越南留學生討論區

📢📢📢📢📢 【住商不動產桃園站前成功加盟店👋擴大徵才 ⭕房仲業務菁英⭕業務助理⭕營業員數名💥💥💥💥💥熱血招募中】 ✅想挑戰高薪？想換一群會一起拚一起笑的工作夥伴？ ✅我們就是你在找的團隊！ ✅這裡不是普通的房仲工作，這裡是你翻轉人生的起點！ ♻️♻️♻️♻️♻️♻️♻️♻️ 【我們要找這樣的你】 ✅敢衝、敢講、敢挑戰！ ✅不怕學👉不怕問👉只怕你不來！ ✅沒經驗沒關係，我們從零教到會👉從菜鳥變戰神！ ♻️♻️♻️♻️♻️♻️♻️♻️ 【你會做的事很簡單】 ✅幫客戶找到家👉或幫他把房子華麗轉身順利售出！ ✅看屋帶看👉談判成交👉你就是房市魔術師！ ✅建立自己的人脈＋收入王國💯💯 ♻️♻️♻️♻️♻️♻️♻️♻️ 【你會拿到的不只有錢💰💰】 ✅超狂抽成👉獎金直接灌進你帳戶💥💥💥 ✅歡樂工作一起賺錢 ✅教育訓練前輩帶你、聚餐旅遊、還有各種表揚 ✅公司地點超讚💥💥💥 👉G07桃園火車站前商圈⭕緊鄰市區⭕東區⭕新站⭕小檜溪⭕大有⭕龜山👉超級核心地段 ✅交通便利客源超多 ♻️♻️♻️♻️♻️♻️♻️♻️ 【薪資待遇】 👉底薪＋獎金抽成(真的高) 👉 新人首年月薪6~10萬跑不掉 👉年收入破百萬不是夢，是常態！ ♻️♻️♻️♻️♻️♻️♻️♻️ 【我們在等你】 ✅歡迎直接撥打圓夢專線或親洽(王店長)： 📲0981-706-868 ☎️03-3340888 ✅還可以來店聊聊🤗 我們公司在👉【桃園市區成功路二段上】 ♻️♻️♻️♻️♻️♻️♻️♻️ 來👉現在就給自己一個機會💯成為下一個百萬經紀人！ ✅住商不動產桃園站前成功加盟店🙌一個讓你華麗蛻變💥💥如鑽石般閃閃發亮的地方 💎💎💎💎💎

📢📢📢📢📢 【住商不動產桃園站前成功加盟店👋擴大徵才 ⭕房仲業務菁英⭕業務助理⭕營業員數名💥💥💥💥💥熱血招募中】 ✅想挑戰高薪？想換一群會一起拚一起笑的工作夥伴？ ✅我們就是你在找的團隊！ ✅這裡不是普通的房仲工作，這裡是你翻轉人生的起點！ ♻️♻️♻️♻️♻️♻️♻️♻️ 【我們要找這樣的你】 ✅敢衝、敢講、敢挑戰！ ✅不怕學👉不怕問👉只怕你不來！ ✅沒經驗沒關係，我們從零教到會👉從菜鳥變戰神！ ♻️♻️♻️♻️♻️♻️♻️♻️ 【你會做的事很簡單】 ✅幫客戶找到家👉或幫他把房子華麗轉身順利售出！ ✅看屋帶看👉談判成交👉你就是房市魔術師！ ✅建立自己的人脈＋收入王國💯💯 ♻️♻️♻️♻️♻️♻️♻️♻️ 【你會拿到的不只有錢💰💰】 ✅超狂抽成👉獎金直接灌進你帳戶💥💥💥 ✅歡樂工作一起賺錢 ✅教育訓練前輩帶你、聚餐旅遊、還有各種表揚 ✅公司地點超讚💥💥💥 👉G07桃園火車站前商圈⭕緊鄰市區⭕東區⭕新站⭕小檜溪⭕大有⭕龜山👉超級核心地段 ✅交通便利客源超多 ♻️♻️♻️♻️♻️♻️♻️♻️ 【薪資待遇】 👉底薪＋獎金抽成(真的高) 👉 新人首年月薪6~10萬跑不掉 👉年收入破百萬不是夢，是常態！ ♻️♻️♻️♻️♻️♻️♻️♻️ 【我們在等你】 ✅歡迎直接撥打圓夢專線或親洽(王店長)： 📲0981-706-868 ☎️03-3340888 ✅還可以來店聊聊🤗 我們公司在👉【桃園市區成功路二段上】 ♻️♻️♻️♻️♻️♻️♻️♻️ 來👉現在就給自己一個機會💯成為下一個百萬經紀人！ ✅住商不動產桃園站前成功加盟店🙌一個讓你華麗蛻變💥💥如鑽石般閃閃發亮的地方 💎💎💎💎💎

