面試經驗談

1. Notebook 機構零件設計與整機組裝設計（A/B/C/D Cover, Hinge, Bracket 等） 2. 模具開發與量產異常分析（Injection, Die-casting, Stamping, CNC） 3. 結構強度與可製造性評估（DFM / DFA / DOE / CAE 分析） 4. 與跨部門（ID, EE, SI, MFG）協作進行設計驗證與問題解決 5. 新材料與新製程技術研究與導入（如可回收材料、低碳工藝） ※依學經歷、工作年資敘薪

1. 衝擊、振動及結構強度相關實驗。 2. 產品結構設計評估及數值分析。 3. 專案分析討論、模擬結果解析及設計變更建議。 4. 實驗設計操作及報告撰寫。 5. 帶領團隊成員，進行研發議題研究與報告(管理2-5人)。 ※依學經歷、工作年資敘薪

1. 衝擊、振動及結構強度相關實驗。 2. 產品結構設計評估及數值分析。 3. 專案分析討論、模擬結果解析及設計變更建議。 4. 實驗設計操作及報告撰寫。 5. 臨時交辨事項。 ※依學經歷、工作年資敘薪

1.針對NB/PC產品進行前期熱模組細部設計與評估 2.NB熱模組測試規劃，提供實驗數據結果 3.進行issue debug以確保產品品質 4.執行研發階段驗證產品功能,以確保產品功能之完整性 ※依學經歷、工作年資敘薪

1.環保法規追蹤解讀及專案展開 2.能耗測試與符合性確認 3.跨部會討論與執行環保策略 4.執行相關認證申請與排程 5.蒐集國內外ESG發展與趨勢 6.協助ESG相關準則導入、規劃與建構ESG管理系統 ※依學經歷、工作年資敘薪

安規即”安全規範”，任何產品依照各國法規，皆需先經過審查，確定其安全才能在該國販售。 故安規工程師的職責，即經由設計、測試及認證三個步驟，將安全且合法的產品，以最快的速度，協助公司推展到市面上。 1. 熟悉安全法規且能靈活應用。 2. 產品安全〝設計研發〝及測試。 3. 各國安規認證申請及管理。 4. 產品量產後，安規相關事項後續追蹤。 ※依學經歷、工作年資敘薪

1. RFQ/NPI/Post RTS activities coordination , prepare RFQ proposal , issues driving. 2. NPI phase travel budget/proto budget control and build activities coordinate among customer , internal teams. 3. Cross function co-ordination among RD/suppliers/RD/Validation team..and Customers. 4. Overall schedule control to meet major milestone.ol to meet major milestone.

1.CTO/BTO/CHV/CVN/TAA/TCO/ICC/BCC BOM申請及paper pilot訂單驗証 2.跨部門討論BOM架構 3.配合工廠生產要求，定義BOM架構及申請 4.依工廠生產流程及組裝方式，與客戶討論BOM架構，及相關訂單與BOM設定 5.負責客人資料建立維護 ※上班地點可選擇台北內湖或者桃園龜山近林口

1.伺服器高速/多層板 PCB layout 設計 2.依據 SPEC 設定並執行佈線規則 3.產生 PCB 生產底片並負責和 PCB 廠商溝通相關問題 ※依學經歷、工作年資敘薪

1.Manage the development of multiple projects. 2.Lead the design and implementation of BIOS/UEFI, prioritizing Reliability, Availability, and Serviceability to enhance overall system performance. 3.Provide technical leadership to the team, introducing and implementing best practices to optimize development processes. 4.Collaborate with clients to gather and analyze project requirements, and conduct thorough risk assessments to identify potential challenges. 5.Coordinate collaboration across various departments to achieve the project goal.

1. 領導BMC韌體的開發與系統整合工作，設計並優化BMC架構，確保系統穩定性與效能達標。 2. 負責BMC韌體更新，實現IPMI、Redfish等標準協議，用於遠程監控與管理。 3. 規劃和執行創新專案，推動產品技術迭代與升級 4. 與硬體、軟體、測試及產品管理等部門進行高效的跨部門溝通，協調資源，確保項目順利進行。 ***依學、經歷敘薪***

(1) Server BMC firmware development and porting. (2) Embedded Linux System development. ※依學經歷、工作年資敘薪

1.負責 Server DC Power 電源架構規劃、設計開發與專案執行，確保產品開發進度符合時程需求。 Responsible for Server DC Power architecture planning, design development, and project execution to ensure product schedules are achieved. 2.主導 DC Power 開發相關工作，包含電源方案設計、驗證與問題分析，確保專案執行與開發效率。 Lead DC Power development activities, including power solution design, validation, and issue debugging, to ensure project execution and development efficiency. 3.與 EE、Layout、Thermal、SI、FW、ME、Vendor 及客戶密切合作，確保電源方案符合產品規格與客戶需求。 Collaborate closely with EE, Layout, Thermal, SI, FW, ME, vendors, and customers to ensure power solutions meet product specifications and customer requirements. 4.負責電源設計品質與風險控管，包含 design review、debug、validation、量產導入與可靠度驗證。 Manage power design quality and risk control, including design review, debugging, validation, mass production implementation, and reliability verification. 5.熟悉並評估 Server 電源技術與市場趨勢，導入具競爭力的電源解決方案。 Analyze Server power technology and market trends to develop competitive power solutions. 6.負責關鍵電源零組件與方案評估，包含 Hot Swap、eFuse、Multi-phase VR、POL與LDO 等。 Evaluate key power components and solutions, including Hot Swap, eFuse, Multi-phase VR, POL and LDO-related designs. 7.協助跨部門技術溝通與客戶技術對應，推動專案順利量產。 Support cross-functional technical communication and customer engagement to ensure successful project execution and mass production. ※依學經歷、工作年資敘薪

