交大專區

1.工作內容主要為租用的柴油發電機添加柴油及例行巡檢. 2.需會具備手排車汽車駕照，月休８日. 3.協助主管交辦事宜.

Job Description -　Main contact window with business lines (BLs) to deliver a high quality and manufacturable product for IC test production, meeting or exceeding the required time to market or product cost. -　Take lead of new product introduction (NPI) for IC test -　To coordinate with related BLs (business line) and align with wafer/final test factories to prepare the product transfer -　To improve new product introduction procedure to enable smooth product transfer -　To reduce risk and impact to customers and factories, escalation management, e.g. reduce risk and impact by right and timely escalation -　To ensure no gap on test tooling availability Facilitate IC test data review and process for planning forecast, take responsibility on test technical data (and improvement plan) in time and accuracy -　To follow up test improvement projects, hold lots, progress of New Product Introduction, test buy off…etc. -　Process of Test Engineering Notice and Enovia ECO Requirement -　Bachelor degree (or above), Engineering background is preferred. -　Excellent communication skills (English/Mandarin, TOEIC＞600) -　Good logic thinking -　Be familiar with MS Office tool -　1 yrs experience in IC testing or related working experience is preferred

Job Responsibilities - To be the owner for manufacturing test on the released products. - Responsible for test program introduce to mass production - Responsible for NPI (after R-gate released) test data analysis and feedback to BL/PETE if any improvement needed - To be the owner for duplicated test hardware by performing debug and qualification, MSC (Gage R&R) analysis and release report - Responsible for 1st line hold lot disposition, including low yield, QA fail .......etc - To initial and work with related process owners on testing processes, documentation, and best practices - Participate in or drive test automation initiatives when applicable Required Qualifications - 3+ years of experience as a Test Engineer - Solid understanding of software/system testing methodologies - Familiarity with Linux environments and command-line operations - Experience with machine language (e.g., Java, C++) - Experience in system, embedded, hardware, or manufacturing testing - Strong analytical and problem-solving skills - Strong sense of ownership and responsibility for product quality English communication, reading, writing

***Please apply for this position on NXP official website: https://pse.is/8ms2kr Role Purpose Lead the development and optimization of high-voltage (HV) and BCD device architectures. This role requires a deep understanding of device physics and a data-driven approach to ensure industry-leading performance and reliability for power management solutions. Key Responsibilities － Device Development: Lead the architecture design and optimization of HV devices (LDMOS, EDMOS, ESD) on 180nm to 55nm BCD nodes. － Physics Analysis: Analyze and optimize Device Physics parameters, including BV, Rdson, SOA, and reliability (HCI/NBTI). － Simulation & Modeling: Utilize TCAD for 2D/3D process and device simulations to accelerate development cycles. － Device Verification: Define verification plans and execute statistical analysis using JMP for DOE and WAT data. － Design Integration: Work within Cadence environments for layout review and test structure design. － Cross-functional Collaboration: Partner with PI and PE teams to resolve yield, reliability, and manufacturing bottlenecks. Required Qualifications － Experience: Master‘s or Ph.D. in EE, Physics, or related field with 10+ years of semiconductor industry experience. － Technical Expertise: 1. Profound knowledge of Device Architecture and Device Physics. 2. Hands-on experience in 180nm to 55nm BCD process nodes. － Tools: 1. Expertise in TCAD (Sentaurus / Silvaco). 2. Expertise in JMP for statistical data analysis. 3. Proficiency in Cadence (Layout/Virtuoso). Preferred Qualifications (Plus) － Advanced Power Devices: Experience with GaN, SiC, or IGBT development. － Silicon Photonics: Knowledge of Photonics integration and device physics. － Domain Knowledge: 1. Process Integration (PI): Understanding of mask flow and doping profiles. 2. Product Engineering (PE): Experience in CP/FT data correlation and yield enhancement. Competencies － Accountability: Strong ownership of project milestones and outcomes. － Critical Thinking: Ability to identify root causes in complex device failures. － Interpersonal Skills: Effective communication across design and foundry teams. － Data-driven: Committed to objective decision-making through rigorous data analysis.

