研發替代役

🍎 商品部專員熱情招募中！ 喜歡觀察市場變化，也對農畜產品與消費者需求充滿好奇嗎？加入商品部，從市場調查、新品發想一路參與商品上市，讓好商品真正走進消費者的生活！ 🎯 商品部專員的工作內容 1. 進行商品、市場與競品調研，發掘消費者需求並提出系列商品與新品構想 2. 規劃商品專案、產品溝通架構、上市資料及跨部門合作需求 3. 整理與維護產品資料、規格、賣點、圖文素材及版本狀態 4. 依品牌與電商顧問方向，協調外部企劃與設計執行包裝、商品頁、社群及活動素材 5. 支援日常社群美編、品牌內容製作及必要的 D2C 客服資訊整理 6. 協助處理主管交辦事項 ✨ 如果你擅長整理資訊、喜歡發想商品，並樂於與不同團隊溝通合作，歡迎加入我們！一起把市場洞察變成實際商品，讓每個好點子都發揮價值！

應徵條件： 1. 瑞昱強力招募(1)116年度研發替代役及(2)預聘116年應屆畢業之碩士、博士生。 2. 碩士以上之電子、電機、電控、資工、資科等相關科系，並具備以下任一條件者佳： a. 熟悉 Mixed-Signal AI 流程開發及支援。 b. 對 EDA AI Agent 開發有興趣或具備相關經驗。 c. 熟悉 MCP (Multi-Chip Package) 及 Digital Design Flow 相關技能開發。 d. 熟練使用 Python, C/C++, TCL 等程式語言。

應徵條件： 1. 瑞昱強力招募(1)116年度研發替代役及(2)預聘116年應屆畢業之碩士、博士生。 2. 碩士以上之電子、電機、電信、通訊、電控、資工、資科等相關科系，並具備下列任一條件者佳： a. 對影像處理演算法熟悉或有興趣。 b. 熟悉語音訊號前置處理與語音辨識或有興趣。 c. 對通訊實體層或跨層演算法設計有興趣者，熟通信協定標準者尤佳。

【本職缺優先審核至休斯微公司官網投遞人選】請至休斯微官網投遞：https://career.suss.com/en/jobs 【Talents who apply job via SUSS MicroTec Career Website will be given priority review】Please apply opening here：https://career.suss.com/en/jobs ________________________________________________________________________________ Summary: The position is to lead manufacturing team in SUSS MicroTec Taiwan factory to meet organization target and people management. - Ensure the planned outputs are delivered based on good quality standardization and on time delivery. - Improvement / Kaizen for the quality, production activities and related processes. - Manpower planning and people development - Responsible for the manufacturing team KPI Tasks: Support process improvements, Lean Manufacturing, Quality improvements and People Development Quality: - Ensure manufacturing team to produce SUSS systems in accordance with established specifications. - Ensure assembly team to observe and report systems issues and support on solution to avoid the defect pass through to next steps. - Lead Process Improvement Team for structural solution both technical and process issues. - Responsible for the quality improvement of products and processes. - Ensure manufacturing team to apply and follow 5S in all working area Production: - Coordinate the activities given in the production plan and monitor the progress. - Lead the continuous improvement of manufacturing activity. - Ensure manufacturing team to produce SUSS systems according to the procedures. - Set an example to other members of the team. - To have overview of total process from assembly through to output and act as escalator for critical issues to drive manufacturing team meet target Planning: - Resource arrangement including manpower, tools and work preparation. - Capacity Resource Planning (CRP) for mid / long term manpower requirement - Control machine cost via monitoring/controlling labor hours for system assembling - Closely control the use of tools, materials and equipment. Skills: - Acquire sufficient knowledge of new and established products and processes, modifications, sub-modules and complete systems. - Mature soft skill for people management - Good mind-set and personality: Target oriented, process driven, systematic and critical thinking - Good communication skills in both, verbal and writing - People management / development Others: - Other tasks assigned by supervisor

