CSR專區

1.工程圖面文件收發整理歸檔。 2.協助各監造工程師建立品管文件。 3.上班地點:工務所。

1. 負責炸物之備料、裹粉與油炸作業，依照標準流程完成餐點製作。 2. 操作油炸設備，掌握油溫、炸製時間與起鍋時機，維持炸物的熟度、酥脆度及出餐品質。 3. 依據點餐內容與出餐順序組合餐點，完成裝盒、擺放及外帶包裝。 4. 依照食品安全及餐飲衛生規範，執行洗手、器具消毒、油品檢查與炸油更換作業。 6. 負責炸台、工作檯、抽油煙設備及廚房器具的清潔維護，並進行廚餘處理與垃圾分類。 我們用小小攤車來傳遞美味炸雞，陪伴著大家很多年，是許多遊客來到國華街必吃的美食，也是專屬台南的美好記憶～ 歡迎加入炸雞洋行國華店，與我們一起製作酥脆美味的炸雞與炸物餐點！期待你的加入。

1.辦理住房登記及退房結帳事宜。 2.客房帳務處理。 3.負責夜間櫃檯人力安排、工作分派與人員督導。 4.緊急狀況處理等。 ★大夜津貼另計。

1. 產品組裝、包裝、出貨作業，填寫報表 2. 維持作業品質與工作環境整潔 3. 需在無塵室工作(有冷氣) 4. 可配合加班 5. 其他主管交辦事項

★職務說明： 1.科技產業資訊蒐集 2.科技產業風險評估 3.科技產業融資方案研擬 4.科技產業專案及業務支援 5.科技供應鏈商機分析與目標客群建立 ★具備條件： 1.學歷：碩士學歷以上。 2.經歷：不拘 3.能出具相關研究報告及簡報 ★薪資說明： (1)無經驗人員正式任用後月薪40,000元 (試用期間支領月薪36,000元) (2)經驗人員月薪40,000元以上(依個人資歷彈性敘薪進用) (3)本行於正常工作日供應員工午餐，每人每月3,000元，並由服務單位統一處理，無提供午餐者發放中食費3,000元 為加速招募流程進行，請務必同時投遞人力銀行職缺與登錄本行官網履歷 –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– 台中商業銀行官網-招募專區 https://www.tcbbank.com.tw/employ/RecruitsSys/Job_Statute.asp

1. 加入車輛鈑金學徒(鳳山總公司)，跟著師傅學習車輛板金工件的安裝與修理，從實作中累積專業技能！

1.負責門禁管制、防竊作業及竊盜處理工作等安全維護工作 2.收發文件 3.針對特定處所進行監視，維持公共安全，減少火災、竊盜或其他危險 4.控制照明、取暖、空氣調節及通風等設備 5.社區安全維護管理、保障客戶生命和財產安全

1.負責門禁管制、防竊作業及竊盜處理工作等安全維護工作 2.收發文件 3.針對特定處所進行監視，維持公共安全，減少火災、竊盜或其他危險 4.控制照明、取暖、空氣調節及通風等設備 5.社區安全維護管理、保障客戶生命和財產安全

1.負責門禁管制、防竊作業及竊盜處理工作等安全維護工作 2.收發文件 3.針對特定處所進行監視，維持公共安全，減少火災、竊盜或其他危險 4.控制照明、取暖、空氣調節及通風等設備 5.社區安全維護管理、保障客戶生命和財產安全 288H

1. 依公司勤務調度支援不同精緻社區之門禁管制、巡邏查察、車道管理及臨時代班勤務 2. 執行社區大門、側門、車道及公共區域之人員與車輛進出管制，核對住戶、訪客、廠商及外送人員身分與進出權限 3. 依勤務表巡查大樓梯間、地下停車場、機房、消防設備、電梯及周界區域，確認門窗、照明、監視設備與公共設施狀況 4. 辦理訪客登記、車位及停車證查核、包裹與掛號物品收發，協助住戶、訪客及施工廠商進行社區出入管理 5. 發現火警、防盜警報、設備異常、漏水、停電、可疑人物或其他突發事件時，依緊急通報流程聯繫管理中心、社區管理單位、消防隊或警方並協助現場管制 6. 填寫勤務交接簿、巡邏紀錄、訪客登記、車輛進出紀錄及異常事件報告，執行交接班作業並回報社區安全與設備異常狀況

