CSR專區

1. 取料機等機具之日常點檢修理及紀錄彙整。 2. 機工具入出庫管理，貨車安排聯絡。 3. 出貨機具之檢核清潔包裝。 4. 工程用品購買。 5. 倉庫人力安排及環境維持。 6. 其他主管交辦事項。 #公司倉庫為鐵皮屋環境 #需具備機電維修經驗，有相關證照者佳

【正職月薪】 起薪為$36000~43000元(依工作經驗能力調整) 【福利&制度】 ○月休8～10天及每年特休假(依勞基法規定) ○勞保、健保，6％勞退提撥 ○免費員工餐、員工聚餐 ○工作能力考核調薪機制 ○三節獎金 ○提供員工制服 【工作說明】 歡迎對餐飲服務有興趣的夥伴們加入 1. 接待服務客人 2. 環境清潔整理 3. 櫃檯收銀、結帳

在日本國內擁有多達1,690家的專業收購店「OTAKARAYA」。 因應事業擴展，將強化支援台灣店鋪營運的後勤辦公室體制! 從文件製作、客戶入帳確認等要求精確度的事務工作,到貴重商品發送前的包裝・輕作業,是一個能廣泛發揮的複合型職位。 ①工作內容 從一般事務到出口實務、商品發送準備,您將全程參與。 辦公室工作(事務・管理業務) 客戶入帳確認:核對買賣交易的入帳狀況及確認對應。 出口文件製作:製作發票(Invoice)、裝箱單(Packing List)。 資料管理:在專用系統中輸入商品資訊、價格、庫存資料。 物流安排:安排配送業者(EMS/DHL/FedEx等)、製作託運單、進度管理。 店鋪輕作業(驗貨・包裝) 商品驗貨:發送前最終檢查刮傷或配件是否齊全。 細心包裝:為安全出口精品(包包・手錶・珠寶等)進行包裝。 庫存核對:核對店內實際庫存與系統資料。

1. 開發潛在國內客戶,拓展市場 2. 負責國內業務接洽及訂單處理 3. 負責業務推展.傳達及說明公司各項業務重大訊息,活動及產品.

1.參與機械設計討論及制定之會議 2.進行機械設計並輸出設計文件( 機器圖紙、外購件清單等) 3.依客戶需求與市場趨勢,進行機構結構設計.規劃機械系統 4.繪製2D及3D組立圖,就inventor者尤佳 4.具備獨立設計能力

Please also apply through: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Tape-Out-Engineer_R-10063230 Role Overview, Responsibilities, and Qualifications The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes. Key Responsibilities 1. Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing. 2. Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors. 3. Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability. 4. Ensure all deliverables conform to foundry requirements. 5. Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement. Qualifications 1. Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred). 2. Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows. 3. Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines. 4. Willingness to work with flexible working hours to support critical Tape-outs. Effective communication in English for collaborating across technical teams. This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.

Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/APAC-Foundry-Operations-Senior-Principal-Engineer_R-10062827 Job Description The APAC Foundry Operation team works with foundry partners on technologies which are evaluated and/or subjected to production. The key areas of responsibility of the jobholder are: - Lead the release and transfer of process options at foundries. - Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process - Lead and steer the projects towards timely completion to support NXP business needs. - Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc. The requirement fulfilling the job: - Bachelor or MSc in physics, material engineering or electrical engineering. In-depth knowledge of semiconductor physics, process development and manufacturing. - ＞10 years of experience with semiconductor process integration, working in foundries’ production or development teams. - Hands on experience in being a lead; leading teams with responsibilities in development, transfer or production projects. - All rounded knowledge on process integration, product testing, reliability testing, tapeouts, device physics will be needed in the discharge of duties as a project/ integration lead. - Good communication skills. - Pro-active working attitude, creative, pragmatic, enterprising and result driven. - Having the ability to influence and steer a discussion. - Familiar in managing/working with foundries, maximizing leverage from foundries.