應徵條件： 1. 瑞昱強力招募(1)116年度研發替代役及(2)預聘116年應屆畢業之碩士、博士生。 2. 碩士以上之電子、電機、電信、電控、資工、資科等相關科系，並具備下列任一條件者佳： a. 熟悉數位信號處理、數位通信系統。 b. 熟悉於影像系統或數位影像處理，或影像壓縮/解壓縮演算法。 c. 熟悉計算機架構或對 SoC 設計有興趣者。 d. 具有電路設計、製程整合、元件經驗或有興趣者。 e. 熟悉 HDL 設計。 f. 對通訊網路、多媒體、電腦週邊、車用電子產品或程式設計有興趣者。

應徵條件： 1. 瑞昱強力招募(1)116年度研發替代役及(2)預聘116年應屆畢業之碩士、博士生。 2. 碩士以上之電子、電機、電信等相關科系，並具備下列任一條件者佳： a. 對 RF IC 設計有興趣者。 b. 熟 CMOS/SiGe RF 設計及通訊系統經驗尤佳。

應徵條件： 1. 瑞昱強力招募(1)116年度研發替代役及(2)預聘116年應屆畢業之碩士、博士生。 2. 碩士以上之電子、電機、電信、電控、資工、資科等相關科系，並具備下列任一條件者佳： a. 熟悉 C/C++、硬體描述語言 (Verilog) 和驗證語言 (Vera/systemVerilog)。 b. 具 IC 設計經驗者佳。 c. 對晶片設計驗證或程式設計有濃厚興趣者。

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應徵條件： 1. 瑞昱強力招募(1)116年度研發替代役及(2)預聘116年應屆畢業之碩士、博士生。 2. 碩士以上之電子、電機、電信、電控、資工及通信等相關科系，並具下列任一條件者佳： a. 熟悉CMOS元件特性。 b. 熟悉SRAM/其他記憶元件特性。 c. 熟悉Hspice, Hsim等simulation tool, Virtuso, Laker等layout tool. d. 對SRAM/其他記憶體電路設計、測試與生產有興趣者。

應徵條件： 1. 瑞昱強力招募(1)116年度研發替代役及(2)預聘116年應屆畢業之碩士、博士生。 2. 碩士以上；電機、資訊等相關科系，並具下列任一條件者佳： a. 熟悉Verilog RTL、Synthesis、Simulation、Timing Analysis 等相關 IC Design Flow及有興趣者。 b. 熟悉 Design for Testability 技術，包含 Scan / ATPG、Delay Test、Memory BIST、Boundary Scan、Diagnosis 等及有興趣者。 c. 有 DFT Tools (如 DFT Compiler、TetraMAX、BSD Compiler、FastScan、TestKompress、MBISTArchitect) 使用經驗及有興趣者。 d. 積極負責、勇於迎接挑戰，對於 Nanometer / SoC DFT Implementation、開發及推廣設計流程有興趣者。

應徵條件： 1. 瑞昱強力招募(1)116年度研發替代役及(2)預聘116年應屆畢業之碩士、博士生。 2. 碩士以上之電子、電機、資工、資科等相關科系 3. 具備以下任一條件者尤佳： a. 具備運用相關專業 tools 能力：C/C++/Python/Java, PyTorch/TensorFlow, ARM & RISC-V Assembly/Intrinsic/SIMD。 b. 數位語音或影像處理相關知識，熟悉 AI ISP 演算法 (AINR / Embedded AI) 開發。 c. 對 AI 代理駕馭 (AI Agent for Autonomous Driving) 前瞻技術有熱忱。 d. 熟悉 LLVM compiler、Inference Engine Optimization 或 AI/ML/DSP 應用相關技術。

