清大專區

※具市場競爭力的薪資制度 ※優於勞基法的特別休假，加入即享12天特休 ※外商的優渥福利制度 ※各式福委會補助與活動 1.負責SMT操機、錫膏印刷等機台設備的基礎操作與維護。 2.檢查待檢物是否確實標明機種與其他規格。 3.依據樣品與BOM表，核對各零件位置與極性是否正確。 4.檢驗基板之零件是否有空焊、短路、缺件、反向等問題，並用箭頭標籤標示不良位置。 5.加強檢驗IC、晶體、電容、LED等有極性之零件。 ＊職位需早班(09:00-18:00)跟午班(17:00-02:00)輪班＊

職位需早班(09:00-18:00)跟午班(17:00-02:00)輪班。 1. 負責 Probe Card 飛針測試包含開發、驗證與量產前測試 2. 撰寫與維護飛針測試程式 3. 進行 電性量測（Continuity / Short / Open / Resistance / Leakage 等）與測試結果分析 4. 協助Probe Card 組裝後電性驗證、良率分析與問題排除 5. 與 製程、設計、製造、客戶端工程師溝通測試需求與規格 6. 分析測試異常，提出改善方案與測試流程優化建議 7. 建立與維護 測試規範、SOP、FA 報告與技術文件

1.負責PCB產品之市場開發與客戶拓展 2.維繫既有客戶關係，保持訂單穩定性 3.開發國內外潛在客戶 4.定期拜訪客戶，掌握需求與專案進度

1.報價相關：新案RFP/ RFQ報價，與客戶溝通需求與規格，成本與報價擬定，在RFQ指定時間內上傳報價 2.B/S & AVAP & BMC management 3.客戶關係維護：每週與客戶開會討論後續預測備料與訂單方向，整理PPT deck產業訊息 4.訂單／帳務統籌：訂單開單催單，每週跟SCM跟催欠料供貨狀況，出貨結帳確保AR立帳收款正確 5.客訴處理 & Report整理：了解客戶問題，並及時提供解決方案處理

1.圖面設計/製作 2.現場管路設計 3.空間管理與協調 4.電腦操作：MS-office、熟AutoCAD 2D及Revit

找穩定工作就選【寶凱電子】 環境安全、制度完善、福利健全，讓你每天上班都更踏實！ ＜生產遊戲機台、訂單穩定，景氣不好也不怕！＞ ＜你一定會喜歡的福利＞ ✔ 加班免費吃晚餐、午餐補助 ✔ 三節禮金／禮品、年終平均 2 個月 ✔ 免費健檢、尾牙、員工旅遊 ✔ 固定班！免輪班！遇紅就休！ ✔ 一對一導師帶你上手 ✔ 同事好相處、溝通順暢 ✔ 加班費依法給、表現佳還能升遷加薪！ 想找穩定＋福利好＋環境優的工作？寶凱電子等你加入！ 【工作內容】 1.制定並執行生產排程，掌握各工單進度，確保交期達成 2.負責產線作業之品質穩定與生產效率提升 3.督導產線人員工作表現，進行人力調度安排與教育訓練計畫，培育團隊技能 4.具備良好的跨部門溝通協調能力，有效整合資源以解決生產相關問題 5.即時處理生產現場異常狀況，提出改善方案，維持順暢運作 【工作需求】 需具備2D加工圖面識圖能力 需配合加班(視訂單情況，不常態加班)

1.負責PCBA 板子堆疊排列與設計方案提出 2.能完成系統結構 3D 設計、爆炸圖與公差尺寸檢討 3.模具DFM 開發檢討並跟蹤模具進度至 MP 階段 4.協助產品驗證測試達到客戶指定條件。

1. 伺服器主機管理(含Windows/Linux 平台) 2. 虛擬化平台管理(含VMware/PVE) 3. AD網域控制站管理(含DNS/DHCP/GP0/使用者帳戶與電腦) 4. Exchange 電子郵件管理(含使用者信箱與郵件規則) 5. SPAM/Antivirus/WSUS(Windows update)與MFA管理 6. 資訊安全優化、維護合約控管與各項資訊專案規畫執行。

