發新產品，新供應商蒐集，找尋品質好、成本低、配合度高的優良供應商。 8.提供緊急措施，使需求業務可做緊急採購。 9. 解決商品瑕疵退貨等問題。 10. 具備國貿、熟悉進口/三角貿易實務流程及採購流程。 11.語文能力(JLPT N1或N2檢定程度) 12.電腦能力(包含邏輯、組織、文書及簡報)、Vlookup&函數試算能力。 13.表達溝通能力(包含說服力) 14.普世價值:配合度、團隊合作特質 加分條件: 具品牌概念與代理品牌經驗。 公司官方網站 https://www.wonson.com.tw/zh-TW

Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/APAC-Foundry-Operations-Senior-Principal-Engineer_R-10062827 Job Description The APAC Foundry Operation team works with foundry partners on technologies which are evaluated and/or subjected to production. The key areas of responsibility of the jobholder are: - Lead the release and transfer of process options at foundries. - Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process - Lead and steer the projects towards timely completion to support NXP business needs. - Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc. The requirement fulfilling the job: - Bachelor or MSc in physics, material engineering or electrical engineering. In-depth knowledge of semiconductor physics, process development and manufacturing. - ＞10 years of experience with semiconductor process integration, working in foundries’ production or development teams. - Hands on experience in being a lead; leading teams with responsibilities in development, transfer or production projects. - All rounded knowledge on process integration, product testing, reliability testing, tapeouts, device physics will be needed in the discharge of duties as a project/ integration lead. - Good communication skills. - Pro-active working attitude, creative, pragmatic, enterprising and result driven. - Having the ability to influence and steer a discussion. - Familiar in managing/working with foundries, maximizing leverage from foundries.

Job Responsibilities - To be the owner for manufacturing test on the released products. - Responsible for test program introduce to mass production - Responsible for NPI (after R-gate released) test data analysis and feedback to BL/PETE if any improvement needed - To be the owner for duplicated test hardware by performing debug and qualification, MSC (Gage R&R) analysis and release report - Responsible for 1st line hold lot disposition, including low yield, QA fail .......etc - To initial and work with related process owners on testing processes, documentation, and best practices - Participate in or drive test automation initiatives when applicable Required Qualifications - 3+ years of experience as a Test Engineer - Solid understanding of software/system testing methodologies - Familiarity with Linux environments and command-line operations - Experience with machine language (e.g., Java, C++) - Experience in system, embedded, hardware, or manufacturing testing - Strong analytical and problem-solving skills - Strong sense of ownership and responsibility for product quality English communication, reading, writing

Role Summary: The NVM Reliability team is responsible for characterizing, modeling, and enabling next-generation Non-Volatile Memory technologies, enabling new product creation company-wide. Job Responsibility: －Interface with foundries and other external suppliers of technology and IP to assess reliability margin to product applications. －Establish qualification requirements for new technology and product introduction. －Perform rigorous statistical analysis of reliability characterization data. －Enable high reliability during volume production by working with product groups to address risk areas. －Support business groups with customer requests for technical information, including reliability characterization results, risks assessments, and consultation on issues. －Communicate study conclusions and recommendations to internal and external teams. Job Qualification: －Bachelor‘s, Masters, or Doctoral degree in Electrical Engineering, Applied Physics, or equivalent, with 10 years of industry experience. －Experienced in data processing and analysis (e.g. Python, JMP, Matlab, Exensio). －Software development experience, such as familiarity with microcontroller software development (C/C++) is desired. －Interest in statistics and solid-state device fundamentals, especially as applied to emerging non-volatile memory technologies like MRAM and RRAM. －Must be curious, proactive, and detail-oriented. －Able to work in a team environment, communicate effectively in English and Mandarin, and solve problems.

***Please apply for this position on NXP official website: https://pse.is/8ms2kr Role Purpose Lead the development and optimization of high-voltage (HV) and BCD device architectures. This role requires a deep understanding of device physics and a data-driven approach to ensure industry-leading performance and reliability for power management solutions. Key Responsibilities － Device Development: Lead the architecture design and optimization of HV devices (LDMOS, EDMOS, ESD) on 180nm to 55nm BCD nodes. － Physics Analysis: Analyze and optimize Device Physics parameters, including BV, Rdson, SOA, and reliability (HCI/NBTI). － Simulation & Modeling: Utilize TCAD for 2D/3D process and device simulations to accelerate development cycles. － Device Verification: Define verification plans and execute statistical analysis using JMP for DOE and WAT data. － Design Integration: Work within Cadence environments for layout review and test structure design. － Cross-functional Collaboration: Partner with PI and PE teams to resolve yield, reliability, and manufacturing bottlenecks. Required Qualifications － Experience: Master‘s or Ph.D. in EE, Physics, or related field with 10+ years of semiconductor industry experience. － Technical Expertise: 1. Profound knowledge of Device Architecture and Device Physics. 2. Hands-on experience in 180nm to 55nm BCD process nodes. － Tools: 1. Expertise in TCAD (Sentaurus / Silvaco). 2. Expertise in JMP for statistical data analysis. 3. Proficiency in Cadence (Layout/Virtuoso). Preferred Qualifications (Plus) － Advanced Power Devices: Experience with GaN, SiC, or IGBT development. － Silicon Photonics: Knowledge of Photonics integration and device physics. － Domain Knowledge: 1. Process Integration (PI): Understanding of mask flow and doping profiles. 2. Product Engineering (PE): Experience in CP/FT data correlation and yield enhancement. Competencies － Accountability: Strong ownership of project milestones and outcomes. － Critical Thinking: Ability to identify root causes in complex device failures. － Interpersonal Skills: Effective communication across design and foundry teams. － Data-driven: Committed to objective decision-making through rigorous data analysis.