應徵條件： 1. 瑞昱強力招募(1)116年度研發替代役及(2)預聘116年應屆畢業之碩士、博士生。 2. 碩士以上之電子、電機、電信、電控、資工等相關科系。 3. 具備下列任一條件者佳： a. 熟 C、C++、Assembly、Linux、SPICE、Matlab、Cadence EDA 環境。 b. 熟類比電路設計、數位信號處理及有興趣者。 c. 對 PAM4 SerDes (112G/224G)、Optical PHY、車用電子 (Automotive IO/Gateway) 開發有興趣者。 d. 具 ADC、PLL、高速 Crypto 相關經驗及有興趣者。 e. 對通訊網路、聯網多媒體、電腦週邊、智慧互聯產品或程式設計有濃厚興趣者。

• 工作項目： 1.新聞稿與官方 Blog 撰寫： 重要產品發表、公關新聞稿與官方 Blog 專題，並導入 SEO/AEO觀念優化內容曝光。 2.媒體經營與輿情監測： 建立並維繫科技/財經核心媒體關係，統籌媒體採訪接待、問答統整及新聞輿情追蹤。 3.公關專案與活動執行： 協助各類公關活動企劃與現場執行。 4.企業官網內容維護與優化： 定期更新與優化官網文案（產品/企業訊息），提升品牌專業形象與數位搜尋能見度。 • 需求條件： 1. 具備 3 年以上企業公關、公關代理商或數位公關相關經驗。 2. 扎實的中英文商務撰寫與高階溝通協調能力。 3. 熟悉媒體運作，且具備現代 SEO 語意優化或 AEO 數位傳播概念。 4. 具科技業（B2B/Tech）、上市公司PR/Communications經驗者優先 。

【本職缺優先審核至休斯微公司官網投遞人選】請至休斯微官網投遞：https://career.suss.com/en/jobs 【Talents who apply job via SUSS MicroTec Career Website will be given priority review】Please apply opening here：https://career.suss.com/en/jobs ________________________________________________________________________________ Do you think strategically, are you interested in the dynamic market of the Semiconductor Industry and promote the success of innovative technologies? Take responsibility for the success of our products and solutions, develop sustainable strategies and promote innovative technologies in a promising market. We are looking for the next possible date Tasks: 1. Technology Scouting & Market Intelligence • Monitor industry trends and emerging technologies in semiconductor manufacturing and advanced packaging. • Identify future equipment opportunities related to: ◦ Hybrid Bonding ◦ Wafer-to-Wafer Bonding ◦ Die-to-Wafer Bonding ◦ Temporary Bonding & Debonding ◦ Advanced Packaging Lithography ◦ RDL Processing ◦ Heterogeneous Integration ◦ Chiplet Integration ◦ Silicon Photonics ◦ Co-Packaged Optics (CPO) ◦ Glass Core Packaging ◦ HBM Packaging Technologies • Analyze competitive technology developments and provide strategic recommendations. 2. Strategic Customer Engagement • Establish and maintain technical relationships with key customer engineering and technology organizations. • Support technical discussions with process integration, module engineering, R&D and advanced packaging teams. • Participate in customer technology reviews, workshops and roadmap discussions. • Serve as a trusted technical advisor to strategic customers. 3. Product & Technology Strategy • Translate customer technology requirements into actionable product development recommendations. • Support long-term product roadmap planning for: ◦ Wafer Bonding Systems ◦ Temporary Bonding & Debonding Platforms ◦ Hybrid Bonding Solutions ◦ Advanced Packaging Lithography Systems ◦ Large Field Exposure Technologies • Identify technology gaps and future investment opportunities. 4. Competitive Intelligence • Monitor competitive activities, product launches and technology roadmaps. • Benchmark competitor solutions and identify differentiation opportunities. • Deliver regular market and technology assessment reports. 5. Business Development Support • Support strategic account planning and opportunity development. • Prepare technical presentations, technology assessments and business case evaluations. • Support major customer pursuits and technology evaluations. 6. Industry Engagement • Represent the company at major industry conferences and technical forums. • Build relationships with semiconductor research institutes, industry organizations and ecosystem partners. • Maintain awareness of emerging technology developments across the semiconductor industry.

