1. BMC韌體測試 2. BMC韌體測試規劃、計劃書撰寫 3. BMC自動測試程式開發 4. BMC問題定位與溝通
針對行動通訊5G模組與5G Mi-Fi產品 1. 進行PTCRB/GCF 3GPP RF/Protocol 一致性測試 (到PTCRB/GCF Lab). 2. 到美、歐、日進行各國電信業者入網測試.(一致性/IOT/Field Trial測試). 3. 研究與了解各國電信業者入網流程或技術需求.
Employees in this position is to enable BMC(Baseboard Management Controller. Firmware supported on worldwide first tier customer projects of Clouding & Enterprise server. The required candidates should have 1. solid C programming skill 2. familiar with BSP integation & maintain 3. familiar with Embeded Linux Device Driver develop 4. ability to coordinate,communications and negotiation
嵌入式系統軟韌體開發/產測程式開發BMC 韌體開發
1.解析伺服器硬體架構與線路設計,掌握系統運作原理。 2.研究並實作 BMC 與各式硬體介面的通訊協定。 3.在 Linux 環境中進行開發與除錯,熟悉 Git、伺服器建置及開發工具操作。 4.使用 OpenBMC 平台進行功能開發、系統整合與驗證,持續優化系統穩定性與可維護性。 5.與跨部門團隊合作,協調軟硬體整合進度,並協助工廠進行問題分析與除錯,確保產品品質與量產穩定性。
Job Description Ingrasys is looking for a talented, analytical, and results-driven Supply Chain Business Program Manager, supporting a global supply chain that spans multiple locations, time zones, and hemispheres. This role reports to the Senior Account Management, and is responsible for all material planning and supply chain activities for a key customer (one of the world leading Data Center Provider in Great Seattle Area). Responsibilities • Own the development and execution of the material plan that supports the production schedule and optimally balances cost, service, and other business objectives. • Manage the Clear to Build process, proactively identifying and resolving all material shortages. • Own end-to-end inventory throughout the supply chain, setting and maintaining target levels. • Proactively identify excess and obsolete inventory and drive corrective actions. • Manage and monitor supply chain KPIs, identifying and addressing opportunities/risks. • Manage relationships with customers and suppliers on a day-to-day basis. • Take a leadership role in project teams driving critical initiatives. • Recommend and implement process improvements. • Weekly reports and trackers for supply chain management team. • Raw material planning and EOL planning and last time buy planning. • Lead and Represent the Supply Chain Management team of all factories to meet with customer Qualifications • Bachelor’s degree or higher, preferably in supply chain, business, or a related field. • 5-10 years of progressive supply chain experience, preferably with some materials planning experience in a high-tech manufacturing environment. • Strong problem solving and analytical skills. • Excellent business communication skills (oral and written); comfortable presenting to senior • leadership. • Advanced user of Microsoft Excel with an understanding of Excel modeling, data analysis, and reporting; macro/VBA skills are a plus. • Strong relationship management skills, with the ability to work effectively across teams and persuade/influence others. • Ability to work on multiple and often competing issues at the same time. • Ability to work in a dynamic fast-paced environment, dealing with new challenges every day.
1.負責ARM M系列處理器的韌體維護與開發 2.建立和管理韌體設計和驗證團隊 3.主導光模塊嵌入式韌體和引導程式設計 4.熟悉硬體設計與電路原理,能與客戶緊密合作 5.維護韌體驗證和故障分析流程
We are seeking an experienced system debug engineer with strong background in the cloud/datacenter domain. In this position, you will play a key role in realizing vision to work closely with Foxconn’s biggest customers: CSPs to enable and scale out Foxconn latest server platforms and technologies. This position will have a chance to touch cutting-edge silicon, server hardware technologies and emerging firmware and OS solutions, and apply them to the CSPs. Responsibilities include: • Mastering the latest Intel/AMD/Ampere hardware and platform features. Tracking the enabling status of those features in silicon, low-level firmware/software, Operating System and latest Linux Upstream Kernel. • Debug customer data-center issues related to platform enabling and customization. Deep dive and root cause silicon enabling and system integration issues to sub system or source code level. • Closely collaborate with silicon enabling, firmware development, and various component teams from third-party vendors (e.g., memory, storage, network, power and performance, thermal/mechanical, I/O, etc.) to troubleshoot and debug cross-discipline and complex integration issues on server platforms. Drive debug taskforce cross functions to ensure timely issue resolution. • Contribute to the definition of new platforms with software architecture and development teams, support platform bring-up activities, review designs and code changes • Contribute to validation team on improving test plan/method to validate features and verify fixes • Put new technology into practice in the fastest manner, explore all possible alternatives for better solution, and pursue constant improvement on debug methodology and tool • Define and drive the system debug process implementation and ingredient owner engagement and alignment Qualifications: The candidate should possess a Bachelor of Science in Electrical Engineering, Computer Science or relevant technology (advanced degree is preferred) with 5+ years of applicable industrial experience in the following: • Solid understanding of x86/IA with design experience or working knowledge on CPU, DIMM, Chipset and Platform • Strong low-level debugging skills that enable the root causing of issues across hardware, firmware and OS levels • Experience with ASSET SCANWORKS, Intel ITP and Cscript development. Experience with PythonSV or programming with Python. In-depth knowledge of CPU flows and experience on silicon level debug and ASD (e.g. CrashDump Analysis) are preferred • Solid understanding and hands-on development/validation experience of popular server/PC technologies including PCI/PCI-E, USB, SAS/SATA, i2C/SMBUS, IPMI, BIOS/EFI and DIMM, Storage, Networking, Virtualization, Manageability, Security, RAS, etc. • Understanding of Operating System, Driver, BIOS and firmware fundamentals. Programming skills (e.g. C/C++) that enable the source code level debug and issue fix is highly preferred. • Experience at model-based problem solving that enable the effective investigation and narrow-down of complex issues; • Demonstrated capability to work within a team environment facing fast-changing requirements and complicated stakeholders.
