交大專區

職責要求 1. 負責Home audio/sound bar產品系統設計與硬體設計工作。 2. 負責Home audio/soundbar專案的開發、測試及量產工作。 3. 參與客戶會議討論並協助澄清設計相關問題。 任職資格 1. 具備電子電路/電聲測試等專業能力。 2. 具有系統整合/大功率系統/Audio/DSP/MCU & ARM System 開發經驗。 3. 具三年以上系統產品的開發設計/安規測試等相關經驗。 4. 熟悉OrCAD 的操作，並具備一定程度的PADS 軟體操作能力。 5. 具WiFi/BT/etc. 無線開發經驗尤佳。 6. 電子/電機相關科系畢業。 7. 具良好的溝通技巧、工作熱忱、責任感、積極認真的工作態度，以及完成專案的使命感。 8. 大學以上 9. 英文中等

職責要求 1.電池電源管理硬體電路設計。 2.電池韌體參數調校驗證 3.電池特性參數開發 4.PCBA電路板設計驗證。 5.生產文件發行及維護。 6.工廠生產支援。 7.電池電源管理新技術研發。 8.安規測試技術支援 任職資格 1.工作經驗：2年以上 2.學歷要求：專科、大學 3.科系要求：電機電子工程相關 4.工作技能：PCB電路板設計、新產品研發與測試、電子電路設計 其他條件： 1.熟知電子元件，電路設計 2.數位，類比，電源相關電路開發經驗者尤佳 3.PCB 軟體設計經驗尤佳 4.電池相關領域尤佳 (有鋰電池設計經驗)

職責要求 一、團隊管理： 1. 管理後端團隊，以提升開發品質和系統穩定性為目標，持續改善團隊開發流程。 2. 規劃團隊成員的職能發展方向，建立內部的技術交流文化，培育和提昇成員能力，讓成員除了工作產出外，技術能力也能持續成長。 二、產品開發與系統架構設計： 1. 主導 GCP Backend 系統與 API 架構的設計規劃，協同團隊進行效能調教，優化金融數據取得的穩定性和正確性，進而提昇產品服務品質。 2. 帶領團隊建立數據分析平台，包含 ETL、Date Pipeline、Data Warehouse，思考如何基於可擴展性和穩定性的基礎下，規劃跨系統間的整合架構。 3. 採 Scrum 模式開發產品，與 PM、設計、前端團隊合作，定義與探索問題，共同提出解決方案，於每個 Sprint 中進行產品的假設與驗證。 4. 與營運及客服團隊共同協助處理、解決用戶反應之問題，並能以使用者角度分析經常性問題所造成的原因，進而提供改善規劃與建議。 任職資格 1. 五年以上後端開發經驗，二年以上團隊領導經驗，新創團隊經驗尤佳。 2. 優秀的 Cloud Architecture、Microservice、Kubernetes 架構設計能力，熟稔 GCP 或 AWS 服務，具備 System、Networking、Automation、Security 及 Architecting 知識 (公司採全雲架構，使用 GCP 平台)。 3. 熟悉 MySQL、BigQuery 資料庫架構設計，具備效能調教經驗者尤佳。 4. 程式開發以 TypeScript 和 Golang 為主，Python 為輔，至少熟稔 TypeScript，且不排斥學習其他語言。 5. 重視程式碼品質，熟悉 Design Pattern、Clean Architecture，具備 Code Review 、Unit Test 和 CI/CD 經驗。 6. 優秀的團隊合作與溝通能力，能與產品經理，開發者以及其他團對成員共同協作，並樂於分享見解與推動改變。 【加分項目】 1. 有 FinTech 產業經驗，熟悉 Open Banking 開發規範尤佳。 2. 有參與敏捷開發與迭代經驗。 3. 熟悉 ISO 27001、或具備資安相關證照或維運經驗。

職責要求 1. Experience on massive MIMO, beamforming design. 2. DSP/ FPGA L1 SW implementation for 5G. 3. Knowledge of Real-time implementation, algorithm benchmarking, optimization for DSP and CPU processing. 任職資格 1. 碩士畢業，工作經驗至少3年以上 2. 主管職務須具備三年以上相關開發領導經驗

職責要求 1、新產品開發專案，包括市場研究、研發計畫及專利之編寫、規劃與執行 2、負責新材料之評估、測試、分析與產品驗證，產品技術規格與時程管控 3、產品說明書/技術文件撰寫及制訂新產品檢驗標準 4、技術服務及產品客訴問題分析與解決 5、材料加工應用之行銷推廣 任職資格 1、碩士以上學歷 2、化工/化學/材料/纖複/高分子相關科系 3、具高分子、有機合成等相關之研究與開發至少1年以上經驗 4、英文聽說讀寫能力佳(多益700分以上)，或具備與國外客戶溝通的能力 5、能配合出差 【位加分項目】 1、曾有技術服務經驗 2、持有塑膠中心辦理之【初級/中級複合材料工程師】證照者佳或優先面試 3、DOE實驗設計、RD專案計畫、8D report、QC七大手法分析、TQC、TQM、SPC