【我們正在找這樣的你！】 喜歡與人互動、對服務業有熱忱，願意學習各式商品知識，歡迎加入中聯百貨！ 在這裡，不只是收銀或補貨，而是學習門市營運的各項技能，讓每天的工作都充滿挑戰與成就感。 ––- 【工作內容】 1. 商品上架、補貨及陳列整理。 2. 收銀結帳及基本帳務作業。 3. 商品整理、庫存巡補及賣場維護。 4. 提供親切、專業的顧客服務。 5. 維持賣場環境整潔與安全。 【工作提醒】 ✔ 工作需久站。 ✔ 須搬運商品，最重約15公斤。 ✔ 如有腰部、肩膀、膝蓋等舊傷或無法搬運重物者，建議先評估自身狀況再應徵。 ––- 【工作時間】 ◆早班: 08:00-16:30（採一頭班） ◆ 需配合排班、輪班。 ––- 【休假制度】 ◆ 月休8～10天（依當月政府公告天數排休） ◆ 特休依勞基法規定。 ––- 【薪資待遇】 **月薪 31,000～32,500 元**（依學經歷及工作表現核薪） ––- 【福利制度】 法定保障 ◆ 勞工保險 ◆ 全民健康保險 ◆ 勞工退休金提撥 公司福利 ◆ 三節禮金(品) ◆ 生日禮金 ◆ 業績獎金 ◆ 年中、年終獎金（兩次合計約0.5～1個月，依公司營運狀況發放） ◆ 員工購物優惠（通過試用期後） ◆ 團體保險 ◆ 不定期員工聚餐 ◆ 完整教育訓練 ◆ 完善升遷制度 ––- 【我們希望你具備】 ✔ 喜歡服務顧客，態度親切有禮。 ✔ 做事細心、積極、具責任感。 ✔ 願意學習新事物，配合團隊合作。 ✔ 能接受久站及搬運商品。 ✔ 具百貨、零售、門市、服務業相關經驗者佳（無經驗亦歡迎，公司提供完整教育訓練）。 ––- 中聯百貨擁有上萬種商品，提供生活五金、居家用品、日常百貨等多元商品，工作內容豐富，每天都能接觸不同商品知識。 如果你喜歡與人互動、願意學習新事物、希望有穩定的工作及發展機會，歡迎加入我們的團隊！

【本職缺優先審核至休斯微公司官網投遞人選】請至休斯微官網投遞：https://career.suss.com/en/jobs 【Talents who apply job via SUSS MicroTec Career Website will be given priority review】Please apply opening here：https://career.suss.com/en/jobs ________________________________________________________________________________ Key Responsibilities: • Lead and drive the qualification, process development, trouble-shooting, characterization of advanced chip/wafer bonding/de-bonding processes for SUSS products to ensure competitive edge of processes performance for customer demands in the domain fields of 3D advanced semiconductor, e.g. SoIC, CoWoS, InFO, BSPDN • Improve the yield of process characteristics by analyzing process symptom data and performing for expertise documentation of technique to conduct 3D processes enhancement for sophisticated technical projects and events • Act as the primary point of contact for on field key customers, manage multi-disciplinary projects and technical tasks of R&D or HVM from concept to completion, ensuring milestones on time and within planning scope • Co-worker with the team to cultivate the continuous BKM techniques knowledge stewardship, accelerating the team‘s technical proficiency • Take accountability and ownership of critical tasks and projects assigned by supervisor Requirements: • Education of Master or beyond in engineering background for Physics, Optics, Material Science, Mechanical Engineering, Electrical Engineering • 6+ years of proven experience in wafer fab working, specifically in 3D wafer process engineering or field applications • Deep technical proficiency with chip/wafer bonder/de-bonder and sophistic knowledge with 3D semiconductor or advanced packaging domains • Demonstrated experience in managing complex projects or tasks • Analytical skills, self-motivated, resilience characteristics with good accountability

