產品成品檢查及包裝 需在無塵室中工作。 需配合平日及假日加班。
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1.協助正職人員處理工作上的事務 2.工作場所環境清潔整理 3.協助會務/賽事或負責特定工作事務
「神腦國際誠摯邀請二度就業、樂齡、退休人士加入我們的團隊!」 【工作內容】 1. 通訊產品介紹與銷售,協助客戶挑選適合的設備。 2. 中華電信相關業務辦理,協助客戶選擇最適資費方案。 3. 新夥伴會有完整教育訓練,歡迎無經驗有服務熱忱的你。 4. 處理各項店務作業,如收銀結帳、庫存盤點、門市清潔,讓 你更了解門市運營模式。 5. 上班地點離家近,上班不用人擠人。 6. 工作氣氛好,跟可愛的門市夥伴一起打拚。 **偶爾需配合店點輪調**
ABC-MART是日系企業,日本第1名通路鞋店,目前販賣商品為自有品牌NUOVO、Hawkins、Danner,並擁有VANS/NIKE / ADIDAS / PUMA等國內外知名休閒運動鞋類品牌。 我們的宗旨是提供顧客需求的商品、設計有魅力的店鋪、實行讓顧客覺得「再去ABC-MART買鞋子!」的服務 歡迎喜愛銷售、服務人群,愛微笑的你加入ABC-MART的大家庭,一起努力! ●店鋪業務: 商品進貨入庫、倉儲管理、結帳收銀、商品陳列、門市清潔、對銷售有熱忱的人 ●升遷管道: 完整的教育訓練、可優先培訓為正職人員 ●服務熱忱: 積極的服務態度、微笑的接待、聆聽顧客需求、喜歡讓顧客滿足、讓有購鞋需求的消費者,決不會空手而回。
1. 負責工作區域清潔工作。 2. 負責資源回收整理及垃圾處理。 3. 負責日常清潔保養工作。 4. 執行其它清潔相關交辦事項。 5.有居家清潔、相關清潔、超商經驗者為佳。 6.周一至周五 0800-1200
高雄三民區補習班 1.輔導國中英語 2.安排學生輔導補課事宜 3.協助處理行政班務相關事項
1.分裝設備操作、線上包裝作業及障礙排除 2.機台操作及例行性機台清機保養
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我們是一家專注於旅遊服務的公司,專業提供個人及團體旅遊規劃、行程設計及相關票務服務。我們的客戶涵蓋從一般大眾到企業機構,致力於提供高效、舒適且有價值的旅遊體驗。 1. 負責公司內部與外部的團體控管事務,包括行程規劃、預訂票務及住宿安排,確保團體運行的順暢。 2. 處理日常文書工作及文件管理,例如會議記錄、報表製作、郵件處理及檔案整理。 3. 協助行政管理工作,包括行事曆管理、會議協調、費用控管、零用金管理及辦公室用品的採購與管理。 4. 熟悉並操作訂票及訂房系統,確保與供應商及內部部門之間的溝通順暢,提升服務效率。 5. 提供專業的客戶服務,處理訪客接待、電話應答及諮詢服務,並維護良好的客戶關係。 6. 掌握旅遊相關法規及行業知識,為團隊提供即時支持,並確保操作流程的合法合規。 7. 支持團控的方案執行,對接內外部相關人員,充分發揮溝通、協調及問題解決的能力,確保旅遊服務的高效運行。 8. 負責團控資料的準確整理、系統化歸檔及追蹤維護,確保信息的完整性和即時性。 我們相信團隊的成長來自於每一位成員的努力與專業,歡迎有興趣且具相關經驗或專業知識的人才加入我們。讓我們攜手為客戶提供優質的旅遊解決方案,期待您的履歷,與我們共創卓越旅遊服務的未來!
1. 策劃與執行旅遊相關產品行銷計畫,包含市場研究、目標客群分析及競爭者調查。 2. 協助製作行銷內容,包括撰寫文案、設計簡單宣傳材料及管理社群媒體帳號。 3. 支援專案管理,包括制定專案時程、協調資源及跨部門合作,確保行銷活動順利進行。 4. 分析行銷活動成效,運用數據進行檢討並調整策略,提升宣傳效果。 5. 負責旅遊相關產品資料整理與更新,並熟悉旅遊業務知識以支援業務需求。 6. 參與活動籌備與執行,包含規劃流程、聯絡合作單位及現場操作事宜。 7. 熟悉數位廣告,如Google Ads、Facebook廣告,具備操作和優化投放經驗。 歡迎加入我們,成為推動旅遊服務創新的一員!期待您的加入,共創更多旅遊體驗價值!