【AITE】(Automation Infrastructure and Tools Engineering) team: provide automation & tools solution to support server design, validation and MFG production. (1) BMC/BIOS/HW/performance test tools and automation (2) MFG L6/L10/L11 etc. test solution (3) Automation test platform development 工作內容: 1.負責伺服器診斷軟體與自動化測試工具開發，支援 Design Validation（DV）與 Manufacturing（MFG）需求。 2. 開發與維護 X86 Server 平台診斷工具、自動化測試程式與 Validation Framework。 3. 設計與實作 Diagnostic Features、Test Scripts 與 Validation Utilities。 4. 執行系統除錯（Debugging）、問題分析（Troubleshooting）與 Root Cause Investigation。 5. 分析 Server 平台相關問題，包括 CPU、DIMM、NIC、GPU、Switch、Storage、NVMe 等系統模組。 6. 持續優化自動化測試效率、軟體品質與開發流程。 7. 帶領小型開發團隊，掌握專案時程、交付品質與問題收斂。 8. 與硬體、韌體、Validation、Manufacturing 團隊跨部門合作，快速定位與解決問題。 9. 支援量產環境之問題分析、測試改善與軟體優化。 ※依學經歷、工作年資敘薪 Job Description: 1. Develop server diagnostic software and automation tools to support Design Validation (DV) and Manufacturing (MFG) environments. 2. Develop and maintain diagnostic tools, automation test programs, and validation frameworks for X86 server platforms. 3. Design and implement diagnostic features, test scripts, and validation utilities. 4. Perform system debugging, troubleshooting, and root cause investigation. 5. Analyze server platform issues related to CPU, DIMM, NIC, GPU, Switch, Storage, NVMe, and related subsystems. 6. Continuously improve automation efficiency, software quality, and development productivity. 7. Lead small development teams and manage project execution, delivery quality, and issue closure. 8. Collaborate with hardware, firmware, validation, and manufacturing teams to resolve technical issues efficiently. 9. Support production issue analysis, test optimization, and software enhancement.

1. LCM/TP/Camera/PL sensor/PPG Design and Design Issue Debugging 2. Optical Design Review with Customers and Venders 3. Projects Schedule Managements for Optical Function 4. Optical Module PCBA/FPC Schematic and layout Design Review 5. LCM/TP/Camera Electrical Performance Validations 6. Defining Optical Part Incoming Inspection Criterion 7. Optical Module Assembly Troubleshooting in Factory Side 8. Optical parts roadmap planning and innovation 9. Team members coaching and technical document organization

1. Familiar in design for active cooling and passive cooling. 2. RFP/ RFQ thermal solution design and performance evaluation including the cost estimation. 3. According to projects to generate the document related to the thermal portion, like PTS, test plan for the thermal portion, design guide of the thermal portion. 4. Strong capability of thermal model building and running the thermal simulation by flotherm and icepak. 5. New technology research and study in thermal fields.

1. Responsible for handling RFQ/RFI and NPI phase or MP phase quotations, logistics planning, and resolving unexpected issues to ensure schedule adherence. 2. Collaborate with cross-functional teams to ensure timely transition of projects into mass production. 3. Build and maintain strong working relationships with customers. 4. Review operational processes and identify optimal solutions to improve efficiency. 5. Track and analyze improvement opportunities through weekly reviews. 6.Prepare and deliver customized sales presentations tailored to specific client needs. ※依學經歷、工作年資敘薪

Design, develop, and maintain Server automated testcases/frameworks for BMC/BIOS firmware validation. ※依學經歷、工作年資敘薪

1. 電子零件評估及選用，BOM表製作。 2. 功能系統規劃，繪製設計線路圖，檢視線路Rule。 3. PCB Layout 零件與線路佈局規劃，檢視Layout Rule。 4. 與工廠產線合作進行電路板零件SMT，並開機驗證功能。 5. 進行介面訊號品質量測，針對問題發生進行Debug。 6. 製作基本報告如: Issue report, SOP/Instruction report。 *** 依學、經歷敘薪 ****

1.依照生產計畫，管理採購交期，依照時程追蹤出貨，符合出貨排程達成生產目標。 2.缺料追蹤與問題排除。 3.供應商日常管理與交期協調。 4.跨部門跟催及回覆採購訂單，協助處理衝突關鍵，使生產排程取得共識。 5.需求變動與供應計畫調整，採購團隊日常管理與流程優化