The key areas of responsibility of the jobholder are: - Collaborate closely with foundries, NXP technology teams, and business lines to qualify and release advanced FinFET processes. - Provide technical leadership in semiconductor device physics, especially in FinFET architecture and behavior. - Interface with internal and external stakeholders on critical development and transfer projects. - Lead and steer projects to meet timelines and business objectives. - Make key decisions on process integration, balancing technical, logistical, and strategic factors. - Support NTI process transfers within foundries and NXP joint ventures Requirements / preferences: - Bachelor‘s or Master‘s degree in Electrical Engineering, Physics, or related field. - Minimum 10 years of experience in semiconductor device engineering, with a strong focus on advanced logic/RF devices. - Proven hands-on experience with HKMG and FinFET technologies in production or development environments. - Deep understanding of semiconductor device physics, especially HKMG and FinFET. - Strong analytical skills in yield enhancement and electrical data analysis. - Fluent in English and Mandarin. - Demonstrated leadership in development, transfer, or ramp-up projects. - Excellent communication and influencing skills. - Proactive, pragmatic, and results-driven mindset. - Experience working with foundries and leveraging external manufacturing capabilities .

- Data analysis to ensure handler work on baseline. Ex. MCBA, index time, temperature control and HW interface maintenance 資料分析確保機台運作在基準條件, 包含作動不順, 作動時間, 溫度控制, 及機台介面維護 - SOP, OCAP, PM document creation. 建立標準化流程,異常處理文件,及保養維護文件 - Responsible for the performance of handler. 負責機台性能及相關報告 - Handle the improvement project on handler. 持續進行機台的改善計畫 - Management recipes of handler and spare parts 機台參數管理及備品管理 - Provide technology and operation training to shift assistant engineer and operators in manufacture lines to support production smoothly. 訓練助理工程師與作業員以利生產線順利運作 - Co-work with worldwide handler team for evaluation/improvement 與其他機台團隊跨國合作, 導入評估, 問題改善

***Please upload English resume onto our official platform: https://reurl.cc/1bbx6m Job Descriptions - The selected candidate will participate in Wi-Fi/BT software/firmware design , implementation, integration, validation and maintenance phases for standard based and non-standard based Wi-Fi/BT/BLE products for IOT and automotive markets. - Lead/participate in complex feature integrations/enhancements, Wi-Fi/BT/BLE SoC bring up, and technical issue solving. - Research, design and develop cutting edge technologies for industrial features and IEEE/WFA/BT/BLE spec. Ranging from Wi-Fi enterprise access point, embedded clients and other wireless technologies. - Participate the full life cycle of IC – spec designing, pre-silicon validation, chip bring-up, software development, customer engaging and supporting. Support customers remotely or onsite as needed. Qualifications - MS in EE, CE, or CS. - Proficient in C programming language. - Experience on Linux / Android programming is a plus - Knowledge on real-time OS (FreeRTOS / ThreadX) programming is a plus - Knowledge of ARM assembly is a plus - Team player and excellent interpersonal, communication and writing skills - Independent, self-motivated and willing to learn

Please apply for this position on NXP official website: https://pse.is/836k2a Job Responsibilities: APAC Central Competence Team works with external foundries to ensure stable chip supply for business lines across NXP. The primary responsibility of this role is to locally drive the lead products ramp up under new technology introduction (NTI). The key areas of responsibility of the jobholder are: 1. Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process 2. Front end process safe launch owner. Closely work with foundries at ramp up phase and drive for manufacturability and yield improvement. 3. Interface with key customers on critical projects. 4. Lead and steer the projects towards timely completion to support NXP business needs 5. Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc Requirements / preferences: 1. Bachelor or MSc in physics or electrical engineering. 2. ＞10 years of experience with front-end IC process integration, working in foundries’ production or development teams 3. In-depth knowledge of IC devices and processes. FinFET and NVM knowledge is a plus. 4. Strong understanding of yield enhancement techniques and data analysis 5. Must be fluent in English and Mandarin 6. Hands on experience in being a lead; leading teams with responsibilities in development / transfer projects or production ramp up. 7. Good communication skills. Having the ability to influence and steer a discussion 8. Pro-active working attitude, creative, pragmatic, enterprising and result driven. 9. Familiar in managing/working with foundries, maximizing leverage from foundries

1.生產排程協助 2.工單與文件管理 3.交期控管與跟催 4.庫存與物料管理協助 5.跨部門溝通 -具基本製造流程概念（加工業尤佳） -細心負責、具溝通協調能力