1. 新模具開發專案跟進 (NPI) 與試產驗收 2. 模具 BOM 表維護與工程變更 (ECN/ECO) 管理 3. 模具加工異常跨部門協調與解決 4. 模具驗收規範與工程文件編撰
1. 模具零件加工工藝路線規劃與工時制定 2. 加工瓶頸分析、切削參數優化與週期縮短 3. 模具加工自動化夾治具與流程導入 4. 加工不良原因分析與良率提升
1. 與客戶溝通並確定測試要求; 2. 較強的英文溝通能力 3. 較強的團隊合作能力及協調能力 4. 抗壓能力強,適應環境能力強
1. Technical Design Leadership & Architectural Oversight 2. Engineering Team Management, Mentorship & Resource Allocation 3. Design Validation & Risk Gatekeeper Management 4. Cross-Functional Optimization & NPI Handover Strategy 5. Vendor & Hyperscaler Technical Alignment
1. Centralized Lab Resource Orchestration & Schedule Alignment 2. Multi-Disciplinary Team Leadership & Engineering Governance 3. Global Regulatory Certification & Compliance Oversight 4. Technical Gatekeeping, Test Strategy, & Failure Analysis 5. Facility Safety Policy Management & Operational Audit
1. Regulatory Testing, Evaluation & Certification Execution 2. Early-Stage Design-In Compliance & Risk Assessment 3. Standards Research, Interpretation & Strategy Formulation 4. Technical Documentation & Technical Construction File (TCF) Management 5. Factory Audits & Production Line Compliance Maintenance 6. Vendor & Third-Party Laboratory Relationship Management
1. Integration Test Execution, Defect Triage & Debugging 2. Test Plan Formulation & Test Case Design 3. Automated Test Script Development & CI/CD Alignment 4. Test Environment Setup & Infrastructure Maintenance 5. Non-Functional Integration Testing (Performance, Stress & Robustness) 6. Technical Documentation, Metrics Reporting & Post-Mortem Reviews
1.負責機構件採購作業,包含詢價、比價、議價、採購下單及合約管理。 2.負責/協助供應商開發、評估與管理,定期維護合格供應商名錄(AVL),確保供應來源及供應鏈穩定。 3.參與新產品導入(NPI)採購作業,與研發、工程等單位合作,進行詢報價、樣品進度追蹤及委外加工等相關事項。 4.負責原物料、生產耗材及治具之採購與交期管理,包含進口作業、帳務核對及供應異常協調,確保物料如期到位,避免影響量產及專案時程。 5.配合品保單位執行供應商稽核及品質管理,協助追蹤品質異常改善,並彙整、維護相關品質文件。 6.執行專案採購及其他採購相關行政作業。
1.負責規劃與執行招募流程作業(IDL&DL),包含需求確認、選才、面談與任用管理等。 2. 開發與維護多元人才招募管道,包含人力銀行、獵才/派遣人力、校園招募、建教合作、內部推薦及其他人才媒合管道。 3. 分析與追蹤人力及招募相關數據,掌握招募進度、人力需求及招募成效,並提出改善建議。 4. 擔任 HRBP,負責所屬單位人力資源管理工作。 5. 執行及推動人資專案。
網通產品 1.新機種/季度報價 2.材料成本控管 3.採購繯境建立/控管 4.供應商管理 5.與中央單位協調、合作
1.曾負責 DDIC(Display Driver IC)及 Gold Bump Wafer 之 CP 測試者優先 2.負責 CP 測試程式、測試條件及測試流程之建立與最佳化,包含新產品導入、工程批驗證及量產條件建立。 3.負責測試相關 SOP、Control Plan、PFMEA、OCAP及相關工程文件建立與維護。 4.視專案需求參與新 Tester、Prober、Probe Card及測試平台之評估、導入與 Qualification。 5.具有設備選型、新產線建置或 Technology Transfer經驗。 6.具英文技術文件閱讀、撰寫及溝通能力。 Responsibilities 1.Candidates with hands-on CP testing experience for DDIC (Display Driver IC) and Gold Bump wafers are highly preferred. 2.Responsible for the development and optimization of CP test programs, test conditions, and test flows, including New Product Introduction (NPI), engineering lot validation, and mass production test setup. 3.Develop and maintain test-related SOPs, Control Plans, PFMEAs, OCAPs, and other related engineering documentation. 4.Participate in the evaluation, selection, qualification, and implementation of new testers, wafer probers, probe cards, and test platforms according to project requirements. 5.Experience in equipment selection, new production line setup, or technology transfer is preferred. 6.Proficiency in reading and writing technical documents in English, with effective English communication skills.
