交大專區

*協助資訊設備、系統與網路之維運 *協助排除電腦、系統及相關資訊設備問題 *協助執行主管交辦之資訊相關事項與專案 *入職後提供完整教育訓練與專人帶領，初期不需獨立作業 職務說明 本職務為公司資訊團隊之基礎支援角色， 主要為配合公司營運時段，團隊分工合作、互相支援。

1. 資訊基礎設備與資訊安全管理 2. 系統管理與資料庫維護 3. 應用系統導入與技術支援 4. MES 系統管理與跨部門協作 5. 監督、管理及培育部內人員日常工作。

1-負責與業主溝通協調與駐點現場人員管理。 2-負責案場每月行政文書相關作業。 3-負責帶領團隊執行相關機電系統維護檢修及保養 4-需具甲種電匠或乙級室內配線等相關證照及相關管理經驗者優。 5-薪資依個人證照與經歷進行敘薪。

1.具備 Linux/Unix 與 Windows Server 環境之維運與資安管理能力。 2.熟悉 Oracle、MSSQL、MySQL 等關聯式資料庫，具資料庫設計、效能調校與備援規劃經驗。 3.具備良好的專案管理、跨部門溝通與問題解決能力，能帶領團隊持續優化資訊流程。 4.熟 Expo（例如你曾使用 Expo 管理專案或升級 SDK）。 5.有APP開發經驗（iOS/Android）。

1. Bus and Architecture design and RTL implementation of Smartphone chipset 2. ASIC and Smartphone SoC and mobile computing platform design. 3. System bus and mobile peripheral designs 4. SoC system performance analysis

提供專業建議與諮詢

建築物、廠房空調/無塵室/監控等系統規劃設計

1.製程開發:設備操作與參數調整，後續產品物性及相關數據分析 2.產品開發:配方探討與列印測試 3.開發時程規劃與相關進度掌握 4.DOE實驗設計應用

本公司代理車銑工件機上量測設備,應用在CNC工具機上。 用於金屬工件,模具產品尺寸檢驗量測 包括工件量測Probe與刀具量測與設定Tool setting 本職務擔任量儀產品安裝技術服務與客戶端教育訓練， 需能配合外勤。 (固定或變動薪資因個人資歷或績效而異)

1. Linux作業系統安裝、維護、安全監控、優化、故障處理 2. 熟悉http tcp協議 3. 伺服器日常檢查以及維護 4. 負責產品的部署、升級、優化、需求跟蹤、問題分析等 5. 系統故障解決，追蹤問題並回報處理狀況 6. 完善系統架構與日常運維等相關文檔 7 完成主管交辦事項 ※ 工作需輪班，依照紅字排定月休天數。 ※ 輪值夜班/大夜班 (另有津貼)，輪值大夜班時，每月津貼12,000元以上

1.負責塑膠模具製造流程管理（加工、組裝至試模） 2.模具結構審核與製造可行性評估 3.熟悉加工製程（銑床、CNC、放電、線切割、研磨等） 4.管控加工品質與精度（尺寸、公差、配合間隙等） 5.模具組裝整合與精度調整（滑塊、頂出、冷卻系統） 6.試模問題分析與修模對策（毛邊、卡模、排氣不良等） 7.管理加工進度與交期控管 8.技術指導現場人員，提升製造能力

1.水質取樣、各項儀器檢測分析、操作、校正. 2.水質分析實驗室管理與維護. 3.訂單、系統資料維護及整理. 4.文書、行政作業. 4.物料庫存管理. 6. 工程師其他交辦事項. ※部份工作內容因台積公司規定需著防護用具(防護用具由台積公司提供).

※具市場競爭力的薪資制度，提供保障年薪 13 個月 ※外商的優渥福利制度 ※優於勞基法的特別休假與彈性休假 ※各式福委會補助與活動 【工作內容】 1. 操作 Teradyne UltraFLEX / UltraFLEX Plus / J750 等自動化測試平台，執行 PCB 電性測試、驗證與故障分析 (Debug / Diagnostics)。 2. 進行機台設定、測試程式下載、配置變更及設備保養維護，確保測試系統穩定運作。 3. 依據測試流程及規範，執行成品與半成品檢驗，記錄測試數據與異常結果。 4. 針對異常樣品進行分析、撰寫異常報告 (Failure Report)，並協助工程師改善良率。 5. 支援新產品導入 (NPI) 測試驗證與量產轉換 (Mass Production Ramp-up)。 6. 配合生產進度，確保測試作業按時完成，維持設備稼動率與品質穩定性。 ＊此職位需早班(09:00-18:00)跟午班(17:00-02:00)輪班＊