職責要求 1.負責辦公室自動化與行政後勤管理相關系統之建置與維護作業，如：採購管理系統、公文表單、ITSM等。 2.評估各項業務電腦化需求，提供可行性評估及資訊化建議方案。 3.負責新應用系統建置開發與既有系統維護作業。 4.協助課內專案開發之人力及技術支援。 任職資格 1.具有以JAVA程式語言開發維護應用系統3年以上之經驗。 2.有專案管理經驗者佳。 3.責任心強，學習能力佳，具良好溝通能力可配合團隊運作。 4.須配合使用者需求On call值班(正常上班時段為主)

1. 智能健身IoT設備運動數據處理 2. 演算法測試 3. 自動化程式撰寫

職責要求 1.負責領導資訊部門，對公司ERP進行統籌運作與修正。 2.負責APP開發專案、資訊系統整合、策略規劃與發展方向。 3.負責公司資安政策，確保資訊安全。 4.管理網路、伺服器、機房等硬體設備的維護與優化，並維護內部使用者體驗。 任職資格 1.大學以上，5年以上管理經驗 2.需會Python或C#，熟ERP、APP開發流程

職責要求 1.BMC Firmware Development, maintaining existing codebase and resolving issues 2.Provide technical support to internal team member and customer 3.Willing to work in a dynamic and fast-paced environment 4.Friendly with OpenBMC or SPX arc 任職資格 1.Bachelor‘s degree in computer science or related field and 3+ years of software development experience 2.Familiar with Unix/Linux programming skill, including C/C++/Python 3.Hands on experience in Linux embedded system development 4.Understanding and Implementation of MCTP, PLDM, SPDM, Redfish, RDE, IPMI 5.Python and Robot Test framework for automation unit and functional test plans 6.Having self-learning ability, proactiveness, and innovative thinking

1.工程品質查核及物料管理。 2.文書製作、監工日報填寫與數量核算。 3.請款計價作業審核製作。 4.配合上級主管交辦事宜。

職責要求 1.新產品開發、既有產品維護 3.依需求開發API 4.系統故障排除 5.跨部門溝供開發功能性需求與技術可行性評估 任職資格 1.2年以上的實務開發經驗。 2.對程式物件導向與MVC架構有基本概念。 3.熟悉PHP, 資料庫, Linux基本指令, Git。 4.能夠根據不同的需求寫出安全性高、可讀性高、易擴充及維護的程式。 5.具備獨立開發能力及良好溝通能力，能有效收斂問題並提出解決方案。 6.願意嘗試學習新的技術。

職責要求 1.產品設計與模擬。 2.協助工廠生產產品執行改善分析及提出合適解決方案。 3.產品工程圖面規格的製作與核對確認。 4.開發階段 模具 生產製程問題檢討及改善。 5.協助業務定義客戶規格需求並提出解決方案。 6.專案進度追蹤規劃、主管交辦事項。 任職資格 1. 具connector經驗10年以上 2. 有工程塑膠材料及銅/鐵材料、電鍍相關知識 3. 具有2D、3D繪圖能力 4. 具有塑膠模具、連接器模具、沖壓模具等經驗 5. 具獨立思考能力，與廠商問題檢討能力 6. 配合工作任務出差

職責要求 1. 醫療器材開發前設計概念發想及技術可行性評估 2. 醫療器材整機或模組機構規劃，風險分析，設計，開發及驗證 3. 醫療器材先期評估、風險分析、設計、開發、驗證、量產導入之相關文件製作 4. 針對特定工程主題蒐集相關機構知識，進行專業分析 5. 協助產線解決量產中製造及製程中的機構相關問題 任職資格 1. 負責內視鏡之主機開發 2. 具備10年以上產品機構設計經驗(設備機構類別不考慮) 3. 具備3年以上管理經驗 4. 能配合海外出差 5. 英文-須能與海外客戶開會口語溝通 6 碩士學位以上

1. Field support to all customers in the Northern part of Taiwan. 2. The field support is to support systems or machines of products. Main task is related to hardware but might involve software troubleshooting in some occasions. 3. On a rotary basis, job holder is required for on-call duty. 4. Obligate to learn new products through daily work and training events； is required to attend training events upon arrangement. 5. Required to participate in customer service meetings, maintain positive relationship with customer contacts. 6. Writes reports on time for the purpose of administration, service events, technical data and improvement. 7. Proactively takes ownership on resolving service problems. 8. Assisting in application and sales to promote products toward customers. 9. Other service which management assign to him.

