CSR專區

1.協助新世代自主研發產品試產、量產。 2.協助優化並維持製程穩定 3.產品良率提升改善 4.產品可靠度改善 5.製程異常與報廢品原因分析 『具工作經驗者，薪資另議』

1. In-line/Final WAT 值班. 2. 異常case 及線上機台分析比較. 3. 實驗分析及導入提升良率. 『具工作經驗者，薪資另議』

1.DRAM先進元件設計及開發 2.實驗規劃與量測分析 『具工作經驗者，薪資另議』

積體電路佈局設計 熟悉 Cadence tools, Hercules DRC/LVS, Calibre DRC/LVS 『具工作經驗者，薪資另議』

1.半導體製程整合相關工作。 2.開發、應用新的半導體相關技術。 3.新製程技術開發。 4.有半導體整合或製程相關經驗者佳。 『具工作經驗者，薪資另議』

1.良率提升分析 2.製程技術改善 3.實驗數據分析 4. In-line/Final WAT 值班 5. 異常case 及線上機台分析比較. 『具工作經驗者，薪資另議』

1. IC設計軟體使用介面自動化程式開發(所指的設計軟體包含益華電腦[Cadence]，新思科技[Synopsys]，明導科技[Mentor] 公司所開發的IC 設計軟體)  操作介面開發之程式開發  操作流程整合之程式開發 所需技能 : 程式開發能力( 具Perl /Python/ Cadence Skill/ C-Shell/C 程式語言或有興趣者 ) 2. IC設計資料驗證程式開發  DRC /LVS /RCX 程式開發  電路模擬的測試程式開發 所需技能 : 程式開發能力( 指的是運用IC設計軟體內建指令所設計出的程式開發或有興趣者) 『具工作經驗者，薪資另議』

1.半導體晶圓清洗設備維修保養。 2.電機/機械/化工相關科系，具半導體晶圓清洗設備經驗者佳。 『具工作經驗者，薪資另議』

1.半導體晶圓清洗及濕式蝕刻製程值班工程師。2.需配合日夜值班工作。3.理工相關科系，無經驗者可。 『具工作經驗者，薪資另議』

1.新製程機台保養技術導入。2.設備規範建立與維護。3.設備異常處理,設備保養維修系統建立&執行。4.保養料件收送及維修。 『具工作經驗者，薪資另議』

1.監控線上SPC Chart，並針對異常部分即時處理。2.製程異常分析，並維護產品品質。3.需要輪替值班，協助線上處理異常。 『具工作經驗者，薪資另議』

1. 生產線上異常產品之處理2. 協助工程實驗排run3. Handle生產線異常機台status4. 生產線異常機台復機lot handling5. 擴散新機台驗機及製程管理6. 擴散製程規範編撰建立7. 製程改善及良率提升8. 製程配方調整及最佳化9. 維護產品製程品質及穩定度 『具工作經驗者，薪資另議』

1.機台例行保養工作.2.機台故障維修復機及設備異常處理工作.3.早/中/夜/假日值班工作.4.設備專案改善工作.5.製程產品異常處理改善工作.6.source 開發及Cost down project執行工作.7.Up-time 改善提昇及Down-time 減少等improve工作.8.工安/ 5S/ TPM/ Q-100執行工作 『具工作經驗者，薪資另議』

1. Spice model parameter extraction and verification 2. Device characterization and test key design 3. Co-work with designer and process technology team during product development for model generation, device/circuit and design debug 『具工作經驗者，薪資另議』

R&D Pilot Line Fab • Updating the Fab engineers on customer issues and technology needs. • Supporting root cause defect and unique fail mode analysis. Process Integration • Delivering advanced technology to meet future product nodes. • Developing recipes to meet structural & electrical requirements. • Managing wafers though Dry Etch levels in support of special requirements. Other Process Areas • Working in cross-functional teams to jointly develop device structures. • Supporting cross-functional failure analysis and yield improvement. Dry Etch peers • Maintaining or developing expertise in multiple process, hardware, or technology areas. • Serving as a resource for peers in recipe & process development. Qualifications: • Understanding in: Transport phenomena, Electromagnetics, Atomic/Molecular physics, and Surface phenomena • Solid trouble shooting, experimental design and data analysis skills • Strong computer skills, including MS Office • Basic understanding of plasma sources used in plasma etching • Understanding in the principles of dry etch processing • Rudimentary understanding of process control and Statistical Process Control (SPC) Education/Experience: MS/PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics 『具工作經驗者，薪資另議』

1.Frame layout design and generation. 2.Tapeout data preparation 3.Optical kerf and test mask layout. 4.Kerf layout library maintain. 『具工作經驗者，薪資另議』

1. build up verilog testbench 2. fullchip verilog simulation/verification 3. verilog behavior models creation 4. pattern pool coverage raising up

1.半導體晶圓TF薄膜製程開發工程師。2.需配合輪班工作。3.理工相關科系，有經驗者佳。 『具工作經驗者，薪資另議』

1.半導體晶圓TF薄膜製程開發值班工程師。2.需配合日夜值班工作。3.理工相關科系，有經驗者佳。 『具工作經驗者，薪資另議』

R&D Pilot Line Fab • Updating the Fab engineers on customer issues and technology needs. • Supporting root cause defect and unique fail mode analysis. Process Integration • Delivering advanced technology to meet future product nodes. • Developing recipes to meet structural & electrical requirements. • Managing wafers though Dry Etch levels in support of special requirements. Other Process Areas • Working in cross-functional teams to jointly develop device structures. • Supporting cross-functional failure analysis and yield improvement. Dry Etch peers • Maintaining or developing expertise in multiple process, hardware, or technology areas. • Serving as a resource for peers in recipe & process development. Qualifications: • Understanding in: Transport phenomena, Electromagnetics, Atomic/Molecular physics, and Surface phenomena • Solid trouble shooting, experimental design and data analysis skills • Strong computer skills, including MS Office • Basic understanding of plasma sources used in plasma etching • Understanding in the principles of dry etch processing • Rudimentary understanding of process control and Statistical Process Control (SPC) Education/Experience: MS/PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics