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💪 喜歡動手做、對水電或冷氣空調有興趣嗎？ 如果你具備相關經驗，歡迎加入我們，一起挑戰各種工程案件，學習更多專業技術！ 📌 工作內容 🔹 協助師傅進行水電冷氣安裝施工 　• 配管施工 　• 配電工程 　• 水電空調器具安裝配置 🔹 協助完成冷氣維修、保養及清洗作業 🔹 準備施工工具、器材及施工後整理收尾 🔹 承作項目包含： ✔ 一般住宅空調 ✔ 工廠空調 提供安裝、維修、保養及清洗等服務。 ✅ 應徵條件 ✔ 具水電或冷氣空調相關工作經驗 ✔ 電機、冷凍空調相關科系尤佳 ✔ 具普通重型機車駕照 ✔ 具普通小型車駕照者佳 持有以下證照者優先錄取： 🏅 丙級冷凍空調裝修技術士 🏅 丙級室內配線（水電）技術士 🎁 福利制度 ✨ 勞保、健保 ✨ 團體保險 ✨ 公司供應午餐及飲料 ✨ 提供員工制服 ✨ 依工作性質有時會加班，加班費另計 🚗 出差外派：依工程需求，偶爾需配合外派 📅 休假制度：依公司規定 🌟 歡迎加入我們！ 只要你肯學習、有責任感、願意與團隊共同努力，歡迎加入我們，一起累積專業技術、穩定發展！ 📞 期待您的加入，歡迎投遞履歷安排面試！

⨳時薪:196-255元⨳ »»免費員工餐 »»限定飲品免費暢飲 »»廚師服代洗服務 ★工作內容★ 1.製作各種義式料理，包括餐前湯、前菜、主菜、餐後甜品等 2.餐前備料 3.完成主管交辦事項 4.將學習窯烤披薩技巧，若您對義式料理有興趣，歡迎長期工讀唷~ ★兼職夥伴身分不受限制★ 歡迎您加入––-薄多義大家庭––- ★升遷管道★ ✔未來可透過內部升遷管道轉正 ★【排班方式】★ 排班區間：10:00-22:00 →依照門市營運狀況彈性排班 【可在面試現場討論】 ★薪資、實力一起LEVEL UP★ 1.每月時數達80小時，時薪為205元 2.達120小時以上時薪215元 3.達150小時以上時薪225元 4.全勤時薪再加＋5元（需達100小時） 5.過站考核通過時薪再加＋3~20元 6.做滿一年時薪再加＋5元 7.國定假日出勤上班給予雙倍薪 8.員工介紹獎金 9.勞、健保、團保及每月提撥勞工退休新制6％ 10.時數未達標則時薪為196元。 ★美味料理送給你★ ◇當日出勤上班日享員工餐，限定飲品無限暢飲 ◇員工購餐85折 ★關於薄多義★ 薄多義的誕生源自於老闆對披薩的熱愛 從一台小小餐車蛻變至台灣西餐連鎖品牌 在全台各地共有12家直營門市，同時正積極拓展其他餐飲品牌 IG : https://www.instagram.com/bite2eatpizza/ FB: https://www.facebook.com/bite2eatpizzaoffical/?locale=zh_TW ––––––-【 加入薄多義，讓你生活如虎添翼 】––––––

1.操作堆高機進行貨品搬運、上架及儲位整理。 2.負責貨櫃卸貨、進貨點收及驗收作業。 3.大倉庫商品進出管理與儲位規劃。 4.商品理貨、補貨、整箱備貨及出貨支援。 5.執行庫存盤點作業，確保帳物一致。 6.協助倉庫庫存管理及商品異常處理。 7.倉庫儲位規劃、調整及優化作業流程。 8.負責倉庫與理貨區之間商品流轉及搬運作業。 9.支援理貨、出貨及倉務相關工作。 10.作為倉管主管儲備幹部，協助管理及教育訓練工作。

1.人員、車輛進出管制 2.廠區巡邏 3.突發狀況通報及處理

• 商場營運與櫃位管理： 負責醫院地下街、美食街、醫療用品及便利商店等進駐櫃位之日常營運督導、績效考核與合約管理。 • 營養科政策執行與推廣： 配合營養科之專業指導，監督並輔導商場餐飲櫃位，落實各項商場管理規定與健康飲食政策之推廣。 • 食安與感控管理： 依據醫院感控標準，執行商場環境衛生、食品安全管制（HACCP/GHP）、病媒蚊防治及定期自主稽查。 • 財務與數據管理： 負責商場各專櫃營業額對帳、抽成計算、業績分析，並定期向營養科主管與院方提交營運報告。 • 跨部門與客訴溝通： 擔任進駐廠商、消費者（醫護/病患/家屬）與醫院營養科、院內各行政單位之間的溝通橋樑，並妥善處理各類突發客訴。 • 定期會議與績效追蹤： 負責籌備商場定期營運會議（如：廠商協調會、食安檢討會），追蹤決議事項執行進度，並落實異常問題改善。

1.零用金管理 2.銀行資金調度 3.開立捐款收據 4.出納相關工作 5.會計帳務處理 6.其他交辦事項

1. 接待客人並協助辦理入住與退房手續 2. 處理客房預訂、排房及相關更改、取消需求 3. 熟練操作飯店管理系統進行帳務處理與報表製作 4. 提供專業旅遊諮詢，解答客人問題並處理投訴 5. 協助行李寄放服務、叫車和交通安排相關事宜 6. 確保櫃檯及工作區域整潔，維持專業儀容及禮儀 7. 熟悉處理緊急情況的流程，確保公共安全及客戶隱私 歡迎熱愛服務業的夥伴加入我們的團隊，一起提供專業且貼心的住宿體驗，期待您的加入！

1. 都市更新相關開發行政事宜。 2. 協助都更各案管理作業、資料蒐集彙整。 3. 協助舉辦說明會。 4. 聯繫各都更案地主及簽約。 5. 主管交辦事宜及都更開發支援。 6. 協同主管及獨立拜訪地主。 *有成案團隊獎金*

1.行李遞送及寄存作業。 2.包裹或宅配郵寄服務。 3.客人遺失物處理。 4.支援大門接待員之工作。 5.協助管制大廳之安全。 6.其它提供房客或館內之公差服務。 7.提供最新之各種館內外交通資訊給房客。 8.接受主管之調度支援開車載客。 9.協助房客提領及後送之行李。 10.協助乘客上下行李。 11.販售各類商品及票卷 12.責任區域之清潔與維護。 13.主管交辦事項 ＃面試可選擇視訊／本館面試或台南（中西區南門路５１號 ）或高雄（地點另約)

1主要職務幫助主廚維護和食物產品的水準 2.督導單位所有員工烹飪技術改良和建立和諧團結合作 3.督導工作流程和產品菜餚生產 4.落實並監督各項工作SOP之執行

• 場館門面接待、票務/報到作業與貴賓引導。 • 活動與會議空間預約、場佈支援與設備確認。 • 電話與現場詢問回覆、意見蒐集與回報。 • 文書與行政支援、簡易帳務與資料彙整。 • 支援活動現場流程與觀眾動線協調。 以活動現場為舞台，結合接待、票務與動線協調歷練，累積場館營運與活動管理能力。 喜愛人群與活動氛圍的你，加入我們，成為精彩體驗的第一窗口！

客房清潔打掃 客房服務 客房設備維護及管理 ＃面試可選擇視訊／本館面試或台南（中西區南門路５１號 ）或高雄（地點另約)

1.餐廳營業現場帶位/點餐/碗盤收送/送客等服務工作 2.顧客服務諮詢 3.危機應變處理 4.餐廳清潔維護 ＃面試可選擇視訊／本館面試或台南（中西區南門路５１號 ）或高雄（地點另約)

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=22593&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Lead the end-to-end product lifecycle – from design to development to global deployment – of future-ready, technology-enabled succession planning, talent management, and assessment solutions, ensuring standardized adoption and consistency across the enterprise. 2. Recommend and deploy scalable talent assessment methodology, based on research in market/ industry best practices. 3. Analyze data to drive continuous product iteration and recommend solutions to enhance product maturity across the company. 4. Develop enablement resources to support internal stakeholders to implement succession management and talent assessment tools across functions. 5. Communicate and collaborate across departments and divisions to support delivery of HR products / solutions. 6. Lead reporting of key company-wide succession planning metrics for external-facing resources (e.g. TSMC Sustainability Report). 7. Plan projects, manage project progress, and take ownership of project implementation including problem resolution, ensuring alignment with business needs, timeline, and adherence to governance structures. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

此職缺由客服系統人才推薦產生

▎工作內容 1. 客戶訊息回覆後勤行政 * 帳目開銷紀錄 * 庶務與進度追蹤： 處理工程行政相關庶務，包含資料整理、進度追蹤。 * 詢價與採購管理： 負責詢價、比價並整理採購單，為公司把關最優採購決策。 2. 外務小幫手 * 移動力擔當： 具備開車技能佳 * 現場協調對接： 協調和聯繫廠商與工班，安排現場勘察。 * 主管交辦事項： 配合主管完成各項交辦工作。 3. 社群紀錄 * 日常側拍紀錄： 記錄設計師的日常工作、工地幕後花絮，進行活動跟拍（只需負責拍照、錄影記錄，不需會剪輯影片！）。 * 社群媒體管理： 協助管理公司社群平台（如 IG、FB 等）與內容更新。 ▎我們在尋找這樣的你（條件與特質） * 持有汽車駕照 * 擅長文字溝通，回覆訊息有溫度、有條理，情商高、有耐心。 * 個性與特質： * 細心與照顧人的天性： 擁有敏銳的觀察力，能主動提供協助，懂得照顧身邊人的需求與客戶的感受。 * 個性不能太 I 人（內向） ▎工作時間與地點 * 工作型態： 彈性排班工作，需依實際案場與公司需求彈性調整，具體細節於面試時共同討論。

餐飲外場： ．進行簡易餐飲之料理，如：烤土司或調配飲料等。 ．收拾碗盤與清理環境。 ．結帳、收銀等工作。 餐飲內場： ．擔任廚師的助手，處理烹飪前與烹飪中之準備工作與其他餐廳相關事務。 ．負責洗、剝、削、切各種食材。 ．負責清理工作環境、設備和餐具。 *有提供飲料、假日有提供餐食

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22574&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : Come and join an innovative and challenging team, where groundbreaking ideas shape the future of semiconductor technology. As an R&D Engineer, you will work on advanced technology development, such as exploratory research in advanced device architectures, device and process integration for manufacturability, advanced module process development, as well as the evaluation of novel materials, equipment, and processes. Responsibilities: 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration For Device Engineers: (1) Transistor Architecture & Design: Pioneering device design for advanced nodes. (2) Advanced Characterization: Defining the parameters of technological progress by characterizing state-of-the-art devices, establishing SPICE modeling targets, and conducting bench electrical measurements (I-V, C-V). (3) Simulation & Modeling: Utilizing TCAD (Technology Computer-Aided Design) and HSPICE to simulate device characteristics, optimize performance, and fortify model integrity. (4) Test Key Design: Crafting precision test key designs to facilitate accurate electrical modeling, design rule validation, and comprehensive device characterization. (5) Customer design enablement: Providing SPICE Model. For Integration Engineers (or Process Integration Engineers) : (1) Process Flow Integration: Integrating devices across various process modules (Lithography, Etch, Thin Films/Epi, Diffusion, CMP) to build a robust, manufacturable baseline for yield and device learning. (2) Experimentation & Lot Handling: Designing advanced Experiments (DOE) to meet device KPIs. Periodically serving as the on-duty engineer to coordinate and handle device lots in the R&D fab. (3) Yield & Reliability Learning: Conducting big data analysis (using JMP, Python, or custom iEDA tools) to identify process design weaknesses, hardware issues, or yield detractors. (4) Technology Transfer: Transitioning the proven, optimized advanced integration baseline process from the R&D phase to fab for high-volume manufacturing. 3. Module R&D Engineer (1) Pioneer Next-Generation Technologies: Research and develop advanced processes, novel materials, next-generation tooling, and cutting-edge computational/simulation methodologies for leading-edge semiconductor nodes. (2) Drive High-Impact Innovation: Deliver highly manufacturable, stable, and cost-effective process technologies. Optimize device physics and performance to meet stringent yield, reliability, and qualification standards. (3) Bridge Lab-to-Fab Scaling: Lead the technology transfer of advanced processes and hardware solutions from R&D phase to High-Volume Manufacturing (HVM) fabs, witnessing your research scale into global production. 4. R&D Process Center (1) PE: Develop advanced module process, optimizing stability and manufacturability to ensure high yield and reliability. Transfer processes and tools to volume manufacturing while collaborating with cross-functional teams and external suppliers to drive leading-edge module integration. Additionally, manage day-to-day operations, troubleshoot equipment, and mentor technicians to sustain operational excellence. (2) EE: Manage advanced semiconductor equipment (Diffusion, Thin Film, Lithography, or Etching) by performing warm-ups, troubleshooting, and efficiency enhancements. Plan and execute defect detection projects to analyze performance while collaborating closely with cross-functional engineers and vendors to ensure optimal equipment productivity and stability. (3) MFG: Oversee daily IC foundry operations, managing work schedules, direct labor, and cross-functional collaboration (PE/PIE/EQ) to ensure consistent service delivery. Drive productivity, manage multiple projects with overlapping deadlines, and analyze data to keep operations running smoothly. Additionally, contribute to process improvements and maintain robotic/detection systems to meet customer and business objectives.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22575&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development. productivity/quality. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22576&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel process/device/product developing for Specialty technologies. 2. Process Integration/Module, Device Analysis/Simulation, Modeling, Test-chip design tape out and WAT/Bench measurement system developing. 3. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.