TWNIC（財團法人台灣網路資訊中心）身為 .tw / .台灣 網域名稱的國碼頂級網域註冊管理局（Registry），我們正在尋找一位具備國際視野與網際網路產業敏銳度的夥伴，加入我們的團隊，擔任「夥伴關係經理」。作為管理局與全球授權「註冊商」（Registrars，如中華電信、GoDaddy、Gandi 等）之間的橋樑，負責建立並維繫合作夥伴關係，透過策略性的關係經營，推動.tw/.台灣網域名稱的註冊數、續約率、加值應用與品牌價值的成長。 1. 通路商業拓展與行銷策略 (Channel Management & BD) (1)規劃與執行優惠方案、促銷活動與註冊商獎勵機制。 (2)開發新的合作註冊商。 2. 關鍵客戶帳戶管理與數據分析 (Key Account Management & Analytics) (1)建立並維持管理局與註冊商之間的溝通與合作夥伴關係。 (2)定期分析網域註冊量與數據、續約率（Renewal Rate）與域名轉移（Transfer）趨勢，並提出對應的因應行動方 案。 3. 技術與營運對接協調 (Technical & Operational Alignment) (1)作為註冊局技術團隊與註冊商之間的協調視窗，協調註冊系統的串接、測試與資料同步。 (2)與註冊商的帳務溝通管理，包含出帳與收款，確保運作的順暢。 4. 政策合規與 DNS 濫用防護 (Compliance & Threat Mitigation) (1)監督授權註冊商落實.tw/.台灣域名註冊規範，並配合中心政策方向推廣域名加值服務（如綠色域名、Registry Lock…等） (2)擔任 DNS 濫用事件（如網路釣魚、惡意軟體散播、DDoS 攻擊來源）的溝通窗口，協調註冊商執行網域封鎖或下 架作業。

【本職缺優先審核至休斯微公司官網投遞人選】請至休斯微官網投遞：https://career.suss.com/en/jobs 【Talents who apply job via SUSS MicroTec Career Website will be given priority review】Please apply opening here：https://career.suss.com/en/jobs ________________________________________________________________________________ Summary: The position is to lead manufacturing team in SUSS MicroTec Taiwan factory to meet organization target and people management. - Ensure the planned outputs are delivered based on good quality standardization and on time delivery. - Improvement / Kaizen for the quality, production activities and related processes. - Manpower planning and people development - Responsible for the manufacturing team KPI Tasks: Support process improvements, Lean Manufacturing, Quality improvements and People Development Quality: - Ensure manufacturing team to produce SUSS systems in accordance with established specifications. - Ensure assembly team to observe and report systems issues and support on solution to avoid the defect pass through to next steps. - Lead Process Improvement Team for structural solution both technical and process issues. - Responsible for the quality improvement of products and processes. - Ensure manufacturing team to apply and follow 5S in all working area Production: - Coordinate the activities given in the production plan and monitor the progress. - Lead the continuous improvement of manufacturing activity. - Ensure manufacturing team to produce SUSS systems according to the procedures. - Set an example to other members of the team. - To have overview of total process from assembly through to output and act as escalator for critical issues to drive manufacturing team meet target Planning: - Resource arrangement including manpower, tools and work preparation. - Capacity Resource Planning (CRP) for mid / long term manpower requirement - Control machine cost via monitoring/controlling labor hours for system assembling - Closely control the use of tools, materials and equipment. Skills: - Acquire sufficient knowledge of new and established products and processes, modifications, sub-modules and complete systems. - Mature soft skill for people management - Good mind-set and personality: Target oriented, process driven, systematic and critical thinking - Good communication skills in both, verbal and writing - People management / development Others: - Other tasks assigned by supervisor

The R&D Manager (Hardware) is responsible for leading the hardware development team in the design and enhancement of semiconductor process equipment. This role focuses on mechanical, electrical, and system integration aspects, ensuring product quality, manufacturability, and performance while collaborating closely with software and process engineering teams. Key Responsibilities • Lead the hardware R&D team in developing new semiconductor equipment and improving existing systems, covering mechanical, electrical, and system integration design. • Define hardware architecture, development roadmaps, and engineering priorities in alignment with product and business strategies. • Supervise mechanical and electrical design reviews, prototyping, and validation to ensure reliability and performance targets are met. • Collaborate cross-functionally with software, manufacturing, process, and service teams to ensure seamless product integration and transfer to production. • Evaluate and adopt advanced technologies to enhance equipment precision, stability, and cost efficiency. • Manage project schedules, resource allocation, and technical documentation throughout the development lifecycle. • Drive continuous improvement in design quality, standardization, and modularization. • Coach and develop engineers, fostering technical growth and a culture of accountability and innovation.

