交大專區

邀請成為國內少數具百千瓦功率等級儲能轉換器技術開發及實場建置經驗的團隊夥伴。 研發項目包括： 1.中大型電力轉換器之硬體電路開發 2.電力轉換器韌體設計與軟體撰寫開發 3.電力轉換器整合測試

【職務說明】 你將加入旺矽科技 AST（Advanced Semiconductor Test）事業群，參與高頻、高功率、矽光子與先進封裝測試平台的設計開發。團隊橫跨自動化探針台、晶圓測試載具、溫度控制模組與光機整合系統，是推動 AI、車用、5G/6G、CPO 測試解決方案的核心團隊。 【工作內容】 1.新產品規劃及新技術開發 2.機構模組設計 3.機台機電整合 4.機台客製化變更 【需求條件】 • 機械/機電/光機背景，熟 3D繪圖如SolidWorks • 具模組設計經驗，了解加工與裝配配合 • 對先進半導體測試應用有高度熱情者佳 【你將接觸】 • 尖端晶片測試需求（AI、車用、SiPh、mmW） • 多元技術領域：光機熱整合、精密載具、自動化模組 • 國際客戶合作與跨部門產品開發流程 https://www.youtube.com/channel/UCzy4pCa_OqlTMJz333PojIQ 工作地點：新竹縣竹北市中和街155號 【Job Title】 AST Mechanical Engineer | Precision Module Design × Advanced Wafer Test Platform Development ________________________________________ 【Job Description】 Join the Advanced Semiconductor Test (AST) division at MPI Corporation, where you’ll be part of a core team developing cutting-edge test platforms for high-frequency, high-power, silicon photonics, and advanced packaging applications. Our team specializes in automated probe stations, wafer test fixtures, thermal control modules, and opto-mechanical integration systems, enabling next-generation testing solutions for AI, automotive, 5G/6G, and CPO technologies. ________________________________________ 【Responsibilities】 1. New product planning and technology development 2. Mechanical module design 3. Mechatronic integration of test platforms 4. Customization and modification of equipment based on customer requirements ________________________________________ 【Requirements】 • Background in mechanical, mechatronics, or opto-mechanical engineering; proficiency in 3D CAD tools such as SolidWorks • Experience in module design with a strong understanding of machining and assembly fit • Passion for advanced semiconductor test applications is a strong plus ________________________________________ 【You Will Be Exposed To】 • Leading-edge IC testing applications (AI, automotive, SiPh, mmWave) • Multidisciplinary technologies: opto-mechanical-thermal integration, precision fixtures, automation modules • Cross-functional product development with international clients and internal teams Work Location: No. 155, Zhonghe Street, Zhubei City, Hsinchu County, Taiwan

車用嵌入式系統控制器軟韌體開發與應用 1. 驅動程式軟體開發設計、CAN通訊系統配置 2. 車輛次系統控制發展與軟體維護 3. 控制器與整車系統整合 4. 執行功能驗證、硬體在環(HIL)驗證 5. 產出研究報告/期刊論文/專利

電動車系統整合與測試驗證 1. 電動車三電系統整合、底盤線傳控制系統整合 2. 電動車零組件HIL驗證，包含撰寫測試腳本、產出測試報告 3. 電動車/自駕車測試、記錄、巡檢與維護(不排斥考大客車、試車場駕照)

1.智慧化設備與自動化產線之控制系統設計與整合 2.設備電控架構規劃與自動化元件選型 3.軸控模組、感測元件、氣壓系統之整合與應用 4.設備通訊與系統整合（包含控制器、上位系統與網路通訊整合） 5.自動化系統測試、調校與優化與機構、軟體、製程團隊協作，完成設備開發與導入 *技術影片與技術簡介* https://www.youtube.com/watch?v=X9wT-LL58sw

**職缺彙整介紹請參考以下連結** 【正職職缺】: https://reurl.cc/E6QkGR 【實習/定期職缺】: https://reurl.cc/bYmMGv **技術影片** https://reurl.cc/6dqW5r 【機械所】AI領域技術運用:自駕車、電動車、機器人 【資通所】生成式AI技術趨動-跨領域創新與應用:半導體 、金融 、醫療、商業服務、國域安全 【服科中心】GAI驅動跨領域技術創新與整合:智慧醫療、文化與運動 、智慧物流

R & D on developing advanced green catalysts for industrial application, including process catalysts of petrochemicals, fine chemicals, biomass transformation, polymerization and emission control.

High Purity Materials Design and Development.

深度學習技術於影像及視訊領域相關之應用與系統開發，參與技術對接洽談，規劃相關技術研發專案計畫。團隊任務包括： 1. 影像相關之人工智慧/機器學習/深度學習/生成式AI演算法應用與系統整合開發。 2.介接客戶影像擷取系統，設計使用情境並開發使用者介面，將系統導入在所需的環境與平台上。 3. 團隊主力應用在AOI電腦視覺檢測、視覺環境感知或人體動作分析問題，並依照問題需求，進行圖像擷取與前處理，調整或修改演算方法。

1. 功率模組特性量測與檢測 2. 功率模組封裝設計與模擬分析，協助電性參數萃取、開關元件特性分析、EMI/EMC分析或散熱與熱傳模擬分析等 3. 建立分析流程與方法並文件化 4. 與系統端配合進行系統整合分析

1. 類神經網路計算的加速演算法設計。 2. 類神經網路模型操作，包括訓練和推論過程，以及資料前處理和後處理。 3. RISC-V 計算架構與指令擴充研究 4. 使用軟體模擬器或FPGA板測試、除錯、驗證所開發的演算法，確保可靠性和性能優化。 5. 跨領域團隊協作，與韌體、驅動程式、系統架構和電路設計等跨領域工程師合作。 6. 使用Emulator (ex: HAPS) or FPGA Prototyping (HAPs) 。 7. 數位電路功能設計與合成

1. 研發生成式AI技術用於影像與3D建模技術 2. 負責電腦視覺演算法開發，如人員追蹤與姿勢判定，大量物體偵測與辨識之AI模型開發與優化；負責3D模型建模與模型互動相關演算法開發，如實體模型掃描建模、3D模型處理與動作生成、VR場景建構與互動相關演算法開發。 3. 研發物理AI相關技術與模擬視覺呈現 4. 參與團隊study group，進行技術分享討論 (此職缺台南、高雄皆有需求)

主要為高頻電性模擬與部分微振動量測

1.PCB/MLO新產品製程導入 2.製程良率提升 3.製程文件撰寫與維護

本職缺EDA人才，工作內容如下說明，具備任一領域專長者即歡迎投遞履歷 1.結合AI技術探索/開發EDA工具，應用範圍涵蓋: *基於既有EDA工具開發全自動化參數探索/優化演算法、工具 *開發2.5D/3D晶片設計/分析演算法(考慮功耗、效能、面積條件) *開發多重物理 (電、熱、力、..)等新型AI 數值分析/計算求解器(Solver)，加速收斂時間 *開發生程式IP/SoC驗證技術，加速驗證收斂 2.了解/探討 強化學習、生成式AI等最新理論研究議題 3.了解/使用既有EDA工具，分析2.5D/3D 系統晶片之功耗、效能、面積

※具市場競爭力的薪資制度，提供保障年薪 13 個月 ※外商的優渥福利制度 ※優於勞基法的特別休假與彈性休假 ※各式福委會補助與活動 【工作內容】 1. 操作 Teradyne UltraFLEX / UltraFLEX Plus / J750 等自動化測試平台，執行 PCB 電性測試、驗證與故障分析 (Debug / Diagnostics)。 2. 進行機台設定、測試程式下載、配置變更及設備保養維護，確保測試系統穩定運作。 3. 依據測試流程及規範，執行成品與半成品檢驗，記錄測試數據與異常結果。 4. 針對異常樣品進行分析、撰寫異常報告 (Failure Report)，並協助工程師改善良率。 5. 支援新產品導入 (NPI) 測試驗證與量產轉換 (Mass Production Ramp-up)。 6. 配合生產進度，確保測試作業按時完成，維持設備稼動率與品質穩定性。 ＊此職位需早班(09:00-18:00)跟午班(17:00-02:00)輪班＊

職位需早班(09:00-18:00)跟午班(17:00-02:00)輪班。 1.負責SMT操機、錫膏印刷等機台設備的基礎操作與維護。 2.檢查待檢物是否確實標明機種與其他規格。 3.依據樣品與BOM表，核對各零件位置與極性是否正確。 4.檢驗基板之零件是否有空焊、短路、缺件、反向等問題，並用箭頭標籤標示不良位置。 5.加強檢驗IC、晶體、電容、LED等有極性之零件。

