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  • 10/27
  • 【2027 TSMC RDSS & AO】Design and Technology Platform Engineer (DTP)
  • 新竹縣寶山鄉
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22575&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development. productivity/quality. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 10/27
  • 【2027 TSMC RDSS & AO】Specialty Engineer (Specialty)
  • 新竹縣寶山鄉
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22576&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel process/device/product developing for Specialty technologies. 2. Process Integration/Module, Device Analysis/Simulation, Modeling, Test-chip design tape out and WAT/Bench measurement system developing. 3. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 10/27
  • 【2027 TSMC RDSS & AO】Process Integration Engineer (PIE)
  • 新竹縣寶山鄉
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22578&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們確保晶片的品質、持續提升良率,提供給客戶具有競爭力且高品質的晶片,讓電子產品不但先進且效能穩定;製程整合工程師為半導體製造中的重要協調者,需要與客戶溝通了解客製化的晶片應用需求,再將訊息帶回廠內,與各工程單位合作。良率精進工程師監控晶片的良率與缺陷,使用量測機台監測晶片的缺陷,找出可能的問題,再與製程解決問題。 1. A highly motivated individual with a strong technical background and capabilities to develop and sustain process technologies for logic, flash memory, and specialty products. 2. Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 3. Be responsible for sustaining ownership such as day-to-day operations, troubleshooting equipment and mentoring technicians. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 10/27
  • ◆彰化縣北斗鎮◆日班機動保全 【會補班往台中市區】
  • 彰化縣彰化市
  • 瑞豐保全股份有限公司
  • 工作經歷不拘,學歷不拘,月薪 35,974~0元0 ~ 10 人次主動應徵
  • [工作內容] 1. 貴賓接待通報與車輛引導與管制。 2. 訪客廠商過濾及登記換證作業。 3. 現場緊急事件回報與處置。 4. 巡邏建築物與周遭環境,留意可疑線索,確保客戶安全。 5. 案場安全、燈火管制、防火、防竊等巡查與處置。 6. 業主委託事項服務、尋物、指引、諮詢等臨時事項處理。 7. 包裹與掛號之收送。 8. 積極主動,態度端正,具服務熱誠 。 ★會安排到台中市區社區案場班★ 月休十天排休

  • 10/27
  • 【大樹藥局】MA儲備幹部
  • 桃園市桃園區
  • (大樹連鎖藥局)大樹醫藥【股】
  • 工作經歷不拘,學歷不拘,月薪 40,000~45,000元0 ~ 10 人次主動應徵
  • 【大樹藥局】儲備幹部計畫開跑 這是一個從第一線到決策核心的培育計畫 快速了解一間公司的運作 不只是執行,而是參與決策。 ––––––––- 培訓時間:一年 培訓事項: 第一階段|門市營運基礎 熟悉第一線運作、了解門市營運及流程 第二階段|後勤單位歷練 後勤單位基礎作業訓練 第三階段|核心任務承接 實際參與單位運作,承接明確任務與績效指標 第四階段|專案參與 跨部門專案執行,接觸策略與決策思維 資格條件: 1.科系:不拘 2.精通英文或日語 3.多益成績:700↑(須提供相關證明,例:成績單、證書) 個人特質: 1.具高抗壓性、積極、耐心、細心之特質 2.良好的溝通協調、邏輯、分析能力 3.工作積極有熱忱,有強烈的責任感,願意挑戰自我

  • 10/27
  • 【2027 TSMC RDSS & AO】Process Engineer (PE)
  • 新竹縣寶山鄉
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22579&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們在第一線負責晶片製造過程,改善機台製程參數的設定,提升良率並讓機台每單位時間產出增加,也降低生產成本;半導體製程可大致分為四大模組,大致流程順序為薄膜沈積、黃光微影製程、溼式與乾式蝕刻、熱製程與離子摻雜(擴散)。 1. To be responsible to drive leading edge process/device/advanced packaging development and optimization of CMOS/Flash/Specialty devices to meet scaling, performance, reliability, and manufacturability requirements. 2. Identify and solve IC process and device problems. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 10/27
  • 【2027 TSMC RDSS & AO】Equipment Engineer (EQ)
  • 新竹縣寶山鄉
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22580&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 台積電,全球半導體技術的領航者,邀請您一同開創未來!在台積,挑戰與成就感並存,而且機會永遠獎勵給有決心與韌性的人! 在自動化的生產線上,設備工程師是能發揮長才與想像力確保高精密和高單價的半導體設備穩定運行的核心。不僅負責設備的維修和保養,還兼具改造半導體設備零件,提升製程良率與機台穩定度。未來工廠 (機器人、AI、物聯網、VR) 正在tsmc發酵,這些都需要設備工程師的創新想法和參與,期待每一位有無限可能的你加入,和我們一起大放光芒。 Responsibilities: 1. Master Nano Diffusion, Thin Film, Lithography, Etching, or Metrology equipment. 2. Sustain and troubleshoot issues with high-tech equipment. 3. Improve and enhance the efficiency and productivity of equipment. 4. Plan and execute the analysis or defect detection projects. 5. Communicate with cross-functional engineers or vendors. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 10/27