【工作說明】 1.負責人員管理、教育訓練及工作績效評估 2.追蹤現場物料領用與耗材管控，維持作業環境之 5S 標準 3.即時反映機台故障與品質瑕疵，填寫生產日報表與異常記錄 4.掌握品質管理、異常處理，提昇良率 【上班時間】 固定早班/晚班 日班:07:30-19:35；夜班:19:30-7:35 【薪資條件】 以工作20天計算，早班50,000~55,000元、夜班60,000~65,000元(含輪班津貼及加班費) 【特殊備註】 正式生產前需至楠梓廠培訓

【本職缺優先審核至休斯微公司官網投遞人選】請至休斯微官網投遞：https://career.suss.com/en/jobs 【Talents who apply job via SUSS MicroTec Career Website will be given priority review】Please apply opening here：https://career.suss.com/en/jobs ________________________________________________________________________________ Role Introduction: • We are looking for talented electrical engineer who is specialized in electrical/control system design of semiconductor process machine. • You will become member of DSC product engineering team, your responsibility is to demonstrate your design skill to fulfill any requirements of product development. • You will be working in an international working environment. We expect the candidate is fluent in English, with mature communication and teamwork skill for better efficiency. Your mission: • Demonstrate your expertise for trouble shooting and design mechatronic system per DSC lithography product roadmap. • Possess strong DOE ability for system error analysis and execute test plan. • Involved in NPI project to MFG team for new system, feature and technology. Perform trouble shooting, technical support and process improvements to fulfill the goal of production output. • Involved in CIP and maintenance project for mature product. • Initiate and validate engineering changes and familiar with ERP system for document management. • Strong mindset and experience of risk assessment, cost evaluation and cross function cooperation. Business travel requirement: • Less than 2 month a year.

【本職缺優先審核至休斯微公司官網投遞人選】請至休斯微官網投遞：https://career.suss.com/en/jobs 【Talents who apply job via SUSS MicroTec Career Website will be given priority review】Please apply opening here：https://career.suss.com/en/jobs ________________________________________________________________________________ The Software R&D Engineer – Scanner is responsible for developing and maintaining software for lithography scanner tools used in semiconductor manufacturing. This includes optimizing HMI, PC platforms, and device control systems. The role also involves leading continuous improvement projects and migrating software to next-generation platforms to align with business and sustainability goals. A strong background in PLC ladder logic and proficiency in C# programming are essential for troubleshooting, maintaining, and enhancing scanner software. This position offers the opportunity to solve complex challenges and contribute to the advancement of semiconductor technology. Task: • Collaborate with the engineering team to develop new features, diagnose root causes, and provide technical support to both the product line and field service teams. • Further standardization of the components used between different module platforms. • Process improvements and quality mindset in design perspective in order to secure production output and deal with customer issue escalation. • Having risk assessments (FMEA) in issue investigation and test planning capability • Software package/patch version control and provide release notes to stakeholders • Involved in ECR (Engineering Change Requests) and CIP (Continued Improvement Projects) according to internal/external customer’s requests. • Responsible for solution delivery and commitment on project timelines. Characteristic: • Teamwork: Able to work in a cross function and international environment. • Self-learning: Able to collect information to improve your knowledge pool, and also help the growth of the team by sharing knowledge. • Proactive: Willing to tackle with technical challenges and the mindset of seeking solutions for continuous improvement. • Planning: Result oriented thoughts for assigned task and project. Business travel requirement: • Less than 2 month a year. • Maximum 10％ support at customer side

🌟歡迎加入正職門市團隊！🌟 你熱愛與人互動，喜歡充滿活力的工作環境嗎？我們正在尋找充滿熱情的夥伴，一起打造歡樂的用餐時光！🎉 🍔 你的任務 1. 為顧客點餐 2. 煎台餐點、漢堡與三明治製作 3. 負責飲料分裝 4. 維持店內環境整潔 準備好投入這個充滿活力的小天地了嗎？立即電洽加入！✨