職位需早班(09:00-18:00)跟午班(17:00-02:00)輪班。 1.負責SMT操機、錫膏印刷等機台設備的基礎操作與維護。 2.檢查待檢物是否確實標明機種與其他規格。 3.依據樣品與BOM表，核對各零件位置與極性是否正確。 4.檢驗基板之零件是否有空焊、短路、缺件、反向等問題，並用箭頭標籤標示不良位置。 5.加強檢驗IC、晶體、電容、LED等有極性之零件。

職位需早班(09:00-18:00)跟午班(17:00-02:00)輪班。 1. 負責 Probe Card 飛針測試包含開發、驗證與量產前測試 2. 撰寫與維護 飛針測試程式 3. 進行 電性量測（Continuity / Short / Open / Resistance / Leakage 等） 與測試結果分析 4. 協助 Probe Card 組裝後電性驗證、良率分析與問題排除 5. 與 製程、設計、製造、客戶端工程師 溝通測試需求與規格 6. 分析測試異常，提出 改善方案與測試流程優化建議 7. 建立與維護 測試規範、SOP、FA 報告與技術文件

Role Summary/Purpose: Hardware design engineer will closely work with worldwide engineers to perform engineering works for hardware testing solution of next generation semiconductor devices. The work includes requirement analysis, feasibility study, solution evaluation, task planning, project management, design execution, quality control and verification. We are working on cutting edge requirement and future technology. Responsibilities: • Provide global semiconductor interface test hardware solutions of next generation semiconductor devices for world-wide customers • Provide chip test interface HW solution engineering to compare pros and cons of different approaches and recommend best option to customers considering both performance, lead time, cost • Responsible for Testing circuits Design and super high layers PCB design for high complexity ATE device interface board correspond to various device testing, eg. Mobile application processor, High performance computer, AI, RF etc. • Responsible for scheme selection of a SUBSTRATE/MLO design in wafer testing, research for low Cost of Test scheme (considering TDE, Skip DIE, substrate stack-up) • Responsible for power integrity (PI) and signal integrity (SI) simulation at board level or system level, frequency domain or time domain to ensure HW product performance at design stage • Implement complex mechanical design/simulation, cable design, thermal evaluation by collaborating with PCB design to achieve premium quality in hardware solution according to customer device testing ultimate challenges. • Responsible for global end to end hardware project management to ensure best quality and on time delivery -Device testing requirement assessment and Feasibility study -Risk analysis and mitigation planning -Schedule planning and project management -Design execution -Regular review with global internal and external customers -Quality Control and Verification • Work closely with Global supply chain, provide solution to solve manufacture (DFM), assembly (DFA) challenges, ensure hardware products on time delivery and very high first pass rate • New technology research, new products, new materials evaluation for next generation device testing • Deliver hardware design training and seminars to customers

We are seeking a highly skilled and motivated Field Application Engineer to provide advanced customer engineering support across our key semiconductor customers. This role will act as a critical technical interface between customers and our internal teams, focusing on problem solving, project execution, and proactive alignment with customer requirements and technology roadmaps. The successful candidate will play a hands-on role in delivering world-class technical support, ensuring rapid issue resolution, and strengthening long-term customer relationships. Key Responsibilities: 1. Advanced Technical Support · Provide expert-level advice on hardware requirements to enable successful loadboard/module design projects. · Conduct schematic capture, component placement, and routing support when needed to address complex technical challenges. · Act as a senior technical resource for diagnosing hardware-related feasibility and performance issues. 2. Customer Engagement & Relationship Building · Gather and validate customer requirements to ensure sufficient information for initiating design projects. · Serve as the primary technical contact, managing expectations and maintaining clear communication with customer engineering teams. · Manage customer interactions throughout the project lifecycle to ensure satisfaction and successful delivery. 3. Application Engineering & Solution Development · Assess and estimate project schedule, cost, and feasibility to define realistic plans. · Support design-in activities by translating customer requirements into technical hardware solutions. · Deliver technical updates, training, and presentations to customers and internal stakeholders. 4. Cross-Functional Collaboration · Collaborate with internal design and project management teams to align project execution with customer requirements. · Provide structured feedback from design projects to influence product development and continuous improvement. · Ensure alignment of project execution with both tactical problem solving and longer-term strategic direction. Preferred Traits: · Resilient and Professional Under Pressure – Remains calm and constructive when facing challenges, escalations, or changing requirements. · Proactive Problem Solver with Strong Ownership – Takes initiative, drives resolution, and ensures customer satisfaction while balancing immediate issue-solving with long-term improvements. · Collaborative and Organized Team Player – Demonstrates a positive “can-do” attitude, manages multiple priorities effectively, and works seamlessly with cross-functional and global teams. This job description serves as a general guide to the responsibilities and qualifications expected for the role and may be subject to modification based on the specific needs of the organization.