1. Field support to all customers in the Hsinchu part of Taiwan. 2. The field support is to support systems or machines of products. Main task is related to hardware but might involve software troubleshooting in some occasions. 3. On a rotary basis, job holder is required for on-call duty. 4. Obligate to learn new products through daily work and training events； is required to attend training events upon arrangement. 5. Required to participate in customer service meetings, maintain positive relationship with customer contacts. 6. Writes reports on time for the purpose of administration, service events, technical data and improvement. 7. Proactively takes ownership on resolving service problems. 8. Assisting in application and sales to promote products toward customers. 9. Other service which management assign to him.

1. Tool installation and service support based in Hsinchu office but not limited to work in Hsinchu area. 2. Preventive maintenance on Photo-Mask Equipment. 3. Participate on service review meetings at customer site. 4. On-call duty at night and weekend is required on rotary base. 5. Windows operation system skill is required for tool software update. 6. Obligate to learn new products and training on new tool abroad. 7. Assistance in application and sales to promote products. 8. Other service task assigned by management.

• Conduct and complete final acceptance test at customer site. • Establish process and qualify bonding systems with customer. • Collaborate with customer in defining problem statements, analyzing abnormal data, resolving process issues, and improving process conditions. • Provide both on-site and remote applications support to customers. • Participate in customer meetings and maintain positive relationship with customer contacts. • Provide expertise and advice to bonder business unit to help product improvement. • Participate in projects related to new product introduction: definition, characterization, alpha testing, beta testing and customer use case development • Learn new products through daily work and training events; is required to attend training events upon arrangement. • Take ownership of application projects assigned by supervisor. • Other tasks are assigned by supervisor

職責要求 - Lead and manage application engineering teams focusing on lithography and wafer bonding technologies for semiconductor advanced package fabrication. - Provide technical expertise and support to customers in Taiwan regarding the usage and optimization of equipment, including mask aligners, coaters, developers, and wafer bonding tools. - Collaborate with R&D teams to implement customer-specific solutions, improving product performance and enhancing customer satisfaction. - Drive the development and integration of new processes for 3D packaging, TSV (Through-Silicon Via) bonding, and other advanced semiconductor applications. - Conduct customer training sessions, troubleshooting, and technical support to ensure optimal equipment performance. - Oversee process validation and testing, ensuring compliance with industry standards. - Regularly interface with customers to understand their challenges and tailor solutions that meet their needs. - Stay updated on the latest industry trends and technical advancements, ensuring the company‘s offerings remain competitive. 任職資格 - Master’s degree in Engineering related field or Material Science. - Minimum 6 years of experience in semiconductor lithography and bonding processes. - Minimum 3 years of team management experience. - Strong problem-solving skills, with the ability to troubleshoot technical issues in semiconductor processing. - Excellent communication and interpersonal skills to effectively interact with customers and cross-functional teams. - Fluent in English; knowledge of Mandarin is an advantage.

職責要求 • Design tasks for devices and equipment for semiconductor manufacturing • Design according to customer’s configuration and specification • Creation of drawings, schematics, documents, parts lists and materials in SAP • Production support in the assembly, purchasing support for technical queries • Creation and technical evaluation of self-developed concepts and designs • Creation of risk assessments, assembly and installation instructions, calculations and designs • Involved in ECR (Engineering Change Requests) and CIP (Continued Improvement Projects) • Design must be in compliance with national and international regulations and standards. • Communicate with our counterpart-location in Germany. • Other tasks are assigned by your supervisor. 任職資格 • Master Degree in Electrical Engineering • Minimum of 5 years’ experience in similar position • Experience using CAD ZUKEN e3 or a similar CAD Software • Experience using SAP • Experience using MS Office • Very good English skills • Excellent communication skills in both, verbal and writing • Ideally Semiconductor Equipment Experience

職責要求 • Demonstrate your expertise for trouble shooting and design mechatronic system per DSC lithography product roadmap. • Possess strong DOE ability for system error analysis and execute test plan. • Involved in NPI project to MFG team for new system, feature and technology. Perform trouble shooting, technical support and process improvements to fulfill the goal of production output. • Involved in CIP and maintenance project for mature product. • Initiate and validate engineering changes and familiar with ERP system for document management. • Strong mindset and experience of risk assessment, cost evaluation and cross function cooperation. 任職資格 Requirements: • Experienced in designing electrical system of an automation machine covering component survey, cost evaluation, schematic planning, system integration. • Familiar with CAD and drawing PDM tool (AutoCAD, E3, etc). • Background of PLC or related PC based coding skill. • Good ERP concept and BOM maintenance experience. • Fluent in English speaking and writing. • More than 3 years working experience. Characteristic: • Teamwork: Able to working in a cross function and international environment. • Self-learning: Able to collect information to improve your knowledge pool, and also help the growth of the team by sharing knowledge. • Proactive: Willing to tackle with technical challenges and the mindset of seeking solutions for continuous improvement. • Planning: Result oriented thoughts for assigned task and project.