1.熟悉IC ATE 測試機台, 如 ETS 800 等 2.熟電源產品測試相關經驗 3.具備Digital, high speed interface testing 與debug 的實作經驗
1.工程師職缺: a. 負責x86-64伺服器操作測試,涵蓋的有: 測試與驗證系統功能(functional test)、相容性(options compatibility test)、效能(performance)、壓力承載(stress loading)、可靠度(RAS feature test)以及整合測試BIOS、BMC、與伺服器硬體所有配件 b. 對發現的產品Defect能有初步的分析與Isolation test去收斂問題點 c. 填寫並描述專案上發現的issue至Tracking system d. 基本溝通技巧和有邏輯/逆向思維 , 譬如能舉一反三或是反向思考 2. 有Intel and AMD x86或ARM伺服器或x86 storage server, networking switch等硬體類產品經驗者尤佳 3. 有伺服器當中主機板的研發與測試過程,具備問題診斷偵錯能力且對Defect敏感經驗者尤佳 *畢業新生擁有電腦硬體裝修軟體應用證照亦可,1年以上電腦系統整合測試工程師經驗尤佳
1. 營運規劃與定價 2. 負責銷售報價並管控產品線毛利 3. 產品營銷與售後支持 4. 根據架構師及業務提供之銷售規格,設計符合需求之服務產品
1.注塑或板金件開發 2.生產製造 3.機構類產品NPI項目管理
1. 海外新建廠區及跨廠區人力資源政策規劃與推動; 2. 以人力資源專家角色協同各單位HRBP團隊進行人資政策規劃、推動、執行管理與稽核; 3. 導入人力資源數據分析工具,建立指標與監控體系,執行成效分析與定期報告; 4. 參與組織轉型發展、員工意見調查與體驗提升等專案,提升公司在CSR/ESG推動成效
1.經營分析 : 負責年度經營預算規劃及損益分析,商業交易模式 2.成本管控 : 工廠成本運營管理、業務流程稽核規範、投資效益分析 3.帳務管理 : 應收、成本、費用&固定資產、應付等相關帳務管控 / 分析 / 檢討 4.主管交辦事項
產品線: Server產品 1.Familiarity with VHDL/Verilog coding and FPGA/CPLD design flow is a must 2.Familiarity with Lattice/Altera/Xilinx EDA design tool. 3.Familiarity with FPGA/CPLD design in server application and multiple bus protocols including I2C / power sequence / SPI / LPC / SGPIO / I2C switch/ UART / PWM / eSPI 4.Strong HW and x86 architecture knowledge is a plus. 5.Fluent English written and verbal communication skills. 6.Integration and test experience 7. Highly self-motivated, able to work independently in a lab environment.
1.主導NPI專案。 2.主導新產品樣品生產及轉量產。 3.負責廠內其他專案之協調及整合。 4.客戶接待。 5.對外溝通,QBR業務處理。
* 負責雲端Server伺服器的相關工作 1. Server platform BIOS development, validation, debugging. 2. BIOS requirements implementation and issues fixed. 3. Project handle and collaborate with customer and cross-functional teams.
1. 制定自動化設備軟件應用改進完善計畫 2. 軟件應用工作整體把控 3. 軟件功能測試、現場設備重大問題調試等技術支持 4. 專案前期參與軟件需求分析工作 5. 軟件二次開發應用
Responsible for End To End Quality, including yield improvement, New Product Introduction and new line qualification, abnormality handling with CLCA, customer interface (audit, RMA, complaint,..), ECN control, and other quality related issue.
1.負責筆記型電腦的自動化設備研發導入,DFM編寫,試產,量產問題解決; 2、負責產品、設備的機構圖編制及各技術階段相關資料的編寫; 3、負責與相關外協、外購廠商技術客製化及產品圖樣的溝通、確認; 4.具備Mac book,dell,HP等筆記本自動化設備開發經驗優先。