  • (台中區)工程助理(無經驗可、月薪4萬起)
  • 台中市大雅區
  • 德業企業社
  • 工作經歷不拘,學歷不拘,月薪 40,000~0元0 ~ 10 人次主動應徵
  • 1. 半導體設備駐廠維護與技術支援,確保設備運行穩定。 2. 執行工地報表的製作與數據分析,提供精確資訊支援。 3. 核對工程進度與施工品質,確保符合規範標準。 4. 現場執行空調與水管工程施工,確保安全及效率。 5. 妥善整理及彙整工務相關文件,確保文件完整性。 6. 丈量圖面相關尺寸,校對並確認圖面與現場的一致性。 7. 配合工程師進行現場測量與設備檢查,發現並解決問題。 8. 參與台中科學園區空調、水機電設備的安裝與測試作業。

  • 10/27
  • 【2027 TSMC RDSS & AO】Intelligent Manufacturing Engineer (IMC/MFG)
  • 新竹縣寶山鄉
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22581&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 智慧製造工程師為創造晶圓產出最大化,滿足客戶交期,為公司帶來營收;身為工廠的第一線管理者,需掌握生產流程,藉由良好且精準派工提升機台生產效率,帶領技術員團隊確保製造流程順暢運行並達成每日的產能目標。 As a global semiconductor technology leader, TSMC is seeking an Intelligent Manufacturing Engineer to join our team. Our commitment to driving manufacturing excellence has led us to integrate artificial intelligence, machine learning, expert systems, and advanced algorithms to build up an intelligent manufacturing environment. Join TSMC, we are the most advanced technology team and connect with the world, as we head towards an unlimited future. We look forward to you joining us! You will be assigned to one of the following five roles according to your interest, experiences, and technical background. Responsibilities: 1. MFG Intelligent Manufacturing Engineer As an Intelligent Manufacturing Engineer, you will be responsible for the development and maintenance of these intelligent manufacturing systems, which are widely used for scheduling and dispatching, employee productivity, equipment productivity, process and equipment control, quality defense, and robotic control. By optimizing quality, productivity, efficiency, and flexibility, you will play a crucial role in driving the success of our manufacturing operations. (1) Smart manufacturing engineers will learn leading artificial intelligence manufacturing technologies worldwide. (2) Big data analysis, improving production efficiency: Through data analysis, identify bottleneck machines and improve machine production efficiency. Breakthrough analysis and dispatching project system, optimize production resources and maximize manufacturing efficiency. (3) Machine learning, creating unlimited possibilities: Utilize cutting-edge machine learning technology to improve the production process and create innovative applications that achieve optimal scheduling and maximize wafer production capacity. 2. CIM Intelligent Manufacturing Engineer (1) Software Developers: Design and develop intelligent manufacturing solutions for factory automation, manufacturing scheduling and dispatching, decision making and engineering analysis. (2) Dispatching Algorithm Developers: Heterogeneous data integration and corresponding solution design and development. (3) Quality Management Engineer: Server maintenance and related setting support including routine upgrades, troubleshooting with AP teams, high-availability architecture, virtual machines solutions, firewall rule, IIS, Nginx, database middle etc. 3. Data Analyst & Data Scientist (1) Application of statistics, machine learning, data mining, pattern recognition and other data analysis by AI techniques. (2) Your main responsibility will be to collect, explore, and extract insights from very large scale structured and unstructured data and explain these insights with the help of data visualization tools to support fab operations. 4. AMHS (Automated Material Handling System) Engineer (1) AMHS (Software) system & AI development/(Hardware) layout design & transport simulation. (2) Enhance System Performance, Quality and Reliability. (3) Coordinate cross-organization AMHS projects. 