***Please upload English resume onto our official platform: https://reurl.cc/qpRoqg Job Description - To work with operation/maintenance to ensure production smoothly. - To assist action confirmations with system monitors. - To work with Engineers for yield improvements from the study of stable plasma cleaning as the leading indicator. Job Qualification: - Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structures - Bachelor‘s or Master‘s student in Material/Science/Electronic Engineering or related - Available to work at least 3 days/week. - Good verbal and written English communication skills - MS Office or Programming skill - Self-motivated, results oriented, willing and eager to learn, proactive attitude

***Please upload English resume onto our official platform: https://reurl.cc/Em0W00 Job Description - To work with IT and Equipment/Production team for MMS (Machine Maintenance Solution) spare part and tool management system build up - To assist Automation project of introducing AMHS (Automatic Material Handling System) for product transportation from wire bond stage to molding stage. Qualifications: - The candidate must be pursuing a Bachelor’s or Master’s degree in Mechanical/Electronic Engineering or related. - Available to work 3 days/ week. - Good verbal and written English communication skills - MS Office, AutoCAD or Programming skill - Self-motivated, results oriented, willing and eager to learn, proactive attitude

Job Description - Ensure compliance with Taiwan electrical regulations, SEMI standards, and safety codes. - Manage and maintain facility electrical systems, including: High/low voltage distribution (HV/LV), Switchgear, transformers, UPS, and generators. - Proficient in AutoCAD for electrical drawings and single line diagrams - Strong knowledge of high-voltage power systems, including: Protective relay operation, Single line diagram development and interpretation, Familiar with motor control systems. - Handle emergency response for power-related incidents and recovery planning. - Ensure power reliability and quality to support critical manufacturing tools - Monitor and improve system performance, capacity, and efficiency. - Lead preventive maintenance (PM), especially annual electricals PM activity and troubleshooting for power systems. - Coordinate power system upgrades, expansions, and projects - Support new tool installation(Hook-up) and capacity ramp-up planning. - Analyze power consumption and drive energy-saving initiatives. Qualifications: - Bachelor‘s degree or above, preferable in Electrical Engineering - At least 5+ years of experience in industrial or semiconductor facilities. - Relevant certifications is a plus. (Electrical Engineer license, HV certification, etc.) - Familiar with PLC operation and basic control logic is a plus. - Experience in Energy Management Systems (EMS), such as ISO 50001, and HVAC systems is a plus.

Job Description 1. Ensure high-quality and accurate implementation Responsible for FDC/ADC model setup based on solid process knowledge and failure analysis experience, ensuring model accuracy and minimizing rework. 2. Manage and reduce configuration risks Configure monitoring logic, thresholds, and rules to effectively distinguish true signals from noise, reducing false alarms and missed detections that may impact production. 3. Drive efficient project execution Ramp up on systems and processes, minimizing trial-and-error to ensure timely and effective implementation of FDC/ADC projects. 4. Collaborate across cross-functional teams Work closely with Process, Equipment, Manufacturing, and IT teams to align objectives, communicate technical insights, and drive decisions efficiently. 5. Support yield improvement and operational performance Leverage monitoring systems to enable actionable insights that contribute to quality improvement, yield enhancement, and manufacturing efficiency. 6. Ensure project continuity and long-term ownership Demonstrate strong role clarity and accountability, supporting stable system operation, continuous improvement, and sustained project ownership. Requirements: Basic Qualifications: - At least 2 years of working experience in semiconductor manufacturing, preferably as a Die Attach Process Engineer. - Master‘s degree or above in engineering-related disciplines, such as Electrical Engineering, Mechanical Engineering, Materials Science, or Chemical Engineering. Technical and Analytical Skills: - Solid knowledge of process control, yield analysis, defect reduction, and continuous improvement methodologies. - Candidates with a statistics-related background are preferred, with the ability to apply data analysis techniques to process monitoring and improvement (e.g. SPC, Cp/Cpk, GR&R, MSA). - Hands-on experience with FDC (Fault Detection & Classification) and ADC (Automatic Defect Classification) applications, capable of utilizing process and equipment data for abnormal detection, trend monitoring, and early warning. - Experience in process automation applications, able to support system- or equipment-level automation projects to enhance process control and reduce manual operation risks. Quality and Customer Interface Experience: - Experience in customer complaint handling and root cause analysis, familiar with structured problem-solving methodologies such as 8D, 5 Why. - Ability to work effectively with cross-functional teams (Process, Quality, Equipment, and Suppliers) to drive corrective and preventive actions. Communication Skills: - Good written and verbal English communication skills, capable of effective interaction with customers, suppliers, and internal teams. - English proficiency equivalent to TOEIC 600 or above. Systems and Manufacturing Knowledge - Ability to leverage system and automation data for process tracking, lot history review, abnormal analysis, and continuous improvement activities.