1.冷凍庫作業 (入貨、出貨、儲位整理、開單、盤點)。 2.堆高機操作。 3.拆櫃、裝櫃。 4.需輪班,可配合加班。 5.協助客戶進出貨事宜。 6.工作環境清潔及維謢。 7.冷凍機具及設備基礎維護及保養。 8.其他主管交辦事項。
1. 協助執行長處理各項行政事務,包括文件處理、日程管理以及會議記錄等。 2. 負責安排執行長的商務行程及出差,包括預訂機票、住宿及相關交通安排。 3. 協助組織與追蹤專案進度,確保各項專案如期完成。 4. 熟練使用辦公軟體(如 Excel、Word、PowerPoint),撰寫報告及製作簡報內容。 5. 進行市場調查及競爭分析,整理並提供有價值的數據及建議。 6. 協助執行長進行內部及外部溝通協調,維繫良好的客戶關係,並處理客訴問題。 7. 熟悉旅遊產業流程,協助簽證辦理及行前準備指導等相關事務。 歡迎加入我們,一起打造高效能、充滿熱忱的工作團隊!立即投遞履歷,期待您的加入!
Please also apply through: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Tape-Out-Engineer_R-10063230 Role Overview, Responsibilities, and Qualifications The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes. Key Responsibilities 1. Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing. 2. Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors. 3. Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability. 4. Ensure all deliverables conform to foundry requirements. 5. Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement. Qualifications 1. Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred). 2. Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows. 3. Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines. 4. Willingness to work with flexible working hours to support critical Tape-outs. Effective communication in English for collaborating across technical teams. This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.
Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/APAC-Foundry-Operations-Senior-Principal-Engineer_R-10062827 Job Description The APAC Foundry Operation team works with foundry partners on technologies which are evaluated and/or subjected to production. The key areas of responsibility of the jobholder are: - Lead the release and transfer of process options at foundries. - Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process - Lead and steer the projects towards timely completion to support NXP business needs. - Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc. The requirement fulfilling the job: - Bachelor or MSc in physics, material engineering or electrical engineering. In-depth knowledge of semiconductor physics, process development and manufacturing. - >10 years of experience with semiconductor process integration, working in foundries’ production or development teams. - Hands on experience in being a lead; leading teams with responsibilities in development, transfer or production projects. - All rounded knowledge on process integration, product testing, reliability testing, tapeouts, device physics will be needed in the discharge of duties as a project/ integration lead. - Good communication skills. - Pro-active working attitude, creative, pragmatic, enterprising and result driven. - Having the ability to influence and steer a discussion. - Familiar in managing/working with foundries, maximizing leverage from foundries.
***Please upload English resume onto our official platform: https://reurl.cc/qpRoqg Job Description - To work with operation/maintenance to ensure production smoothly. - To assist action confirmations with system monitors. - To work with Engineers for yield improvements from the study of stable plasma cleaning as the leading indicator. Job Qualification: - Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structures - Bachelor‘s or Master‘s student in Material/Science/Electronic Engineering or related - Available to work at least 3 days/week. - Good verbal and written English communication skills - MS Office or Programming skill - Self-motivated, results oriented, willing and eager to learn, proactive attitude
***Please upload English resume onto our official platform: https://reurl.cc/Em0W00 Job Description - To work with IT and Equipment/Production team for MMS (Machine Maintenance Solution) spare part and tool management system build up - To assist Automation project of introducing AMHS (Automatic Material Handling System) for product transportation from wire bond stage to molding stage. Qualifications: - The candidate must be pursuing a Bachelor’s or Master’s degree in Mechanical/Electronic Engineering or related. - Available to work 3 days/ week. - Good verbal and written English communication skills - MS Office, AutoCAD or Programming skill - Self-motivated, results oriented, willing and eager to learn, proactive attitude
Job Description - Main contact window with business lines (BLs) to deliver a high quality and manufacturable product for IC test production, meeting or exceeding the required time to market or product cost. - Take lead of new product introduction (NPI) for IC test - To coordinate with related BLs (business line) and align with wafer/final test factories to prepare the product transfer - To improve new product introduction procedure to enable smooth product transfer - To reduce risk and impact to customers and factories, escalation management, e.g. reduce risk and impact by right and timely escalation - To ensure no gap on test tooling availability Facilitate IC test data review and process for planning forecast, take responsibility on test technical data (and improvement plan) in time and accuracy - To follow up test improvement projects, hold lots, progress of New Product Introduction, test buy off…etc. - Process of Test Engineering Notice and Enovia ECO Requirement - Bachelor degree (or above), Engineering background is preferred. - Excellent communication skills (English/Mandarin, TOEIC>600) - Good logic thinking - Be familiar with MS Office tool - 1 yrs experience in IC testing or related working experience is preferred