我們是大墩事業（大榮生技關係企業），專注於保健食品的品牌推廣與業務開發。 同時代理與推廣 諾瑪 NUMA 保健食品品牌，更多品牌理念與產品資訊可參考官網：https://www.numafirst.com/zh-TW 本職缺主要負責中區美容相關通路開發與客戶經營，希望找到喜歡與人互動、願意主動開拓市場的業務夥伴。 【主要工作內容】 • 開發美容 SPA、美容工作室、美體／體態管理及相關美容通路 • 主動進行陌生拜訪、電話開發及潛在客戶接洽 • 依客戶需求進行產品介紹、合作方案規劃與業務提案 • 協助合作店家了解產品特色、銷售方式及相關資訊 • 維護既有客戶關係，追蹤訂單、回購及後續合作 • 蒐集市場資訊與客戶需求，持續拓展新合作據點 【我們希望你具備】 • 喜歡與人互動，具良好溝通及業務開發能力 • 不排斥陌生開發，願意主動拜訪新客戶 • 能獨立安排拜訪行程及追蹤客戶 • 對保健食品、美容、美體及健康產業有興趣 • 具美容產業、美容師、美容顧問或相關業務經驗者優先 另有產品獎金、績效獎金、業績獎金、收款獎金及成長獎金等制度。 如果你熟悉美容產業，也喜歡透過開發與經營，把陌生客戶一步步變成長期合作夥伴，歡迎加入我們。