Job Responsibilities - To be the owner for manufacturing test on the released products. - Responsible for test program introduce to mass production - Responsible for NPI (after R-gate released) test data analysis and feedback to BL/PETE if any improvement needed - To be the owner for duplicated test hardware by performing debug and qualification, MSC (Gage R&R) analysis and release report - Responsible for 1st line hold lot disposition, including low yield, QA fail .......etc - To initial and work with related process owners on testing processes, documentation, and best practices - Participate in or drive test automation initiatives when applicable Required Qualifications - 3+ years of experience as a Test Engineer - Solid understanding of software/system testing methodologies - Familiarity with Linux environments and command-line operations - Experience with machine language (e.g., Java, C++) - Experience in system, embedded, hardware, or manufacturing testing - Strong analytical and problem-solving skills - Strong sense of ownership and responsibility for product quality English communication, reading, writing

Role Summary: The NVM Reliability team is responsible for characterizing, modeling, and enabling next-generation Non-Volatile Memory technologies, enabling new product creation company-wide. Job Responsibility: －Interface with foundries and other external suppliers of technology and IP to assess reliability margin to product applications. －Establish qualification requirements for new technology and product introduction. －Perform rigorous statistical analysis of reliability characterization data. －Enable high reliability during volume production by working with product groups to address risk areas. －Support business groups with customer requests for technical information, including reliability characterization results, risks assessments, and consultation on issues. －Communicate study conclusions and recommendations to internal and external teams. Job Qualification: －Bachelor‘s, Masters, or Doctoral degree in Electrical Engineering, Applied Physics, or equivalent, with 10 years of industry experience. －Experienced in data processing and analysis (e.g. Python, JMP, Matlab, Exensio). －Software development experience, such as familiarity with microcontroller software development (C/C++) is desired. －Interest in statistics and solid-state device fundamentals, especially as applied to emerging non-volatile memory technologies like MRAM and RRAM. －Must be curious, proactive, and detail-oriented. －Able to work in a team environment, communicate effectively in English and Mandarin, and solve problems.