職位需早班(09:00-18:00)跟午班(17:00-02:00)輪班。 1. 負責 Probe Card 飛針測試包含開發、驗證與量產前測試 2. 撰寫與維護 飛針測試程式 3. 進行 電性量測（Continuity / Short / Open / Resistance / Leakage 等） 與測試結果分析 4. 協助 Probe Card 組裝後電性驗證、良率分析與問題排除 5. 與 製程、設計、製造、客戶端工程師 溝通測試需求與規格 6. 分析測試異常，提出 改善方案與測試流程優化建議 7. 建立與維護 測試規範、SOP、FA 報告與技術文件

Role Summary/Purpose: Hardware design engineer will closely work with worldwide engineers to perform engineering works for hardware testing solution of next generation semiconductor devices. The work includes requirement analysis, feasibility study, solution evaluation, task planning, project management, design execution, quality control and verification. We are working on cutting edge requirement and future technology. Responsibilities: • Provide global semiconductor interface test hardware solutions of next generation semiconductor devices for world-wide customers • Provide chip test interface HW solution engineering to compare pros and cons of different approaches and recommend best option to customers considering both performance, lead time, cost • Responsible for Testing circuits Design and super high layers PCB design for high complexity ATE device interface board correspond to various device testing, eg. Mobile application processor, High performance computer, AI, RF etc. • Responsible for scheme selection of a SUBSTRATE/MLO design in wafer testing, research for low Cost of Test scheme (considering TDE, Skip DIE, substrate stack-up) • Responsible for power integrity (PI) and signal integrity (SI) simulation at board level or system level, frequency domain or time domain to ensure HW product performance at design stage • Implement complex mechanical design/simulation, cable design, thermal evaluation by collaborating with PCB design to achieve premium quality in hardware solution according to customer device testing ultimate challenges. • Responsible for global end to end hardware project management to ensure best quality and on time delivery -Device testing requirement assessment and Feasibility study -Risk analysis and mitigation planning -Schedule planning and project management -Design execution -Regular review with global internal and external customers -Quality Control and Verification • Work closely with Global supply chain, provide solution to solve manufacture (DFM), assembly (DFA) challenges, ensure hardware products on time delivery and very high first pass rate • New technology research, new products, new materials evaluation for next generation device testing • Deliver hardware design training and seminars to customers

We are seeking a highly skilled and motivated Field Application Engineer to provide advanced customer engineering support across our key semiconductor customers. This role will act as a critical technical interface between customers and our internal teams, focusing on problem solving, project execution, and proactive alignment with customer requirements and technology roadmaps. The successful candidate will play a hands-on role in delivering world-class technical support, ensuring rapid issue resolution, and strengthening long-term customer relationships. Key Responsibilities: 1. Advanced Technical Support · Provide expert-level advice on hardware requirements to enable successful loadboard/module design projects. · Conduct schematic capture, component placement, and routing support when needed to address complex technical challenges. · Act as a senior technical resource for diagnosing hardware-related feasibility and performance issues. 2. Customer Engagement & Relationship Building · Gather and validate customer requirements to ensure sufficient information for initiating design projects. · Serve as the primary technical contact, managing expectations and maintaining clear communication with customer engineering teams. · Manage customer interactions throughout the project lifecycle to ensure satisfaction and successful delivery. 3. Application Engineering & Solution Development · Assess and estimate project schedule, cost, and feasibility to define realistic plans. · Support design-in activities by translating customer requirements into technical hardware solutions. · Deliver technical updates, training, and presentations to customers and internal stakeholders. 4. Cross-Functional Collaboration · Collaborate with internal design and project management teams to align project execution with customer requirements. · Provide structured feedback from design projects to influence product development and continuous improvement. · Ensure alignment of project execution with both tactical problem solving and longer-term strategic direction. Preferred Traits: · Resilient and Professional Under Pressure – Remains calm and constructive when facing challenges, escalations, or changing requirements. · Proactive Problem Solver with Strong Ownership – Takes initiative, drives resolution, and ensures customer satisfaction while balancing immediate issue-solving with long-term improvements. · Collaborative and Organized Team Player – Demonstrates a positive “can-do” attitude, manages multiple priorities effectively, and works seamlessly with cross-functional and global teams. This job description serves as a general guide to the responsibilities and qualifications expected for the role and may be subject to modification based on the specific needs of the organization.