5. PIDS/WAT (Wafer Acceptance Test) Engineer (1) New WAT tool data matching and release. (2) WAT quality/manufacturing efficiency improvement. (3) WAT tool, recipe, and system management. (4) WAT productivity and quality improvement. (5) WAT tool and systematic issue troubleshooting. 6. PIDS/NTO (New Tape Out) Engineer (1) Handle mask tape out and manufacturing flow creation. (2) Manage projects related to NTO system development and enhancement. 7. Quality Management Engineer (1) Manage audit, defense, and quality systems. (2) To perform data analysis and simulation. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 10/27
  • (新竹區)廠務工程助理(無經驗可、月薪4萬起)
  • 新竹市東區
  • 德業企業社
  • 工作經歷不拘,學歷不拘,月薪 40,000~0元0 ~ 10 人次主動應徵
  • 1. 協助半導體廠區駐廠相關事務,支持日常運營。 2. 執行廠區內各項報表整理及數據更新作業。 3. 核對工程設備、圖面資料並進行現場管理。 4. 負責工程施工作業,確保施工品質達標。 5. 協助現場組長進行施工計劃及進度管理。 6. 整合工務文件及聯繫相關廠商完成協作。 7. 進行施工現場尺寸丈量,落實圖紙核對作業。

  • 10/27
  • 【2027 TSMC RDSS & AO】Facility Engineer (FAC)
  • 新竹縣寶山鄉
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22582&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 廠務工程師為整合各項廠區資源,提供晶圓生產所需之電力、水、氣體、化學品、空調等,為台積高度智慧自動的生產單位,供應最高品質、最穩定的生產作業環境。近年廠務工程師更肩負環境保護與永續的責任,如何精進節水、節能、減碳、環保的廠務運轉技術,更是廠務工程師可以發揮專業與創意的主舞台。 1. Responsible for planning, constructing, operating, and maintaining semiconductor plant facility systems, including risk analysis of facility system operations and supply quality, allocating resources and energy, managing construction safety. 2. Provide a stable facility system, including power, water, gas, chemicals and HVAC, to meet wafer production requirements. 3. Collaborate with other departments to ensure that the facility system operates at the highest level of quality when on duty. 4. Construction management & project coordination. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 10/27
  • 【2027 TSMC RDSS & AO】Product Engineer (PE)
  • 新竹縣寶山鄉
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22583&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 加入台積電,成為產品工程師,你將有機會參與世界級先進製程技術,與頂尖團隊合作,挑戰技術極限!你將負責協助產品導入量產、提升良率,並確保產品符合客戶的最高標準。在這裡,你將學習到最先進的半導體技術,並為推動科技發展貢獻力量。我們的專業涵蓋非常廣,從成熟廠到先進廠、從邏輯產品到特殊應用甚至到封裝測試,能夠對產品有全面的了解與完整分析的能力。 1. Leading edge product development. Learn the most advanced technology in semiconductor manufacturing, identify effective process solution for yield and chip performance improvement. 2. Involving cross-team work for joint project development. Coordinate with customer/Fab/different support team closely to address improvement opportunities and work-out the solution. 3. Expanding wider vision with learning device engineering, manufacturing process, yield / WAT analysis, design rule, wafer CP test knowledge, by using comprehensive analysis skills to solve product issue. 4. Developing HV, embedded memory, RF, MEMS, and CIS products falls under the category of 〝〝More than Moore〝〝. In this role, you will collaborate with R&D and customers to develop new applications using mature Si process technology. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 10/27
  • 護理之家約用防火管理人
  • 南投縣埔里鎮
  • 臺中榮民總醫院埔里分院
  • 工作經歷不拘,學歷不拘,月薪 42,555~44,055元0 ~ 10 人次主動應徵
  • 1.擔任護理之家防火管理人。 2.綜整護理之家消防業務。 3.負責緊急災害應變計畫及災害處理。 4.危機管理及處理業務。 5.配合各項評鑑、督考及驗證作業。 6.其他臨時交辦事項。

  • 10/27
  • 【2027 TSMC RDSS & AO】Advanced Packaging Technology and Service Engineer (APTS)
  • 新竹縣寶山鄉