1.負責新產品及新客戶 NPI(New Product Introduction),包含製程條件建立、DOE、工程批驗證、量產移轉及製程文件建立。 2.協助建立及維護 SOP、Control Plan、PFMEA、OCAP、製程規格及相關工程文件。 3.視專案需求參與新設備、新材料、新化學品及新製程之評估與導入。 4.具有 Gold Bump 新產線建置、technology transfer或產能擴充經驗。 5.具備英文技術文件閱讀、撰寫及溝通能力 Responsibilities 1.Lead New Product Introduction (NPI) for new products and customers, including process condition setup, DOE execution, engineering lot validation, mass production transfer, and process documentation. 2.Support the development and maintenance of SOPs, Control Plans, PFMEAs, OCAPs, process specifications, and other related engineering documentation. 3.Participate in the evaluation, qualification, and implementation of new equipment, materials, chemicals, and processes as required by projects. 4.Experience in Gold Bump production line setup, technology transfer, or capacity expansion. 5.Proficiency in reading and writing technical documents in English, with effective English communication skills.
管轄IQC / PQC / CS & Training, 總計3個部門, 部門主管職掌如下: 1. 統籌品質策略與標準制定,確保製程、來料、出貨品質穩定 2. 監督供應商品質管理與稽核制度,提升供應鏈品質水平 3. 主導品質異常分析與改善,建立跨部門問題閉環機制 4. 管理品質系統、稽核與訓練,確保符合內外部認證與法規要求 5. 強化客戶品質服務與客訴應對,提升客戶滿意度與信賴感
1.規劃與優化產線布局與動線 2. 建立並維護標準工時,分析製程效率 3. 設計與改善作業方法,提升人機效能 4. 評估產能與人力需求,支援排程與資源配置 5. 主導效率改善與持續改善專案(如Lean、Kaizen)
Responsible for developing smart phone tester and validating the tester system in factory to support a new product introduction from PROTO to MP stage. This includes: 1. Working closely with CM development and design teams early in the product development life cycle. Specifying new feature test coverage/test requirement specification definition 2. Responsible for station online bring up, including tester set up, test SW/HW validation, calibration & stress test. 3. Responsible for analyzing test exception and tester online maintenance 4. Improve station stability to hit MP target
1.負責 SAP ABAP 程式與 SAP Fiori / SAPUI5 前端應用開發與維護 2.進行 OData 服務開發與 API 串接,實現跨系統資料整合 3.與功能顧問及業務團隊合作,評估系統需求並撰寫技術規格書 4.負責系統問題排查、程式除錯及效能調校,確保系統穩定運作 5.持續關注並導入 SAP ABAP / Fiori 最新技術與開發最佳實務
1、數據中心電力架構規劃與電路設計 2、電力工程圖資與系統分析審查 3、高低壓電力設備規格制定與選型 4、電力系統冗餘與高可靠度架構評估 5、系統測試驗證與試運行規劃
1.DC/DC電源規劃與開發 2.Debug與問題解決 3.Second Source認證導入 4.品質問題分析 5.新技術研究與導入
1.分析銀行內部龐大之客群、交易、產品行為數據,剖析客戶跨商品(如:財富管理、信用卡、放款等)之行為,建立精準客群輪廓及標籤。 2.協同業務、行銷團隊設計精準行銷策略,找出跨售(Cross-selling)與向上銷售(Up-selling)的潛在商機,提升客群貢獻度。 3.探索並實作 GAI 在金融數據分析、業務執行流程之創新場景。 1.Analyze large-scale banking data, including customer, transaction, and product behavior data, to identify cross-product customer behaviors (e.g., Wealth Management, Credit Cards, Lending, etc.), and develop customer segmentation models and tagging frameworks to support precise customer profiling. 2.Collaborate with business and marketing teams to design targeted marketing strategies, identify cross-selling and up-selling opportunities, and enhance overall customer value and engagement. 3.Explore and implement innovative use cases of GAI in financial data analytics and business process optimization.
1. 企業現金管理產品功能應用發展規劃與管理 2. 新業務模式規劃與洽談 3. 商品行銷策略規劃 4. 調研企業現金管理產品市場發展與同業競品