The key areas of responsibility of the jobholder are: - Collaborate closely with foundries, NXP technology teams, and business lines to qualify and release advanced FinFET processes. - Provide technical leadership in semiconductor device physics, especially in FinFET architecture and behavior. - Interface with internal and external stakeholders on critical development and transfer projects. - Lead and steer projects to meet timelines and business objectives. - Make key decisions on process integration, balancing technical, logistical, and strategic factors. - Support NTI process transfers within foundries and NXP joint ventures Requirements / preferences: - Bachelor‘s or Master‘s degree in Electrical Engineering, Physics, or related field. - Minimum 10 years of experience in semiconductor device engineering, with a strong focus on advanced logic/RF devices. - Proven hands-on experience with HKMG and FinFET technologies in production or development environments. - Deep understanding of semiconductor device physics, especially HKMG and FinFET. - Strong analytical skills in yield enhancement and electrical data analysis. - Fluent in English and Mandarin. - Demonstrated leadership in development, transfer, or ramp-up projects. - Excellent communication and influencing skills. - Proactive, pragmatic, and results-driven mindset. - Experience working with foundries and leveraging external manufacturing capabilities .

- Data analysis to ensure handler work on baseline. Ex. MCBA, index time, temperature control and HW interface maintenance 資料分析確保機台運作在基準條件, 包含作動不順, 作動時間, 溫度控制, 及機台介面維護 - SOP, OCAP, PM document creation. 建立標準化流程,異常處理文件,及保養維護文件 - Responsible for the performance of handler. 負責機台性能及相關報告 - Handle the improvement project on handler. 持續進行機台的改善計畫 - Management recipes of handler and spare parts 機台參數管理及備品管理 - Provide technology and operation training to shift assistant engineer and operators in manufacture lines to support production smoothly. 訓練助理工程師與作業員以利生產線順利運作 - Co-work with worldwide handler team for evaluation/improvement 與其他機台團隊跨國合作, 導入評估, 問題改善

***Please upload English resume onto our official platform: https://reurl.cc/1bbx6m Job Descriptions - The selected candidate will participate in Wi-Fi/BT software/firmware design , implementation, integration, validation and maintenance phases for standard based and non-standard based Wi-Fi/BT/BLE products for IOT and automotive markets. - Lead/participate in complex feature integrations/enhancements, Wi-Fi/BT/BLE SoC bring up, and technical issue solving. - Research, design and develop cutting edge technologies for industrial features and IEEE/WFA/BT/BLE spec. Ranging from Wi-Fi enterprise access point, embedded clients and other wireless technologies. - Participate the full life cycle of IC – spec designing, pre-silicon validation, chip bring-up, software development, customer engaging and supporting. Support customers remotely or onsite as needed. Qualifications - MS in EE, CE, or CS. - Proficient in C programming language. - Experience on Linux / Android programming is a plus - Knowledge on real-time OS (FreeRTOS / ThreadX) programming is a plus - Knowledge of ARM assembly is a plus - Team player and excellent interpersonal, communication and writing skills - Independent, self-motivated and willing to learn

Please apply for this position on NXP official website: https://pse.is/836k2a Job Responsibilities: APAC Central Competence Team works with external foundries to ensure stable chip supply for business lines across NXP. The primary responsibility of this role is to locally drive the lead products ramp up under new technology introduction (NTI). The key areas of responsibility of the jobholder are: 1. Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process 2. Front end process safe launch owner. Closely work with foundries at ramp up phase and drive for manufacturability and yield improvement. 3. Interface with key customers on critical projects. 4. Lead and steer the projects towards timely completion to support NXP business needs 5. Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc Requirements / preferences: 1. Bachelor or MSc in physics or electrical engineering. 2. ＞10 years of experience with front-end IC process integration, working in foundries’ production or development teams 3. In-depth knowledge of IC devices and processes. FinFET and NVM knowledge is a plus. 4. Strong understanding of yield enhancement techniques and data analysis 5. Must be fluent in English and Mandarin 6. Hands on experience in being a lead; leading teams with responsibilities in development / transfer projects or production ramp up. 7. Good communication skills. Having the ability to influence and steer a discussion 8. Pro-active working attitude, creative, pragmatic, enterprising and result driven. 9. Familiar in managing/working with foundries, maximizing leverage from foundries