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22584&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: TSMC‘s advanced packaging process is an efficient and high-density packaging technology that mainly targets the demand for high-performance semiconductor components, including microprocessors, graphics processors, artificial intelligence chips, etc. This technology uses advanced 3D stacking technology to vertically stack multiple chips and uses high-density packaging materials to fix them together. This technology can improve the performance of components, reduce power consumption, reduce package size, and increase system integration. TSMC‘s packaging process includes various technologies such as CoWoS, InFO. Among them, CoWoS is a technology that connects different chips through copper wires through silicon interconnect technology to achieve high-frequency and high-speed data transmission. InFO technology directly encapsulates chips on the substrate, connecting chips and substrates through tiny copper wires, achieving a more compact and efficient packaging solution. TSMC‘s advanced packaging process can improve chip performance and production efficiency and meet the packaging technology requirements of modern high-performance electronic products, such as smartphones, artificial intelligence, high-performance computing, and other fields. TSMC‘s advanced packaging organization include Testing R&D Engineer conduct exploratory research in DFT test architecture, evaluating next-gen test technology of several device (logic SOC, HPC, AP, RF, etc.), which used 3D silicon stacking and advanced packaging technologies and closely teamwork with international customer from new product introduction to mass production. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 10/27
  • 混凝土車司機
  • 雲林縣褒忠鄉
  • 雲林順利企業社
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 🚚 一起上路,成就城市地基的穩重守護! 能駕馭重量級機械的你,這裡就是發揮硬實力的舞台! 🌟 你將會: 1. 操控聯結車,安全有效地運送水泥製品至指定地點。 2. 確保貨物正確、安全裝載,並熟練操作升降及傾倒設備進行裝卸。 3. 遵守載重限制及運輸法規,讓每趟路程都行穩致遠。 4. 定期檢查和保養車輛,保持最佳運行情況。 5. 持續記錄運輸日誌,完成交付簽收,報告運輸異常。 🔧 這是一份不單調的挑戰! 不僅僅是開車,更是瞭解水泥製品特性、解決緊急狀況的全能任務高手! 現在就加入我們,讓你的駕駛技術和專業精神在每次行程中熠熠生輝!

  • 10/27
  • 【2027 TSMC RDSS & AO】Quality & Reliability Engineer (Q&R)
  • 新竹縣寶山鄉
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22585&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 品質與可靠性工程師:為守護客戶產品不受任何缺陷影響,建立優良的產品品質與可靠度,以協助客戶在市場上搶得先機、強化競爭力;QR致力於開發領先全球的電子、物理、材料與化學等科學分析專業及可靠度統計量測方法,應用於我們的產線,確保從晶片設計、製程開發、產品量產到封裝測試等階段的品質及可靠度問題皆有完整的解決方案,同時提供最先進的材料與故障分析等服務,成為公司各組織、客戶以及供應商最信任的合作夥伴。 1. Quality and Reliability roles. 2. Failure & TEM analysis, Reliability data analysis with reliability modeling, manufacturing production quality management and reliability assessment, research, and development of new analysis methodology/technique. 3. Customers problem resolving production quality / reliability issues. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 10/27
  • 【2027 TSMC RDSS & AO】Information Technology (IT)
  • 新竹縣寶山鄉
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22586&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: You will be tasked with one or more of the following responsibilities: 1. Development and integration of Factory Automation Systems. 2. Development and integration of Advanced Technology. 3. Development and integration of Office Automation Systems. 4. Development and integration of Cloud Computing, Kubernetes or Big Data Analytics Systems. 5. Build/Development Scalable Platform for managing container applications. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 10/27
  • 砂石車司機
  • 雲林縣褒忠鄉
  • 雲林順利企業社
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 🚚 準備好了嗎?讓我們一起上路,馳騁砂石運輸的世界! 能夠掌控重量級機械的你,這裡是展現駕駛功力的最佳舞台!🔥 🌟 你的任務: 1. 駕駛聯結車,穩定又精準地把水泥製品送到指定地點。 2. 妥善裝載砂石貨物,操作升降和傾倒設備,讓裝卸工作行雲流水。 3. 嚴格遵守載重限制和交通法規,確保每一趟的行程安全無虞! 4. 定期檢查、維護車輛,讓車輛保持巔峰狀態,行程更穩健。 5. 記錄運輸日誌,仔細完成交付簽收,並及時回報任何異常狀況。 🔧 沒錯,這份工作絕對不單調! 這不只是開車,你還將掌握砂石特性的運輸要訣,並面對任何突發狀況的挑戰!✨ 現在就是好機會!用你的駕駛技能、專業態度,和我們一起創造每一次行程的精彩! 快加入,讓砂石的世界因你更加流暢動人!🚀