【工作內容】 1. 指導學生學業：協助學生完成學校作業，進行課業輔導及複習，針對個別需求提供額外的加強與支持，培養學生良好的學習習慣。 2. 關懷學生生活：代替家長照顧學童，妥善處理學生在班內的生活事務，關心學生情緒，營造溫暖的學習環境。 3. 家長聯繫與回饋：與家長保持良好的溝通，定期反饋學生的學習狀況，讓家長充分了解孩子的進步與需要改進之處。 4. 考卷與作業處理：負責批改考卷及學生作業，製作或整理輔助教材與講義，幫助學生更有效率地學習。 5. 月考與複習負責：在月考前指導學生進行充分複習，並給予個別化建議，幫助學生提升成績，確保教學成效。 6. 環境清潔與維護：維持教室與公共區域的整潔，營造良好的學習與生活空間。 7. 活動與團隊配合：協助補習班內的活動策劃與執行，與其他同事保持良好的協作，確保各項事務運作順暢。 【職位要求】 1. 有教學或安親班經驗者優先，無經驗者亦可，我們提供完善的培訓制度。 2. 需具備耐心、細心及責任感，能以正面態度引導學生並積極解決問題。 3. 具良好的溝通能力，能與學生及家長有效互動，並維持專業形象。 4. 對教育事業充滿熱情，喜歡與孩子相處，有能力面對挑戰與壓力。 【工作條件與福利】 1. 工時與特休：每月工時及特休假皆符合《勞基法》規定，尊重員工權益。 專注教學：僅需專注於自己的班級，不需承擔招生或額外活動的壓力，工作內容單純。 2. 薪資透明與激勵： ✔ 尚未獨立帶班期間：月薪 30,000 元。 ✔ 獨立帶班後，除基本薪資外，另依帶班學生人數提供獎金制度： - 帶班 1–16 人：獎金 3,000 元 - 帶班 17 人：獎金 3,700 元 - 帶班 18 人：獎金 4,400 元 - 帶班 19 人：獎金 5,100 元 - 帶班 20 人：獎金 6,000 元 - 帶班 21 人以上：每增加 1 人，獎金增加 1,000 元 ✔ 薪資制度 公開透明、無隱藏條件，面談時將 100％ 說明實際工作內容及所有福利制度。 【我們的承諾】 1. 正派經營，提供穩定且愉快的工作環境。 2. 透明化管理，讓員工安心投入教育工作。 如果您熱愛教育並希望加入一個正直且專業的團隊，歡迎投遞履歷並加入我們的行列！ 我們致力於為每位員工提供安心穩定的工作環境與豐富的福利措施，讓每位團隊成員都能在愉快的氛圍中工作與成長。 【基本保障】 ✔ 勞保與健保：依法為每位員工提供完善的勞健保保障。 ✔ 週休二日：每週享有固定休假，重視員工的生活與工作平衡。 【獎勵與補助】 ✔ 績效獎金：根據工作表現，提供具有激勵性的績效獎金。 ✔ 禮品/禮金：於節日或特殊場合發放禮金或禮品，表達公司對員工的關懷。 ✔ 人數獎金：根據公司營運成果，提供額外獎金回饋員工的努力。 【休假與彈性安排】 ✔ 特休假：依照勞基法及員工資歷提供充足的休假天數，鼓勵員工享受工作之外的生活。 ✔ 彈性請假：支持員工照顧家庭或處理緊急事項，打造友善的工作環境。 【其他福利】 ✔ 每月下午茶：每月定期提供豐富的下午茶，讓員工在忙碌之餘享受放鬆時光，增進同事間的交流。 ✔ 員工子女學費優惠：提供員工子女學費優惠，減輕教育負擔，讓員工在工作與家庭之間取得更好的平衡。 ✔ 手機補助福利：任職滿兩年者即可申請「手機補助」，公司配給當年度iPhone或等值Android新手機，讓你輕鬆汰舊換新、保持通訊順暢！ ✔ 課後照顧證照：無論是安親老師還是英文老師，若擁有課後照顧證照或在職期間進修取得證照者，次月即提撥每月$1000獎金。 ✔ 推薦人才入職獎勵：成功推薦新員工加入團隊，經試用期通過後即可獲得推薦獎金，金額依職缺與人選條件不同，總額為$10,000～$20,000，與你一同打造優質團隊！ 【學習與成長】 ✔ 內部與外部培訓：提供多元化的學習資源，幫助員工提升專業技能與職場競爭力。 ✔ 職涯發展規劃：針對不同職位，提供明確的晉升與發展機會。 加入我們，不僅是一份工作，更是一個能實現自我價值、收穫職場成就的舞台。我們期待每位同仁都能在這裡找到歸屬感，開創屬於自己的精彩職涯！