1. 指揮並監督工人，以控制工程的執行進度與施工品質。 2. 計劃、組織及指揮有關工程的活動與維護結構、設施與系統。 3. 與所有人、承包商及業主共同商量，討論及解決如工作問題等事務。 4. 審查與檢閱專案的規劃，以監控是否遵守安全法規和其他章程。 5. 預先檢查分包廠商施工前之準備工作。 6. 進行相關設備之驗收、設定、測試、淨化、保養及日常操作。 7. 維護日常操作表單紀錄、電腦程式使用日誌與電腦檔案使用記錄等。 8. 其他主管交辦事項。

1.廠區內生產線設備之電控與機械維修。 2.公用系統（水、電、氣及空調等）之日常巡檢保養維護。 3.冷凍冷藏空調系統維修保養。 4.機台保養維修。 5.鍋爐及廢水操作。 6.其他主管交辦事項。

1.參與品質改善的執行 2.協助推動人員的教育訓練 3.參與標準化修訂及稽核 4.實際參與生產作業 5.執行上級交辦的工作

1. 研讀相關法規，進行產品的電磁相容EMC安全規範測試 2. 測試產品基本檢修及判定測試結果 3. 測試報告撰寫與審核 4. 協助客戶技術問題 5. 其他主管交辦事項

1、IoT／網通產品WiFi Router、Network Device 硬體架構規劃與電路設計開發 2、MCU電路設計與整合 3、WiFi／Ethernet 電路設計與高速訊號規劃 4、BLE與無線通訊介面設計 5、PCB設計與Layout協作電路佈線與驗證 6、EMI / EMC / RF 測試與問題分析改善 7、樣品驗證與量產導入

1.例行性售後的服務。 2.鍋爐保養與維修及定及檢查作業。 3.提供顧客產品維修後的報價。

1.協助 CPC 部門日常行政作業之運作、執行與進度追蹤。 2.協助跨部門相關議題之溝通、協調與後續追蹤。 3.協助專案／案件之進度控管、資料彙整與追蹤回報。 4.執行主管交辦事項，並進行後續跟進與進度回饋。 5.協助工程單位使用 AutoCAD 進行圖面繪製與基本版面編修。 6.協助採購相關流程作業，包含文件整理、下單及訂單追蹤。 7.協助工程相關 ERP 系統資料建置、維護與整理。 8.支援工程部日常行政庶務及相關行政協助。 9.協助工程部進行簡易產品之基本檢測與紀錄。 10.熟悉鼎新 ERP 系統操作尤佳。

1.廠內設備維修/保養/執行、設備履歷建立/維護。 2.設備/系統維護和監控，例如：機電設備、空調、用水、用電、消防等。 3.不定時巡檢，需配合緊急情況發生時之異常處理。 4.具冷凍機維修經驗者尤佳。

1.具三年以上精密零件成型研磨加工經驗 2.具塑膠模具零件成型研磨加工經驗者尤佳 3.具沖壓模具零件成型研磨加工經驗者尤佳

1.依據施工圖進行現場冷涷空調設備之配管安裝工程 2.空調及冷凍系統設備的保養與維修

1.設計沖壓模具，並參與模具製作、加工、組立、送樣及試模工作。 2.規劃與管理模具之生產線。 3.負責開模前之規劃及開模後之進度掌控。 4.負責模具的維修及保養作業 5.具識圖能力

1設備組立&配管作業。 2.設備組立問題處理與紀錄。 3.客戶端零組件安裝保養。 4.組裝環境&工具管理維護。 5.設備零組件管理。 6.設備零組件進貨檢查管理。 7.設備出機前置作業。 8.設備交機作業。 9.部門制式文書表格資料撰寫。 10.參加外部課程訓練。 11.主管交辦事項處理。