***Please apply for this position on NXP official website: https://pse.is/8ms2kr Role Purpose Lead the development and optimization of high-voltage (HV) and BCD device architectures. This role requires a deep understanding of device physics and a data-driven approach to ensure industry-leading performance and reliability for power management solutions. Key Responsibilities － Device Development: Lead the architecture design and optimization of HV devices (LDMOS, EDMOS, ESD) on 180nm to 55nm BCD nodes. － Physics Analysis: Analyze and optimize Device Physics parameters, including BV, Rdson, SOA, and reliability (HCI/NBTI). － Simulation & Modeling: Utilize TCAD for 2D/3D process and device simulations to accelerate development cycles. － Device Verification: Define verification plans and execute statistical analysis using JMP for DOE and WAT data. － Design Integration: Work within Cadence environments for layout review and test structure design. － Cross-functional Collaboration: Partner with PI and PE teams to resolve yield, reliability, and manufacturing bottlenecks. Required Qualifications － Experience: Master‘s or Ph.D. in EE, Physics, or related field with 10+ years of semiconductor industry experience. － Technical Expertise: 1. Profound knowledge of Device Architecture and Device Physics. 2. Hands-on experience in 180nm to 55nm BCD process nodes. － Tools: 1. Expertise in TCAD (Sentaurus / Silvaco). 2. Expertise in JMP for statistical data analysis. 3. Proficiency in Cadence (Layout/Virtuoso). Preferred Qualifications (Plus) － Advanced Power Devices: Experience with GaN, SiC, or IGBT development. － Silicon Photonics: Knowledge of Photonics integration and device physics. － Domain Knowledge: 1. Process Integration (PI): Understanding of mask flow and doping profiles. 2. Product Engineering (PE): Experience in CP/FT data correlation and yield enhancement. Competencies － Accountability: Strong ownership of project milestones and outcomes. － Critical Thinking: Ability to identify root causes in complex device failures. － Interpersonal Skills: Effective communication across design and foundry teams. － Data-driven: Committed to objective decision-making through rigorous data analysis.

***Please upload English resume onto our official platform: https://reurl.cc/9WEqOV NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 45,000 employees in more than 35 countries. Opportunity Join a world class team working on state of the art Tier 1 automotive products. NXP‘s Highly Profitable Business Line Advanced Power Solutions is seeking experienced Mobile Power Analog Designers. We engage directly with the most visible and successful mobile companies. Site Job Description Working in the Power Delivery group of the Advanced Power Solutions business line, candidate will be part of a team developing fast charging and power delivery solutions for mobile applications. Task and responsibilities - Responsible for technical executions from block design, verification, and validation for mixed signal integrated circuits, Guarantee the technical deliverables of his jobs in terms of quality and performance; - This includes system definition, block architecture, circuit design, simulation and layout. All aspects require good engineering skills together with analysis, creativity, collaboration and customer interaction. - Must have strong expertise in analog design theory and device physics, and be capable of applying these to original and novel techniques that can provide significant value. - Write articles for technical publications and conferences, and provide email and phone support for assigned products. - Documentation for design reviews and design notes, layout guidance, and other cell design activities. - Our work culture encourages engineering innovation and creativity. Engineers are expected to file patents, publish papers or technical articles and to maintain awareness of current technical developments. Design engineers are part of a team and interact globally and locally with customers, design partners, product, test and packaging engineers, program management, quality, and business teams. Qualifications - Candidate needs to hold a minimum of a B.S. degree in electrical engineering. M.S. degree is preferred. - At least 10 years direct experience designing analog and mixed-signal transistor level circuitry for power management applications. - Ability to design traditional analog MOS and BJT circuits such as bandgap references, amplifiers, oscillators, detection circuits, linear LDO and switching regulators. - Ability to design multiphase DC-DC switching converter and experienced in current balance circuit. - Knowledge in digital controlled loop design. - Other desirable skills include experience with mixed-signal design tools and flow, reading and writing Verilog AMS models.

The key areas of responsibility of the jobholder are: - Collaborate closely with foundries, NXP technology teams, and business lines to qualify and release advanced FinFET processes. - Provide technical leadership in semiconductor device physics, especially in FinFET architecture and behavior. - Interface with internal and external stakeholders on critical development and transfer projects. - Lead and steer projects to meet timelines and business objectives. - Make key decisions on process integration, balancing technical, logistical, and strategic factors. - Support NTI process transfers within foundries and NXP joint ventures Requirements / preferences: - Bachelor‘s or Master‘s degree in Electrical Engineering, Physics, or related field. - Minimum 10 years of experience in semiconductor device engineering, with a strong focus on advanced logic/RF devices. - Proven hands-on experience with HKMG and FinFET technologies in production or development environments. - Deep understanding of semiconductor device physics, especially HKMG and FinFET. - Strong analytical skills in yield enhancement and electrical data analysis. - Fluent in English and Mandarin. - Demonstrated leadership in development, transfer, or ramp-up projects. - Excellent communication and influencing skills. - Proactive, pragmatic, and results-driven mindset. - Experience working with foundries and leveraging external manufacturing capabilities .