1.數位電路驗證/測試/除錯及報告撰寫 2.協助工廠生產試作及技術轉移 3.熟悉電子電路相關原理及應用 4.熟悉ARM平台，具手持式裝置、手機或平板設計經驗

1.負責公司核心專案之規劃、推動與執行管理，統籌相關資源並追蹤執行成效，確保專案目標如期達成。 2.深入解析營運數據、經營績效及關鍵管理指標，洞察潛在風險與成長契機，提出具前瞻性之策略建議與優化方案。 3.作為跨部門協同運作之整合樞紐，具備財務、人力資源、採購或營運等任一領域之管理經驗，協助推動專案執行與資源整合。 4.協助組織流程再造、制度精進及治理機制建構，持續提升營運韌性、決策品質與整體管理效能。

1.產線生產製程檢驗及成品檢驗 2.IQC/IPQC/FQC/OQC檢驗之品管相關工作 3.主管交辦事項

Role Summary/Purpose: Hardware design engineer will closely work with worldwide engineers to perform engineering works for hardware testing solution of next generation semiconductor devices. The work includes requirement analysis, feasibility study, solution evaluation, task planning, project management, design execution, quality control and verification. We are working on cutting edge requirement and future technology. Responsibilities: • Provide global semiconductor interface test hardware solutions of next generation semiconductor devices for world-wide customers • Provide chip test interface HW solution engineering to compare pros and cons of different approaches and recommend best option to customers considering both performance, lead time, cost • Responsible for Testing circuits Design and super high layers PCB design for high complexity ATE device interface board correspond to various device testing, eg. Mobile application processor, High performance computer, AI, RF etc. • Responsible for scheme selection of a SUBSTRATE/MLO design in wafer testing, research for low Cost of Test scheme (considering TDE, Skip DIE, substrate stack-up) • Responsible for power integrity (PI) and signal integrity (SI) simulation at board level or system level, frequency domain or time domain to ensure HW product performance at design stage • Implement complex mechanical design/simulation, cable design, thermal evaluation by collaborating with PCB design to achieve premium quality in hardware solution according to customer device testing ultimate challenges. • Responsible for global end to end hardware project management to ensure best quality and on time delivery -Device testing requirement assessment and Feasibility study -Risk analysis and mitigation planning -Schedule planning and project management -Design execution -Regular review with global internal and external customers -Quality Control and Verification • Work closely with Global supply chain, provide solution to solve manufacture (DFM), assembly (DFA) challenges, ensure hardware products on time delivery and very high first pass rate • New technology research, new products, new materials evaluation for next generation device testing • Deliver hardware design training and seminars to customers

We are seeking a highly skilled and motivated Field Application Engineer to provide advanced customer engineering support across our key semiconductor customers. This role will act as a critical technical interface between customers and our internal teams, focusing on problem solving, project execution, and proactive alignment with customer requirements and technology roadmaps. The successful candidate will play a hands-on role in delivering world-class technical support, ensuring rapid issue resolution, and strengthening long-term customer relationships. Key Responsibilities: 1. Advanced Technical Support · Provide expert-level advice on hardware requirements to enable successful loadboard/module design projects. · Conduct schematic capture, component placement, and routing support when needed to address complex technical challenges. · Act as a senior technical resource for diagnosing hardware-related feasibility and performance issues. 2. Customer Engagement & Relationship Building · Gather and validate customer requirements to ensure sufficient information for initiating design projects. · Serve as the primary technical contact, managing expectations and maintaining clear communication with customer engineering teams. · Manage customer interactions throughout the project lifecycle to ensure satisfaction and successful delivery. 3. Application Engineering & Solution Development · Assess and estimate project schedule, cost, and feasibility to define realistic plans. · Support design-in activities by translating customer requirements into technical hardware solutions. · Deliver technical updates, training, and presentations to customers and internal stakeholders. 4. Cross-Functional Collaboration · Collaborate with internal design and project management teams to align project execution with customer requirements. · Provide structured feedback from design projects to influence product development and continuous improvement. · Ensure alignment of project execution with both tactical problem solving and longer-term strategic direction. Preferred Traits: · Resilient and Professional Under Pressure – Remains calm and constructive when facing challenges, escalations, or changing requirements. · Proactive Problem Solver with Strong Ownership – Takes initiative, drives resolution, and ensures customer satisfaction while balancing immediate issue-solving with long-term improvements. · Collaborative and Organized Team Player – Demonstrates a positive “can-do” attitude, manages multiple priorities effectively, and works seamlessly with cross-functional and global teams. This job description serves as a general guide to the responsibilities and qualifications expected for the role and may be subject to modification based on the specific needs of the organization.

DIS Tech’s Project Management team designs custom hardware connecting DUTs to ATE testers (e.g., Teradyne, Advantest). We’re hiring a Project Manager to lead interface projects from concept to delivery. This customer-facing role involves translating requirements into test hardware while managing timelines, resources, and scope. Ideal candidates are engineers ready to grow into leadership, with strong communication, spatial reasoning, attention to detail, and urgency. Mentorship and hands-on training provided. Key Responsibilities: • As a Project Manager, you will be responsible for leading, executing and managing all the engineering activities of the new product design and development project with a high degree of independence and creativity. • Work closely with customers (both internal and external) to gather requirements and acceptance criteria. • Perform project sizing (scope, cost, schedule). • Create statement of work to align clearly with customer about scope, deliverables, schedule, acceptance criteria, risks and mitigation plan. • Create, track and manage detailed project plans and keep customers informed of project status. • Track, assess and communicate impact of changes (change management). • Drive PCB schematic and layout design, working with internal PCB design team. • Drive SI/PI performance optimization, working with internal simulation team. • Manage design reviews and milestone approvals. • Understand our supplier’s DFM rules/requirements/capabilities, and guide design accordingly. • Define PCB materials, stack-up, layout rules. • Work with operations team to ensure project manufacture/assembly/logistics are on-track, lead to resolve any schedule slipping by working out improvement plan • Provide continuous technical support for products already in the field. • Visit or travel to DIS Tech and customer sites as required. • Attend periodic night-time meetings with customers or teams in other regions (EU, US oversea customer when needed).

Role Summary/Purpose Experienced hardware designer will closely work with worldwide engineers to perform engineering works for hardware testing solutions of next generation semiconductor devices. The work includes requirement analysis, feasibility study, task planning, project management, design execution, quality control and verification. We are working on cutting-edge requirements and future technology, work here can be interesting and exciting. Job Description • Design semiconductor test hardware solutions of next generation semiconductor devices for world-wide customers • Collect and analyze customer input, make sure it is complete and feasible • Provide constructive suggestions of interface hardware solutions to customers to close electrical/mechanical gaps, ensure smooth execution of customer project • Evaluate and provide project sizing including schedule, cost, resource, feasibility • Hands on critical part of high complexity project such as high-speed signal topology, RF signal, high current signal, signal integrity, mechanical consideration, design for manufacturability and design for assembly • Project execution/management including resource/task assignment, collaboration, daily mentor, schedule management, risk mitigation, quality control • Act as cross team interface between customer, manufacture and assembly supplier to ensure well project execution through close communication • Execute assigned technical roadmap research and development • Support team development through mentoring, knowledge sharing and training • Deliver hardware design training and seminars to customers • Keep close communication with worldwide Teradyne teams and customers

1.安全治理(組) -內部資安稽核，並配合 ISO 27001 與內控作業 -協助公司資安合規檢核與改善，提升整體安全性 -規劃與執行資安教育訓練，使用生成式AI製作教育訓練教材，提升全員資安意識 2.監測與事故回應(組) -資安監控並分析可疑資料外洩事件，協助資安事件的通報與處理 -分析漏洞風險並協調維運團隊進行修補與安全更新 -追蹤公開漏洞資料庫（CVE / NVD / Security Advisory）並以 AI 自動彙整與關聯分析，評估產品影響 3.安全工程(組) -新資安解決方案導入與技術評估 -執行社交工程演練、弱點檢測、滲透測試，並追蹤改善狀況 -建立與優化安全開發流程（SSDLC）整合 AI Code Review 與靜態分析工具，推動產品安全測試與安全強化措施 -建置與維運地端 AI 開發環境，支援內部資安工具的自研與迭代 -研發 AI 自動化滲透測試工具（DAST/SAST）加速覆蓋範圍，並追蹤改善狀況

1. 執行遠端軟體安裝和網路部署的問題排除 2. 設計系統部署架構和建立驗證網路 3. 提供客戶技術支援 4. 協助教育訓練客戶

1. 利用Angular/TypeScript/Bootstrap開發前端WED介面 2. 設計API和串接後端系統 3.持續追蹤軟體品質並主動改善 4.協助軟體安裝部署 5. 支援問題解析和排除

1. eNB//HeNB/gNB Protocol Stack for 5G small cell 2. SW development/Maintenance for NSA and SA 3. Implement/Optimize RRM/SON/S1/X2/NG/Xn modules 4. Develop test cases 5. Provide worldwide on-site support of 10T/FT/OT

1. 開發與制訂射頻（RF）電路系統架構及其規格 2. 開發與驗證射頻相關之校正（calibration） 3. 制訂射頻前端元件（RF front-end components）規格，並最佳化完整的射頻/基頻鏈路預算（link budget）