【工作內容】 1. 指導學生學業：協助學生完成學校作業，進行課業輔導及複習，針對個別需求提供額外的加強與支持，培養學生良好的學習習慣。 2. 關懷學生生活：代替家長照顧學童，妥善處理學生在班內的生活事務，關心學生情緒，營造溫暖的學習環境。 3. 家長聯繫與回饋：與家長保持良好的溝通，定期反饋學生的學習狀況，讓家長充分了解孩子的進步與需要改進之處。 4. 考卷與作業處理：負責批改考卷及學生作業，製作或整理輔助教材與講義，幫助學生更有效率地學習。 5. 月考與複習負責：在月考前指導學生進行充分複習，並給予個別化建議，幫助學生提升成績，確保教學成效。 6. 環境清潔與維護：維持教室與公共區域的整潔，營造良好的學習與生活空間。 7. 活動與團隊配合：協助補習班內的活動策劃與執行，與其他同事保持良好的協作，確保各項事務運作順暢。 【職位要求】 1. 有教學或安親班經驗者優先，無經驗者亦可，我們提供完善的培訓制度。 2. 需具備耐心、細心及責任感，能以正面態度引導學生並積極解決問題。 3. 具良好的溝通能力，能與學生及家長有效互動，並維持專業形象。 4. 對教育事業充滿熱情，喜歡與孩子相處，有能力面對挑戰與壓力。 【工作條件與福利】 1. 工時與特休：每月工時及特休假皆符合《勞基法》規定，尊重員工權益。 專注教學：僅需專注於自己的班級，不需承擔招生或額外活動的壓力，工作內容單純。 2. 薪資透明與激勵： ✔ 尚未獨立帶班期間：月薪 30,000 元。 ✔ 獨立帶班後，除基本薪資外，另依帶班學生人數提供獎金制度： - 帶班 1–16 人：獎金 3,000 元 - 帶班 17 人：獎金 3,700 元 - 帶班 18 人：獎金 4,400 元 - 帶班 19 人：獎金 5,100 元 - 帶班 20 人：獎金 6,000 元 - 帶班 21 人以上：每增加 1 人，獎金增加 1,000 元 ✔ 薪資制度 公開透明、無隱藏條件，面談時將 100％ 說明實際工作內容及所有福利制度。 【我們的承諾】 1. 正派經營，提供穩定且愉快的工作環境。 2. 透明化管理，讓員工安心投入教育工作。 如果您熱愛教育並希望加入一個正直且專業的團隊，歡迎投遞履歷並加入我們的行列！ 我們致力於為每位員工提供安心穩定的工作環境與豐富的福利措施，讓每位團隊成員都能在愉快的氛圍中工作與成長。 【基本保障】 ✔ 勞保與健保：依法為每位員工提供完善的勞健保保障。 ✔ 週休二日：每週享有固定休假，重視員工的生活與工作平衡。 【獎勵與補助】 ✔ 績效獎金：根據工作表現，提供具有激勵性的績效獎金。 ✔ 禮品/禮金：於節日或特殊場合發放禮金或禮品，表達公司對員工的關懷。 ✔ 人數獎金：根據公司營運成果，提供額外獎金回饋員工的努力。 【休假與彈性安排】 ✔ 特休假：依照勞基法及員工資歷提供充足的休假天數，鼓勵員工享受工作之外的生活。 ✔ 彈性請假：支持員工照顧家庭或處理緊急事項，打造友善的工作環境。 【其他福利】 ✔ 每月下午茶：每月定期提供豐富的下午茶，讓員工在忙碌之餘享受放鬆時光，增進同事間的交流。 ✔ 員工子女學費優惠：提供員工子女學費優惠，減輕教育負擔，讓員工在工作與家庭之間取得更好的平衡。 ✔ 手機補助福利：任職滿兩年者即可申請「手機補助」，公司配給當年度iPhone或等值Android新手機，讓你輕鬆汰舊換新、保持通訊順暢！ ✔ 課後照顧證照：無論是安親老師還是英文老師，若擁有課後照顧證照或在職期間進修取得證照者，次月即提撥每月$1000獎金。 ✔ 推薦人才入職獎勵：成功推薦新員工加入團隊，經試用期通過後即可獲得推薦獎金，金額依職缺與人選條件不同，總額為$10,000～$20,000，與你一同打造優質團隊！ 【學習與成長】 ✔ 內部與外部培訓：提供多元化的學習資源，幫助員工提升專業技能與職場競爭力。 ✔ 職涯發展規劃：針對不同職位，提供明確的晉升與發展機會。 加入我們，不僅是一份工作，更是一個能實現自我價值、收穫職場成就的舞台。我們期待每位同仁都能在這裡找到歸屬感，開創屬於自己的精彩職涯！

