面試經驗談

1. 一般會計帳務處理工作 2. 維護、更新、管理各類文件檔案（如：合約、書目資料、憑證）和資料庫系統 3. 收發公文並處理會簽文件 4. 每月員工薪資、獎金明細核算 5. 進銷項發票輸入及日常帳務登打 6. 營業稅、營所稅、各類所得扣繳等各項申報作業 7. 主管交辦事務

可外派至海外各廠稽核

1.物流營運與系統操作（基礎）： 學習並掌握智慧倉儲系統（WMS）與自動化倉儲（AS/RS）設備的日常運作流程。 2.數據分析與流程優化（進階）： 參與自動化/智慧化物流專案，透過數據分析協助改善倉儲效率與設備優化。 3.跨部門管理與專案培訓（幹部）： 接受倉儲管理、團隊帶領與供應鏈專案培訓，培養未來物流主管之綜合能力。 ––- ※我們要的就是你※ 1.不限科系，大學以上畢業。大學畢業無經驗起薪：33k-35k ，試用期通過另依表現調薪 2.無經驗可，公司提供完善教育訓練及提供證照補助機會。 4.具相關經驗者，另外以經驗敘薪。 5.可視訊面談。 6.公司提供員工宿舍。

【工作說明】 1.成品庫現場管理 2.流程改善 3.稽核帶領 4.成本預算管控 【應徵條件】 1.兩年以上倉儲或出貨管理經驗 2.多益550分以上(或GEPT/雅思/托福之英文證照) 【特殊備註】 需在路竹及南科廠兩地作業

【工作說明】 1.負責人員管理、教育訓練及工作績效評估 2.追蹤現場物料領用與耗材管控，維持作業環境之 5S 標準 3.即時反映機台故障與品質瑕疵，填寫生產日報表與異常記錄 4.掌握品質管理、異常處理，提昇良率 【上班時間】 固定早班/晚班 日班:07:30-19:35；夜班:19:30-7:35 【薪資條件】 以工作20天計算，早班50,000~55,000元、夜班60,000~65,000元(含輪班津貼及加班費) 【特殊備註】 正式生產前需至楠梓廠培訓

1. 負責炸物之備料、裹粉與油炸作業，依照標準流程完成餐點製作。 2. 操作油炸設備，掌握油溫、炸製時間與起鍋時機，維持炸物的熟度、酥脆度及出餐品質。 3. 依據點餐內容與出餐順序組合餐點，完成裝盒、擺放及外帶包裝。 4. 依照食品安全及餐飲衛生規範，執行洗手、器具消毒、油品檢查與炸油更換作業。 6. 負責炸台、工作檯、抽油煙設備及廚房器具的清潔維護，並進行廚餘處理與垃圾分類。 我們用小小攤車來傳遞美味炸雞，陪伴著大家很多年，是許多遊客來到國華街必吃的美食，也是專屬台南的美好記憶～ 歡迎加入炸雞洋行國華店，與我們一起製作酥脆美味的炸雞與炸物餐點！期待你的加入。

1.辦理住房登記及退房結帳事宜。 2.客房帳務處理。 3.負責夜間櫃檯人力安排、工作分派與人員督導。 4.緊急狀況處理等。 ★大夜津貼另計。

1.負責原料、紗線及產品之取樣與品質檢測。 2.操作實驗室檢測儀器，執行各項物性測試。 3.負責檢測數據記錄、整理及報告製作。 4.協助品質異常追蹤及相關檢驗工作。 5.負責實驗室儀器、用品及環境之日常維護。 6.依公司作業規範執行實驗室相關工作。 7.公司提供完整培訓 2025年任職1年以上，80％以上平均年終奬金超過2個月。

