交大專區

車用相關 IC 設計流程專家。 具備車用SoC/ASIC RTL2GDS 實做經驗和問題解決能力。 同時具備車用IC設計流程中 Safety mechanism 的專業知識。

1. Architecture design and RTL implementation of Automotive/Smartphone chipset 2. SoC system power and performance analysis 3. SoC system bus and memory subsystem design, integration, and modeling 4. SoC low power design, integration, and modeling 5. SoC functional safety analysis, design, integration, and modeling 6. SoC cyber security analysis, design, integration, and modeling

解讀客戶的網絡安全需求 從網絡安全需求中推導出功能和安全概念 制定和審查安全系統架構 與 IP 團隊和客戶溝通和協調安全設計 執行系統安全分析（例如：TARA）

1. 旗艦智慧型手機晶片整合 2. 車用系統晶片整合 3. Clock架構 4. Timing收斂與分析 5. DFT/Test mode整合驗證

1.AI系統硬體規劃：系統規格與設計需求收集 2.AI系統硬體設計：負責設計和開發硬體系統架構，包括電路設計、元件評估與選擇、客製化元件規劃。 3. AI系統硬體驗證與測試：確認硬體系統正常運作，包含驗證與測試。 4. 跨組織合作：與IC design team、system team、SI/PI team與layout team等等合作，完成系統設計、製作與驗證。 5.客戶與相關廠商支援：包含技術文件撰寫、客戶參考設計支援、on site支援等等。 6. 帶領團隊 完成 部門目標,包括 PCB design & Testing & Customer supporting

1. Responsible for the development of soft firmware of ASIC product system, high-speed data transmission Software/PHY development and optimization of hardware performance 2. Lead related IP development, familiar with software/firmware/SDK, issue debugging, optimization and testing in ASIC projects 3. Collaborate with the team for functional/system bring-up, validation, performance optimization and adjustment 4. Achieve product design-in import and support product mass production 5. It would be better if being capable in Signal Processing/Algorithm implementation and SI/PI simulation interpretation.

1. Familiar to 2.5D or 3D PKG integration & development & mass production experience 2. From chip architecture view to propose best-fit PKG technology with SIPI, testing, thermal consideration

1.CPO SERDES 系統開發​ 2.CPO Optical系統開發

1. 負責晶片間（D2D & UCIe ) PHY IP硬體驗證與軟體開發。 2. 主導相關IP開發，熟悉ASIC專案中的軟體/SDK，能夠進行問題調試、最佳化和測試。 3. 與團隊合作，完成功能/系統啟動、驗證、效能最佳化和調整。 4. 實現產品設計導入，並支援產品量產。

1. Direct manager and project lead 2. Cloud data center product 3. DFT task force 4. 4.1Short term: top DFT flow implement and signoff 4.2Long term: DFT/test mode planning and new tech development.

• Chip to Chip 介面類比 PHY 電路，例如 UCIe 標準或客製化的 Die to Die 連結類比電路設計 • HBM/DDR/LPDDR類比PHY電路設計與混合模式/高速電路設計等。

1. Develop and implement DRAM controller/PHY solutions for data-center applications. Validate functionality, improve design to optimize performance, power, latency and efficiency. 2. Memory controller/PHY Integration: Design and integration memory system.

1. 數位晶片設計流程與整合 2. 熟悉低功耗的設計流程(和架構)

1. 整合IR 資訊和內部團隊合作解決 IR 問題 2. 產生並分析 power 資訊 3. 和客戶溝通 IR 相關的 methodology 並開發流程解決問題

1.PCB power related hardware design：Resonsible for design and develop hardware including circuit design, component evaluation and selection, customized component planning, layout review, etc. 2. System specification and design requirement collection. 3. System hardware verification and testing: function verification and power quality measurement. 4. Cross-organizational collaboration: Collaborate with IC design team, system team, SI/PI team, layout team, etc. to complete system design, production and verification. 5. Customer and related manufacturer support: including technical document writing, customer reference design support, on site support, etc.

The Senior Manufacturing and Test Engineer is responsible for improving manufacturing and test flows to optimize quality, yield and power in AI ASICs. Activities include DFT definition, coverage analysis and test content improvements at socket & system level to drive yield and quality. Collaboration across design and manufacturing teams to correlate pre-silicon to post-silicon through data analysis, building quality models and driving optimizations is expected. Deep understanding and experience in DFT architecture, quality, yield and power measurement flows is needed.

• Design, simulate and test various building blocks for photonic ICs such as modulators, filters, and detectors. • Develop mathematical models of photonic components for co-simulation with electronic circuits. • Contribute to the integration and testing of Photonic & Electronic ICs, collaborate with cross functional teams to improve system performance and optimize designs. • Must be proficient in programming (e.g. Python or MATLAB) for design automation

The Senior Power Integrity Engineer is responsible for the design and analysis of Power Delivery Networks (PDNs), encompassing voltage regulators, PCBs, substrates, and silicon dies, to drive strategic technology development for data center SoCs. Key responsibilities include conducting power integrity pathfinding, developing both detailed and reduced-order PDN models, and optimizing PDN performance through comprehensive time-domain and frequency-domain analysis. This role requires proficiency in scripting and design automation, as well as expertise in analytical methods and commercial simulation tools (e.g., 2.5D EM solvers) to extract PCB and package impedance profiles and generate accurate N-port models.

1. 應用於I/O 小晶片的 SerDes 設計驗證工作. 包含從原型測試到量產晶片, 並與類比, 數位和演算法設計團隊合作. 2. 負責實現 SerDes 韌體設計, 以驗證連線效能和實現量產測試 3. 負責建立自動測試和資料分析, 以測試SerDes的晶片特性和分析失效晶片

1. 高速Serdes系統技術開發(200Gbps+), 包括電通訊與光通訊(optical interconnect) 2. 定義系統技術規格並與設計團隊(Analog, Digital, Algorithm)討論系統架構, 建立模型模擬評估 3. Serdes 關鍵技術評估與開發( e.g., Next Gen Serdes, optical nonlinearity compensation, CPO technology) 4. 協助Serdes IP驗證問題分析