【本職缺優先審核至休斯微公司官網投遞人選】請至休斯微官網投遞：https://career.suss.com/en/jobs 【Talents who apply job via SUSS MicroTec Career Website will be given priority review】Please apply opening here：https://career.suss.com/en/jobs ________________________________________________________________________________ Do you think strategically, are you interested in the dynamic market of the Semiconductor Industry and promote the success of innovative technologies? Take responsibility for the success of our products and solutions, develop sustainable strategies and promote innovative technologies in a promising market. We are looking for the next possible date Tasks: 1. Technology Scouting & Market Intelligence • Monitor industry trends and emerging technologies in semiconductor manufacturing and advanced packaging. • Identify future equipment opportunities related to: ◦ Hybrid Bonding ◦ Wafer-to-Wafer Bonding ◦ Die-to-Wafer Bonding ◦ Temporary Bonding & Debonding ◦ Advanced Packaging Lithography ◦ RDL Processing ◦ Heterogeneous Integration ◦ Chiplet Integration ◦ Silicon Photonics ◦ Co-Packaged Optics (CPO) ◦ Glass Core Packaging ◦ HBM Packaging Technologies • Analyze competitive technology developments and provide strategic recommendations. 2. Strategic Customer Engagement • Establish and maintain technical relationships with key customer engineering and technology organizations. • Support technical discussions with process integration, module engineering, R&D and advanced packaging teams. • Participate in customer technology reviews, workshops and roadmap discussions. • Serve as a trusted technical advisor to strategic customers. 3. Product & Technology Strategy • Translate customer technology requirements into actionable product development recommendations. • Support long-term product roadmap planning for: ◦ Wafer Bonding Systems ◦ Temporary Bonding & Debonding Platforms ◦ Hybrid Bonding Solutions ◦ Advanced Packaging Lithography Systems ◦ Large Field Exposure Technologies • Identify technology gaps and future investment opportunities. 4. Competitive Intelligence • Monitor competitive activities, product launches and technology roadmaps. • Benchmark competitor solutions and identify differentiation opportunities. • Deliver regular market and technology assessment reports. 5. Business Development Support • Support strategic account planning and opportunity development. • Prepare technical presentations, technology assessments and business case evaluations. • Support major customer pursuits and technology evaluations. 6. Industry Engagement • Represent the company at major industry conferences and technical forums. • Build relationships with semiconductor research institutes, industry organizations and ecosystem partners. • Maintain awareness of emerging technology developments across the semiconductor industry.

【本職缺優先審核至休斯微公司官網投遞人選】請至休斯微官網投遞：https://career.suss.com/en/jobs 【Talents who apply job via SUSS MicroTec Career Website will be given priority review】Please apply opening here：https://career.suss.com/en/jobs ________________________________________________________________________________ - Primarily responsible for operating and supporting Photomask cleaning, developing and baking equipments. - Set up new equipments and perform final acceptance testing to ensure full compliance with customer and internal requirements. - Maintain production tools in optimal condition and troubleshoot process or equipment issues in a timely manner. - Support Continuous Improvement Projects (CIP) to enhance equipment performance and process quality. - Build and maintain strong communication and relationships with customers to support ongoing collaboration and satisfaction. - Apply in-depth knowledge of application processes and demonstrate strong skills in operating production equipment. - Continuously learn and stay updated on new products, technologies, and processes through scheduled training sessions and self-paced learning. - Attend and participate in sales meetings, product seminars, and trade shows to represent the company and enhance product knowledge. - Keep abreast of semiconductor industry trends, with a focus on photomask equipment and related applications. - Prepare and deliver clear written reports, technical presentations, and documentation to customers. - Perform additional tasks and assignments as directed by the supervisor.