工作內容： • 與倉庫、報關行、快遞及貨運業者溝通，處理出口及提貨相關作業 • 執行每日成品與半成品出貨作業（含 SAP 系統操作、出口報單種類、統計方式、開立提單） • 接收內部出貨指令，協調倉庫進行包裝作業 • 與各單位協調，完成跨部門作業 • 與報關行及貨運代理（Forwarder）聯繫並進行工作協調 • 追蹤貨件遞送進度及異常狀況 • 執行主管交辦事項 • 每兩個月調整班表，輪值月份需於每週六上班，並於平日排休 應徵條件: • 大學畢業，國際貿易、運籌管理、企業管理相關科系尤佳 • 英文能力：聽略懂、說略懂、讀中等、寫中等 • 具 1 年以上相關工作經驗者佳 • 具英檢證書或 TOEIC 550 分以上者佳 • 熟悉 Microsoft Word（如函數及樞紐分析）及 Excel 等辦公軟體者優先

- Data analysis to ensure handler work on baseline. Ex. MCBA, index time, temperature control and HW interface maintenance 資料分析確保機台運作在基準條件, 包含作動不順, 作動時間, 溫度控制, 及機台介面維護 - SOP, OCAP, PM document creation. 建立標準化流程,異常處理文件,及保養維護文件 - Responsible for the performance of handler. 負責機台性能及相關報告 - Handle the improvement project on handler. 持續進行機台的改善計畫 - Management recipes of handler and spare parts 機台參數管理及備品管理 - Provide technology and operation training to shift assistant engineer and operators in manufacture lines to support production smoothly. 訓練助理工程師與作業員以利生產線順利運作 - Co-work with worldwide handler team for evaluation/improvement 與其他機台團隊跨國合作, 導入評估, 問題改善

Please apply for this position on NXP official website: https://pse.is/836k2a Job Responsibilities: APAC Central Competence Team works with external foundries to ensure stable chip supply for business lines across NXP. The primary responsibility of this role is to locally drive the lead products ramp up under new technology introduction (NTI). The key areas of responsibility of the jobholder are: 1. Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process 2. Front end process safe launch owner. Closely work with foundries at ramp up phase and drive for manufacturability and yield improvement. 3. Interface with key customers on critical projects. 4. Lead and steer the projects towards timely completion to support NXP business needs 5. Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc Requirements / preferences: 1. Bachelor or MSc in physics or electrical engineering. 2. ＞10 years of experience with front-end IC process integration, working in foundries’ production or development teams 3. In-depth knowledge of IC devices and processes. FinFET and NVM knowledge is a plus. 4. Strong understanding of yield enhancement techniques and data analysis 5. Must be fluent in English and Mandarin 6. Hands on experience in being a lead; leading teams with responsibilities in development / transfer projects or production ramp up. 7. Good communication skills. Having the ability to influence and steer a discussion 8. Pro-active working attitude, creative, pragmatic, enterprising and result driven. 9. Familiar in managing/working with foundries, maximizing leverage from foundries

💼【室內設計人員】搶手職缺，等你來挑戰！ 還在尋找能大展身手的舞台嗎？這就是你的機會！💪 🌟 你的任務 1. 室內空間規劃設計，打造令人驚嘆的夢想居家或商業空間 2. 施工圖繪製，精確轉化創意成落地的藍圖 📚 期待的你 - 土木系、建築系、室內設計系相關科系畢業者優先 - 若有相關設計經驗，將為加分亮點🎯 💰 薪資待優（可依條件及資歷討論） 別再猶豫了，快來加入點亮空間美學的行列吧！