職掌: 1.掌握產品市場新趨勢，掌握並提升產品的競爭力，提供內部人員專業諮詢與建議。 2.規劃產品策略、藍圖以及管理產品生命週期。 3.管理產品開發與量產之相關協調工作或技術移轉專案(包括專案規劃、專案組織成立以及開發時程、成本、品質等之控管等)。 4.採購核價、議價、下單、成本掌控及交期控制、進行驗收作業。 5.建立、更新供應商資料（如：貨品價格、規格和到貨時間），以選擇最佳供應商。 6.供應商維護及管理，與良好供應商維持良好關係。 7.開發新產品，新供應商蒐集，找尋品質好、成本低、配合度高的優良供應商。 8.提供緊急措施，使需求業務可做緊急採購。 9. 解決商品瑕疵退貨等問題。 10. 具備國貿、熟悉進口/三角貿易實務流程及採購流程。 11.語文能力(JLPT N1或N2檢定程度) 12.電腦能力(包含邏輯、組織、文書及簡報)、Vlookup&函數試算能力。 13.表達溝通能力(包含說服力) 14.普世價值:配合度、團隊合作特質 加分條件: 具品牌概念與代理品牌經驗。 公司官方網站 https://www.wonson.com.tw/zh-TW

Please also apply through: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Tape-Out-Engineer_R-10063230 Role Overview, Responsibilities, and Qualifications The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes. Key Responsibilities 1. Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing. 2. Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors. 3. Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability. 4. Ensure all deliverables conform to foundry requirements. 5. Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement. Qualifications 1. Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred). 2. Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows. 3. Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines. 4. Willingness to work with flexible working hours to support critical Tape-outs. Effective communication in English for collaborating across technical teams. This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.

Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/APAC-Foundry-Operations-Senior-Principal-Engineer_R-10062827 Job Description The APAC Foundry Operation team works with foundry partners on technologies which are evaluated and/or subjected to production. The key areas of responsibility of the jobholder are: - Lead the release and transfer of process options at foundries. - Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process - Lead and steer the projects towards timely completion to support NXP business needs. - Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc. The requirement fulfilling the job: - Bachelor or MSc in physics, material engineering or electrical engineering. In-depth knowledge of semiconductor physics, process development and manufacturing. - ＞10 years of experience with semiconductor process integration, working in foundries’ production or development teams. - Hands on experience in being a lead; leading teams with responsibilities in development, transfer or production projects. - All rounded knowledge on process integration, product testing, reliability testing, tapeouts, device physics will be needed in the discharge of duties as a project/ integration lead. - Good communication skills. - Pro-active working attitude, creative, pragmatic, enterprising and result driven. - Having the ability to influence and steer a discussion. - Familiar in managing/working with foundries, maximizing leverage from foundries.

- Data analysis to ensure handler work on baseline. Ex. MCBA, index time, temperature control and HW interface maintenance 資料分析確保機台運作在基準條件, 包含作動不順, 作動時間, 溫度控制, 及機台介面維護 - SOP, OCAP, PM document creation. 建立標準化流程,異常處理文件,及保養維護文件 - Responsible for the performance of handler. 負責機台性能及相關報告 - Handle the improvement project on handler. 持續進行機台的改善計畫 - Management recipes of handler and spare parts 機台參數管理及備品管理 - Provide technology and operation training to shift assistant engineer and operators in manufacture lines to support production smoothly. 訓練助理工程師與作業員以利生產線順利運作 - Co-work with worldwide handler team for evaluation/improvement 與其他機台團隊跨國合作, 導入評估, 問題改善