DIS Tech’s Project Management team designs custom hardware connecting DUTs to ATE testers (e.g., Teradyne, Advantest). We’re hiring a Project Manager to lead interface projects from concept to delivery. This customer-facing role involves translating requirements into test hardware while managing timelines, resources, and scope. Ideal candidates are engineers ready to grow into leadership, with strong communication, spatial reasoning, attention to detail, and urgency. Mentorship and hands-on training provided. Key Responsibilities: • As a Project Manager, you will be responsible for leading, executing and managing all the engineering activities of the new product design and development project with a high degree of independence and creativity. • Work closely with customers (both internal and external) to gather requirements and acceptance criteria. • Perform project sizing (scope, cost, schedule). • Create statement of work to align clearly with customer about scope, deliverables, schedule, acceptance criteria, risks and mitigation plan. • Create, track and manage detailed project plans and keep customers informed of project status. • Track, assess and communicate impact of changes (change management). • Drive PCB schematic and layout design, working with internal PCB design team. • Drive SI/PI performance optimization, working with internal simulation team. • Manage design reviews and milestone approvals. • Understand our supplier’s DFM rules/requirements/capabilities, and guide design accordingly. • Define PCB materials, stack-up, layout rules. • Work with operations team to ensure project manufacture/assembly/logistics are on-track, lead to resolve any schedule slipping by working out improvement plan • Provide continuous technical support for products already in the field. • Visit or travel to DIS Tech and customer sites as required. • Attend periodic night-time meetings with customers or teams in other regions (EU, US oversea customer when needed).

主要職責： 一、現場技術支援與故障分析 - 於客戶現場及委外半導體封裝測試廠（OSAT）進行產品維護與維修。 - 執行初步故障排除與故障分析，記錄並評估電性輸出數據。 - 解讀測試機數據紀錄，協助故障分析。 - 與公司內部工程團隊（設計、製造、品質工程）協作，進行深入分析並導入可持續的解決方案。 - 支援系統性根本原因調查，收集相關資料並撰寫詳盡且準確的服務報告。 - 主導對外客戶溝通：管理客戶期待、清楚呈現分析結果，並在必要時協助緩解問題升級。 二、內部跨部門協作 - 與同事、技術銷售工程師、專案經理、品質工程師及設計中心密切合作，傳達客戶需求與技術風險。 - 主動分享知識與經驗，支援團隊成員。 - 將客戶回饋轉化為具體可執行的任務，並確保各部門了解其工作背後的目的與意義。 - 作為公司內部團隊與客戶之間的緩衝角色，適當處理問題，維持穩定的合作關係。

We are currently seeking dynamic and results-oriented Technical Sales engineer to join our team at DIS Tech. In this role, the Technical Sales engineer will be responsible for managing and responding to technical product inquiries, understanding customer requirements, and clearly communicating the value and benefits of our products and solutions. The role also serves as a key liaison for addressing post-sales product performance issues. This position is critical in supporting business growth by collaborating with Account Managers or engaging directly with customers to deliver technical support. A strong focus on customer satisfaction, relationship building, and effective project management is essential to success in this role. Responsibilities- •Conduct in-depth analysis of customer needs, pain points, and challenges to develop and deliver customized device interface product solutions that ensure seamless product integration. •Build and maintain strong customer relationships by providing tailored technical solutions for semiconductor device final test and wafer sort applications. •Collaborate closely with customers to define project requirements, identify new business opportunities, and support ongoing sustainment activities. •Develop a comprehensive understanding of DIS Tech products, applications, and processes to effectively address customer needs. •Lead technical analysis and requirements gathering for customer RFQs, preparing detailed technical proposals and quotations. •Deliver pre- and post-sales support by addressing application-specific requirements and assisting the sales team with technical expertise. •Coordinate root cause analysis and corrective action planning with stakeholders to resolve product performance and quality issues in the field. •Work collaboratively with cross-functional teams, including account management, engineering, sales, quality, and operations, to drive business growth and customer satisfaction. •Provide comprehensive training to customers on product use and applications, fostering confidence and satisfaction with solutions. •Stay updated on industry trends, competitor activities, and advancements in existing and emerging technologies, as well as the latest developments in the product line. •Prepare and deliver application notes, white papers, and other technical documentation to support customer education and marketing efforts.