- Explore timing degrade considering power integrity for proper signoff criterion - Explore EDA tool new features and introduce to project team - Define area-efficient stacking possibilities, robust PG structure for different IP styles - Provide quick assessment to IR severity and improved approaches
1. WiFi 無線通訊系統架構 2. WiFi IP數位設計 3. 計算機系統與周邊架構與數位設計 4. 系統晶片整合
1. Work on 28nm~7nm design implementation, methodology, and sign-off 2. Perform floorplan, clock planning, place and route, timing closure, and physical verification 3. Manage schedule, resolve design and flow issues, drive methodologies and execution 1. Work on 28nm~7nm design implementation, methodology, and sign-off 2. Perform floorplan, clock planning, place and route, timing closure, and physical verification 3. Manage schedule, resolve design and flow issues, drive methodologies and execution
1. Architecture design and RTL implementation of Camera system 2. Verification of Camera system
1. 影像編碼器硬體架構研究與電路設計實現 2. 影像編碼演算法研究與硬體複雜度分析
•我們在一個節奏快且敏捷的工作環境, 聚焦長期目標, 動手解決真正問題, 將 AI 落地在真實世界, 並發表論文在頂級會議與期刊. 歡迎加入我們. •此職位將協助部門AI專案執行相關實驗與分析, 包含但不限於實驗規劃, 模型開發. •This is a technical role, and it requires a high willingness to learn state-of-the-art AI techniques and a skill to apply AI techniques to business applications/processes. This job opening encompasses a wide range of end-to-end ML pipeline activities, including framing AI problems, data collection/preprocess/exploration, model development/evaluation, model deployment/monitor. Our major responsibilities include (1) landing AI in real world (2) publication at top conference/journal (DAC, IEEE/TCAD, ICLR, ICML…). Here, you will be working in a fast-paced and agile environment which needs a mindset of a startup. Together with worldwide colleagues you will deliver everything from state-of-the-art algorithms to quicker value proving solutions. •This position will assist the department‘s AI project to perform related experiments and analysis, including but not limited to experiment planning, model development.
人工處理器系統架構及RTL設計。 系統架構設計包含效能、功耗、D頻寬、以及面積分析。 並須負擔RTL實做。
1. ARM CPU subsystem platform design & integration 2. CPU post-silicon issue resolving
1. 執行功能與性能測試工作,並操作對應的測試儀表. 2. 與同事合作共同定位, 分析與解決測試過程中發現的問題.
1. Smartphone功能開發流程設計及管理 2. 需求管理流程設計及管理 3. 內部project feature管控 1. Smartphone feature development process design & management 2. Requirement management process 3. Internal project feature management and control
1. WiFi 無線通訊系統架構 2. WiFi IP數位設計 3. 計算機系統與周邊架構與數位設計 4. 系統晶片整合
1. Processor ISA design 2. Cache and bus interface 3. DSP and machine learning library design 4. Simulator/modeling and architecture
對於Smartphone AP SoC,從系統效能、功率消耗、實現與應用成本等多重面向分析產品競爭力,進而從系統角度優化硬體架構及軟體配套策略。
職缺一: 1. 專案功耗計算, 分析低功耗的設計並提出可能的解決方案 2. 跨多個 power domain 規劃, 設計, 和驗證 3. 瞭解完整設計流程和整合流程 職缺二: 1.Timing Sign-off and tapeout 2.Data-in/tape out 完整性,正確性檢查及確認. 3.和Front-end RD and backend-end PD,合作, 確保data-in 及Tape out 的進度 *台北/新竹皆有職缺
1. Processor ISA design 2. Cache and bus interface design 3. Simulator/modeling and architecture
1. 電源管理晶片與低功耗系統設計 2. 混合信號積體電路: 電源控制, 數位控制震盪器, AUXADC, SerDes 應用等 3. 數位電路設計與晶片整合 (frontend/backend integration)
In charge of technical program task execution to support team‘s goal
1. 主要處理28nm及以下之先進製程 2. 負責後段APR flow 3. 需參與團隊, 合作完成專案 4. 需撰寫程式
1. 數位 IC 設計 2. 高速 MAC/PCS/PHYD 設計 3. 高速電路架構與整合
無線通訊系統 (Wifi, Eithernet, Switch 等) 數位IC的前段驗證, 熟MAC design Verification尤佳。