Please apply for this position on NXP official website: https://pse.is/836k2a Job Responsibilities: APAC Central Competence Team works with external foundries to ensure stable chip supply for business lines across NXP. The primary responsibility of this role is to locally drive the lead products ramp up under new technology introduction (NTI). The key areas of responsibility of the jobholder are: 1. Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process 2. Front end process safe launch owner. Closely work with foundries at ramp up phase and drive for manufacturability and yield improvement. 3. Interface with key customers on critical projects. 4. Lead and steer the projects towards timely completion to support NXP business needs 5. Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc Requirements / preferences: 1. Bachelor or MSc in physics or electrical engineering. 2. ＞10 years of experience with front-end IC process integration, working in foundries’ production or development teams 3. In-depth knowledge of IC devices and processes. FinFET and NVM knowledge is a plus. 4. Strong understanding of yield enhancement techniques and data analysis 5. Must be fluent in English and Mandarin 6. Hands on experience in being a lead; leading teams with responsibilities in development / transfer projects or production ramp up. 7. Good communication skills. Having the ability to influence and steer a discussion 8. Pro-active working attitude, creative, pragmatic, enterprising and result driven. 9. Familiar in managing/working with foundries, maximizing leverage from foundries

***Please upload English resume onto our official platform: https://reurl.cc/1bbx6m Job Descriptions - The selected candidate will participate in Wi-Fi/BT software/firmware design , implementation, integration, validation and maintenance phases for standard based and non-standard based Wi-Fi/BT/BLE products for IOT and automotive markets. - Lead/participate in complex feature integrations/enhancements, Wi-Fi/BT/BLE SoC bring up, and technical issue solving. - Research, design and develop cutting edge technologies for industrial features and IEEE/WFA/BT/BLE spec. Ranging from Wi-Fi enterprise access point, embedded clients and other wireless technologies. - Participate the full life cycle of IC – spec designing, pre-silicon validation, chip bring-up, software development, customer engaging and supporting. Support customers remotely or onsite as needed. Qualifications - MS in EE, CE, or CS. - Proficient in C programming language. - Experience on Linux / Android programming is a plus - Knowledge on real-time OS (FreeRTOS / ThreadX) programming is a plus - Knowledge of ARM assembly is a plus - Team player and excellent interpersonal, communication and writing skills - Independent, self-motivated and willing to learn

Role Summary: The NVM Reliability team is responsible for characterizing, modeling, and enabling next-generation Non-Volatile Memory technologies, enabling new product creation company-wide. Job Responsibility: －Interface with foundries and other external suppliers of technology and IP to assess reliability margin to product applications. －Establish qualification requirements for new technology and product introduction. －Perform rigorous statistical analysis of reliability characterization data. －Enable high reliability during volume production by working with product groups to address risk areas. －Support business groups with customer requests for technical information, including reliability characterization results, risks assessments, and consultation on issues. －Communicate study conclusions and recommendations to internal and external teams. Job Qualification: －Bachelor‘s, Masters, or Doctoral degree in Electrical Engineering, Applied Physics, or equivalent, with 10 years of industry experience. －Experienced in data processing and analysis (e.g. Python, JMP, Matlab, Exensio). －Software development experience, such as familiarity with microcontroller software development (C/C++) is desired. －Interest in statistics and solid-state device fundamentals, especially as applied to emerging non-volatile memory technologies like MRAM and RRAM. －Must be curious, proactive, and detail-oriented. －Able to work in a team environment, communicate effectively in English and Mandarin, and solve problems.

Job Responsibilities - To be the owner for manufacturing test on the released products. - Responsible for test program introduce to mass production - Responsible for NPI (after R-gate released) test data analysis and feedback to BL/PETE if any improvement needed - To be the owner for duplicated test hardware by performing debug and qualification, MSC (Gage R&R) analysis and release report - Responsible for 1st line hold lot disposition, including low yield, QA fail .......etc - To initial and work with related process owners on testing processes, documentation, and best practices - Participate in or drive test automation initiatives when applicable Required Qualifications - 3+ years of experience as a Test Engineer - Solid understanding of software/system testing methodologies - Familiarity with Linux environments and command-line operations - Experience with machine language (e.g., Java, C++) - Experience in system, embedded, hardware, or manufacturing testing - Strong analytical and problem-solving skills - Strong sense of ownership and responsibility for product quality English communication, reading, writing