又增企業股份有限公司專注於電力機械設備與多元電力器材製造，產品涵蓋AC/DC電源線、連接器以及汽機車與家電配線組合。⚡🔌現在招募行政人員加入團隊！喜歡整理資料、協調流程，也想了解電力器材產業的日常運作嗎？這份工作會接觸採購、財務、出貨與品質等多項行政任務，讓每一天都充實又有成就感！ 🌟 行政人員工作內容 1. 使用Microsoft Office（Word、Excel、PowerPoint）處理報價單、採購單、出貨文件、會議紀錄及部門報表 2. 協助電力器材採購與庫存管理，記錄物料進出庫、追蹤交期並整理供應商資料 3. 辦理發票、請款、費用核銷及零用金管理並協助整理財務文件與基本會計資料 4. 收發客戶及供應商信件、包裹與文件並處理公文、會簽資料、文件歸檔及業務資料統計 5. 協助管理電力器材品質文件，整理檢驗紀錄、產品規格、出貨資料及品質異常追蹤文件 💛 我們期待細心負責、具備時間管理能力並樂於團隊合作的你加入又增！無論你擅長文書處理、資料整理或跨部門溝通，都歡迎來認識行政人員的工作機會，一起讓各項流程順利完成！

熟析日文 ，能獨立作業者

1. 加入車輛鈑金學徒(鳳山總公司)，跟著師傅學習車輛板金工件的安裝與修理，從實作中累積專業技能！

1.庫存管理與訂單作業 2.收料、發料、入庫、出貨相關作業 3.物料管理,包含原料需求請購, 出貨達交、異常處理等 4.帳務處理(各項表單整理、歸檔等庶務工作 ) 5.跨BU、跨部門溝通與協調 6.其他主管交辦事項

1. 協助整理歐規電氣箱、壁掛式電氣箱、操作台、儀器標準組合機櫃及金屬家具等產品的生產工單、製造單據與圖面資料 2. 辦理金屬板材、角鐵、五金零件、門鎖、鉸鏈及電氣箱配件等物料的領料、退料、數量清點與庫存紀錄 3. 協助追蹤裁切、沖床、折床、焊接、研磨、表面處理及組裝等製程進度，更新生產進度表與異常紀錄 4. 協助執行產品外觀、尺寸、孔位、焊接品質及組裝狀況檢查，填寫檢驗紀錄並回報不良品與返工項目 5. 負責廠內半成品、成品及待出貨產品的分類、標示、數量核對與儲放位置管理，協助犬舍、置物櫃及公文櫃等產品出貨備料 6. 協助廠務文件、設備保養紀錄、環境清潔紀錄及廢金屬、包裝材料等資源回收資料的整理與歸檔

1.負責門禁管制、防竊作業及竊盜處理工作等安全維護工作 2.收發文件 3.針對特定處所進行監視，維持公共安全，減少火災、竊盜或其他危險 4.控制照明、取暖、空氣調節及通風等設備 5.社區安全維護管理、保障客戶生命和財產安全

1.負責門禁管制、防竊作業及竊盜處理工作等安全維護工作 2.收發文件 3.針對特定處所進行監視，維持公共安全，減少火災、竊盜或其他危險 4.控制照明、取暖、空氣調節及通風等設備 5.社區安全維護管理、保障客戶生命和財產安全 288H

應徵詳談

【本職缺優先審核至休斯微公司官網投遞人選】請至休斯微官網投遞：https://career.suss.com/en/jobs 【Talents who apply job via SUSS MicroTec Career Website will be given priority review】Please apply opening here：https://career.suss.com/en/jobs ________________________________________________________________________________ Summary: The position is to lead manufacturing team in SUSS MicroTec Taiwan factory to meet organization target and people management. - Ensure the planned outputs are delivered based on good quality standardization and on time delivery. - Improvement / Kaizen for the quality, production activities and related processes. - Manpower planning and people development - Responsible for the manufacturing team KPI Tasks: Support process improvements, Lean Manufacturing, Quality improvements and People Development Quality: - Ensure manufacturing team to produce SUSS systems in accordance with established specifications. - Ensure assembly team to observe and report systems issues and support on solution to avoid the defect pass through to next steps. - Lead Process Improvement Team for structural solution both technical and process issues. - Responsible for the quality improvement of products and processes. - Ensure manufacturing team to apply and follow 5S in all working area Production: - Coordinate the activities given in the production plan and monitor the progress. - Lead the continuous improvement of manufacturing activity. - Ensure manufacturing team to produce SUSS systems according to the procedures. - Set an example to other members of the team. - To have overview of total process from assembly through to output and act as escalator for critical issues to drive manufacturing team meet target Planning: - Resource arrangement including manpower, tools and work preparation. - Capacity Resource Planning (CRP) for mid / long term manpower requirement - Control machine cost via monitoring/controlling labor hours for system assembling - Closely control the use of tools, materials and equipment. Skills: - Acquire sufficient knowledge of new and established products and processes, modifications, sub-modules and complete systems. - Mature soft skill for people management - Good mind-set and personality: Target oriented, process driven, systematic and critical thinking - Good communication skills in both, verbal and writing - People management / development Others: - Other tasks assigned by supervisor