【本職缺優先審核至休斯微公司官網投遞人選】請至休斯微官網投遞：https://career.suss.com/en/jobs 【Talents who apply job via SUSS MicroTec Career Website will be given priority review】Please apply opening here：https://career.suss.com/en/jobs ________________________________________________________________________________ Key Responsibilities: • Lead and drive the qualification, process development, trouble-shooting, characterization of advanced chip/wafer bonding/de-bonding processes for SUSS products to ensure competitive edge of processes performance for customer demands in the domain fields of 3D advanced semiconductor, e.g. SoIC, CoWoS, InFO, BSPDN • Improve the yield of process characteristics by analyzing process symptom data and performing for expertise documentation of technique to conduct 3D processes enhancement for sophisticated technical projects and events • Act as the primary point of contact for on field key customers, manage multi-disciplinary projects and technical tasks of R&D or HVM from concept to completion, ensuring milestones on time and within planning scope • Co-worker with the team to cultivate the continuous BKM techniques knowledge stewardship, accelerating the team‘s technical proficiency • Take accountability and ownership of critical tasks and projects assigned by supervisor Requirements: • Education of Master or beyond in engineering background for Physics, Optics, Material Science, Mechanical Engineering, Electrical Engineering • 6+ years of proven experience in wafer fab working, specifically in 3D wafer process engineering or field applications • Deep technical proficiency with chip/wafer bonder/de-bonder and sophistic knowledge with 3D semiconductor or advanced packaging domains • Demonstrated experience in managing complex projects or tasks • Analytical skills, self-motivated, resilience characteristics with good accountability

【本職缺優先審核至休斯微公司官網投遞人選】請至休斯微官網投遞：https://career.suss.com/en/jobs 【Talents who apply job via SUSS MicroTec Career Website will be given priority review】Please apply opening here：https://career.suss.com/en/jobs ________________________________________________________________________________ Key Responsibilities: • Improve the yield of process characteristics by analyzing process symptom data and performing for expertise documentation of technique to conduct lithography processes enhancement for sophisticated technical projects and events • Perform the qualification, process development, trouble-shooting, characterization of advanced lithography processes for SUSS products to ensure competitive edge of processes performance for customer demands in the domain fields of advanced packaging for 2.5D/3D IC, CoWoS, CoPoS, FOWLP • Act as the primary point of contact for on field customers, work with multi-disciplinary projects and technical tasks of R&D or HVM from concept to completion, ensuring milestones on time and within planning scope • Take accountability and ownership of critical tasks and projects assigned by supervisor Requirements: • Education of Master or beyond in engineering background for Physics, Optics, Material Science, Mechanical Engineering, Electrical Engineering • 5+ years of proven experience in wafer fab working, specifically in lithography process engineering or field application • Good technical proficiency with lithography scanner and knowledge with 3D semiconductor or advanced packaging domains • Analytical skills, self-motivated, resilience characteristics with good accountability • Demonstrated experience in complex projects or tasks

【本職缺優先審核至休斯微公司官網投遞人選】請至休斯微官網投遞：https://career.suss.com/en/jobs 【Talents who apply job via SUSS MicroTec Career Website will be given priority review】Please apply opening here：https://career.suss.com/en/jobs ________________________________________________________________________________ The Software R&D Engineer – Scanner is responsible for developing and maintaining software for lithography scanner tools used in semiconductor manufacturing. This includes optimizing HMI, PC platforms, and device control systems. The role also involves leading continuous improvement projects and migrating software to next-generation platforms to align with business and sustainability goals. A strong background in PLC ladder logic and proficiency in C# programming are essential for troubleshooting, maintaining, and enhancing scanner software. This position offers the opportunity to solve complex challenges and contribute to the advancement of semiconductor technology. Task: • Collaborate with the engineering team to develop new features, diagnose root causes, and provide technical support to both the product line and field service teams. • Further standardization of the components used between different module platforms. • Process improvements and quality mindset in design perspective in order to secure production output and deal with customer issue escalation. • Having risk assessments (FMEA) in issue investigation and test planning capability • Software package/patch version control and provide release notes to stakeholders • Involved in ECR (Engineering Change Requests) and CIP (Continued Improvement Projects) according to internal/external customer’s requests. • Responsible for solution delivery and commitment on project timelines. Characteristic: • Teamwork: Able to work in a cross function and international environment. • Self-learning: Able to collect information to improve your knowledge pool, and also help the growth of the team by sharing knowledge. • Proactive: Willing to tackle with technical challenges and the mindset of seeking solutions for continuous improvement. • Planning: Result oriented thoughts for assigned task and project. Business travel requirement: • Less than 2 month a year. • Maximum 10％ support at customer side