***Please apply for this position on NXP official website: https://pse.is/8ms2kr Role Purpose Lead the development and optimization of high-voltage (HV) and BCD device architectures. This role requires a deep understanding of device physics and a data-driven approach to ensure industry-leading performance and reliability for power management solutions. Key Responsibilities － Device Development: Lead the architecture design and optimization of HV devices (LDMOS, EDMOS, ESD) on 180nm to 55nm BCD nodes. － Physics Analysis: Analyze and optimize Device Physics parameters, including BV, Rdson, SOA, and reliability (HCI/NBTI). － Simulation & Modeling: Utilize TCAD for 2D/3D process and device simulations to accelerate development cycles. － Device Verification: Define verification plans and execute statistical analysis using JMP for DOE and WAT data. － Design Integration: Work within Cadence environments for layout review and test structure design. － Cross-functional Collaboration: Partner with PI and PE teams to resolve yield, reliability, and manufacturing bottlenecks. Required Qualifications － Experience: Master‘s or Ph.D. in EE, Physics, or related field with 10+ years of semiconductor industry experience. － Technical Expertise: 1. Profound knowledge of Device Architecture and Device Physics. 2. Hands-on experience in 180nm to 55nm BCD process nodes. － Tools: 1. Expertise in TCAD (Sentaurus / Silvaco). 2. Expertise in JMP for statistical data analysis. 3. Proficiency in Cadence (Layout/Virtuoso). Preferred Qualifications (Plus) － Advanced Power Devices: Experience with GaN, SiC, or IGBT development. － Silicon Photonics: Knowledge of Photonics integration and device physics. － Domain Knowledge: 1. Process Integration (PI): Understanding of mask flow and doping profiles. 2. Product Engineering (PE): Experience in CP/FT data correlation and yield enhancement. Competencies － Accountability: Strong ownership of project milestones and outcomes. － Critical Thinking: Ability to identify root causes in complex device failures. － Interpersonal Skills: Effective communication across design and foundry teams. － Data-driven: Committed to objective decision-making through rigorous data analysis.

The key areas of responsibility of the jobholder are: - Collaborate closely with foundries, NXP technology teams, and business lines to qualify and release advanced FinFET processes. - Provide technical leadership in semiconductor device physics, especially in FinFET architecture and behavior. - Interface with internal and external stakeholders on critical development and transfer projects. - Lead and steer projects to meet timelines and business objectives. - Make key decisions on process integration, balancing technical, logistical, and strategic factors. - Support NTI process transfers within foundries and NXP joint ventures Requirements / preferences: - Bachelor‘s or Master‘s degree in Electrical Engineering, Physics, or related field. - Minimum 10 years of experience in semiconductor device engineering, with a strong focus on advanced logic/RF devices. - Proven hands-on experience with HKMG and FinFET technologies in production or development environments. - Deep understanding of semiconductor device physics, especially HKMG and FinFET. - Strong analytical skills in yield enhancement and electrical data analysis. - Fluent in English and Mandarin. - Demonstrated leadership in development, transfer, or ramp-up projects. - Excellent communication and influencing skills. - Proactive, pragmatic, and results-driven mindset. - Experience working with foundries and leveraging external manufacturing capabilities .

1.AS文件維護與整理 2.鼎新ERP及SFT操作 3.執行工程師交辦事項 4.圖資管理 5.學習並協助使用電腦繪圖軟體 (會AUTO CAD基礎即可)

注意並病患的用藥習慣,需有緊急護理經驗等........工作地點:三民區.鼓山區.左營區.前鎮區.小港區(以上須調派其它單位) ※需執登,另有獎金 AM:08:00~PM:12:00

注意並病患的用藥習慣,需有緊急護理經驗等........ 工作地點:三民區.鼓山區.左營區.前鎮區.小港區(以上須調派其它單位) ※需執登,另有獎金 假日班:星期六、日 AM:08:00~PM:06:00

注意並病患的用藥習慣,需有緊急護理經驗等........工作地點:三民區.鼓山區.左營區.前鎮區.小港區(以上須調派其它單位) ※需執登,另有獎金 工作時段:20:00~08:00

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