The R&D Manager (Hardware) is responsible for leading the hardware development team in the design and enhancement of semiconductor process equipment. This role focuses on mechanical, electrical, and system integration aspects, ensuring product quality, manufacturability, and performance while collaborating closely with software and process engineering teams. Key Responsibilities • Lead the hardware R&D team in developing new semiconductor equipment and improving existing systems, covering mechanical, electrical, and system integration design. • Define hardware architecture, development roadmaps, and engineering priorities in alignment with product and business strategies. • Supervise mechanical and electrical design reviews, prototyping, and validation to ensure reliability and performance targets are met. • Collaborate cross-functionally with software, manufacturing, process, and service teams to ensure seamless product integration and transfer to production. • Evaluate and adopt advanced technologies to enhance equipment precision, stability, and cost efficiency. • Manage project schedules, resource allocation, and technical documentation throughout the development lifecycle. • Drive continuous improvement in design quality, standardization, and modularization. • Coach and develop engineers, fostering technical growth and a culture of accountability and innovation.

【本職缺優先審核至休斯微公司官網投遞人選】請至休斯微官網投遞：https://career.suss.com/en/jobs 【Talents who apply job via SUSS MicroTec Career Website will be given priority review】Please apply opening here：https://career.suss.com/en/jobs ________________________________________________________________________________ Do you think strategically, are you interested in the dynamic market of the Semiconductor Industry and promote the success of innovative technologies? Take responsibility for the success of our products and solutions, develop sustainable strategies and promote innovative technologies in a promising market. We are looking for the next possible date Tasks: 1. Technology Scouting & Market Intelligence • Monitor industry trends and emerging technologies in semiconductor manufacturing and advanced packaging. • Identify future equipment opportunities related to: ◦ Hybrid Bonding ◦ Wafer-to-Wafer Bonding ◦ Die-to-Wafer Bonding ◦ Temporary Bonding & Debonding ◦ Advanced Packaging Lithography ◦ RDL Processing ◦ Heterogeneous Integration ◦ Chiplet Integration ◦ Silicon Photonics ◦ Co-Packaged Optics (CPO) ◦ Glass Core Packaging ◦ HBM Packaging Technologies • Analyze competitive technology developments and provide strategic recommendations. 2. Strategic Customer Engagement • Establish and maintain technical relationships with key customer engineering and technology organizations. • Support technical discussions with process integration, module engineering, R&D and advanced packaging teams. • Participate in customer technology reviews, workshops and roadmap discussions. • Serve as a trusted technical advisor to strategic customers. 3. Product & Technology Strategy • Translate customer technology requirements into actionable product development recommendations. • Support long-term product roadmap planning for: ◦ Wafer Bonding Systems ◦ Temporary Bonding & Debonding Platforms ◦ Hybrid Bonding Solutions ◦ Advanced Packaging Lithography Systems ◦ Large Field Exposure Technologies • Identify technology gaps and future investment opportunities. 4. Competitive Intelligence • Monitor competitive activities, product launches and technology roadmaps. • Benchmark competitor solutions and identify differentiation opportunities. • Deliver regular market and technology assessment reports. 5. Business Development Support • Support strategic account planning and opportunity development. • Prepare technical presentations, technology assessments and business case evaluations. • Support major customer pursuits and technology evaluations. 6. Industry Engagement • Represent the company at major industry conferences and technical forums. • Build relationships with semiconductor research institutes, industry organizations and ecosystem partners. • Maintain awareness of emerging technology developments across the semiconductor industry.