交大專區

1.設計、實施和管理企業基礎設施，並根據業務需求優化企業資源。 2.監控和排除系統環境中的問題，確保可用性、問題排除。 3.實施自動化工具以提高資源管理效率。 4.與開發和運維團隊協作，實現集成解決方案並持續改進系統架構。 ※依學經歷、工作年資敘薪

1. SAP HCM 系統開發及維運 2. HR 相關系統數位化

1.L2, L3交換機設定與日常維護。 2.網路建置及產線架線預算作業。 3.防火牆設定、網管系統管理。 4.負責產線架線，佈線工程管理。 5.日常HelpDesk維運。 6.配合生產線開線維運及On-Call。

這是一個結合尖端 AI 技術與硬體工程領域的職位。我們正在招募具備熱情、能利用大語言模型 (LLM) 解決複雜工程問題的開發者。你將負責開發智慧代理人 (AI Agent)，整合內部技術文件與設計工具，直接輔助伺服器研發流程。 工作內容 1.AI Agent 架構設計與開發： 基於 LLM 開發具備任務規劃與執行能力的 AI Agent，用於輔助硬體工程師進行電路設計、零件選型及規範查詢。 2.RAG 系統建置與優化：負責檢索增強生成 (RAG) 系統開發，包含向量資料庫架構設計。 3.MCP 生態系整合： 利用 Model Context Protocol (MCP) 打造標準化接口，串接不同部門的知識庫與外部自動化工具（如 OrCAD 或其他相關模擬軟體）。 4.知識架構建置： 負責開發結合向量檢索與知識圖譜 (Knowledge Graph) 的 GraphRAG 系統，針對伺服器硬體組件間的複雜相依關係進行關聯建模。 5.研發流程自動化：將 AI 能力嵌入硬體開發生命週期，包含自動生成電路圖草案、零件選型推薦及規格合規性檢查。 6.輔助工具自動化： 開發自動化腳本或 API，將 AI 輸出結果整合進硬體設計流程，提高研發與驗證效率。 7.前瞻技術追蹤： 主動追蹤並評估最新的 AI 框架或技術。 ※依學經歷、工作年資敘薪

1. LCM/TP/Camera/PL sensor/PPG Design and Design Issue Debugging 2. Optical Design Review with Customers and Venders 3. Projects Schedule Managements for Optical Function 4. Optical Module PCBA/FPC Schematic and layout Design Review 5. LCM/TP/Camera Electrical Performance Validations 6. Defining Optical Part Incoming Inspection Criterion 7. Optical Module Assembly Troubleshooting in Factory Side 8. Optical parts roadmap planning and innovation 9. Team members coaching and technical document organization

1. Familiar in design for active cooling and passive cooling. 2. RFP/ RFQ thermal solution design and performance evaluation including the cost estimation. 3. According to projects to generate the document related to the thermal portion, like PTS, test plan for the thermal portion, design guide of the thermal portion. 4. Strong capability of thermal model building and running the thermal simulation by flotherm and icepak. 5. New technology research and study in thermal fields.

【AITE】伺服器Diag開發工程師（BMC/BIOS/HW） 工作內容： AITE(Automation Infrastructure and Tools Engineering) team: provide automation & tools solution to support server design, validation and MFG production. (1) BMC/BIOS/HW/performance test tools and automation (2) MFG L6/L10/L11 etc. test solution (3) Automation test platform development 此職位主要使用 Python 進行 BMC/BIOS/HW 測試案例自動化。 ※依學經歷、工作年資敘薪 CS or EE Master/Bachelor with 0~3 years experience (工A) CS or EE Master/Bachelor ＞ 3 years experience (高工級) CS or EE Master/Bachelor ＞ 5 years experience (課長級)

Design, develop, and maintain Server automated testcases/frameworks for BMC/BIOS firmware validation. ※依學經歷、工作年資敘薪

Key Responsibilities: • Implement V&V process to measure and analyze AI inference performance: accuracy, false positive, false negative, precision, recall, .. etc. Find out and identifying bottlenecks in the AI modules. • Compliance with test specifications to implement integration test and system test for AI module • Validate AI inference engine performance and stability across different embedded runtimes (e.g., TensorRT, SNPE, ONNX Runtime). • Utilize Linux profiling tools and vendor-specific monitors to analyze CPU, GPU, and NPU load during sustained inference tasks. • Perform stress and reliability testing on inference modules to detect memory leaks, OOM (Out of Memory) issues. • Develop automated performance benchmarking scripts to ensure consistent validation across different software versions and hardware revisions. • Collaborate with hardware and software development teams to identify and resolve system-level bottlenecks and hardware-software integration issues. • Ensure alignment with automotive standards such as: ASPICE (Automotive SPICE), ISO 26262 (Functional Safety), ISO 21448 (SOTIF), OEM-specific requirements (Toyota, Honda, VW, GM, etc.)

【Key Responsibilities】: • Develop and maintain the QA strategy for assigned SW projects in coordination with Quality Manager • Create, maintain and ensure the execution of the QA Plan for the project • Define, monitor and report quality KPIs at SW and ML model level • Prepare the quality status report highlighting non-conformities and quality risks to project management • Define escalation process to ensure identified non-conformities are addressed and resolved effectively • Perform internal gap analysis at SW and ML level to assess compliance with A-SPICE processes • Conduct work product reviews, audits and process compliance checks within the project • Collaborate with engineering and supply chain teams to resolve quality-related issues and implement corrective and preventive actions • Support project teams in preparing for internal and/or external ASPICE assessments for SW and ML • Facilitate lessons learned sessions and collaborate closely with software and ML engineering teams to implement A-SPICE process improvements and ensure alignment with functional safety standards • Ensure proper documentation and traceability across the development lifecycle, particularly for the SUP.1 process • Support the definition and refinement of the Product Development Process in alignment with organizational and project-specific quality requirements • Serve as the quality interface with Mandarin-speaking engineering teams and OEM counterparts, facilitating alignment on quality requirements and findings

Key Responsibilities:  Use simulators (e.g., ANSYS, Carla) to perform environment modeling, including scene construction, weather parameter adjustment, lighting, object modeling, and texture mapping.  Generate synthetic datasets based on data specifications and requirements, ensuring the quality and consistency of the synthesized data.  Produce ground truth for AI training, including semantic segmentation masks, depth maps, and bounding boxes …, etc.  Collaborate with Perception Algorithm Engineers to refine simulation environments and parameters based on model training needs, ensuring the “sim-to-real” gap is minimized.

SMT (PCBA) 1. Oversee QA operations, including inspections, supplier management, root cause analysis, and product reliability. 2. Develop and maintain quality management systems, including training programs. 3. Lead internal audits and external certifications (such as ISO, SPC...etc) for compliance with industry standards. 4. Drive quality improvement initiatives and manage customer complaints with preventive measures. 5. Engage clients through regular quality meetings and action plans. 6. Lead and develop the QA team, fostering accountability and continuous improvement. 7. Performs other related duties as assigned.

1.環保法規追蹤解讀及專案展開 2.能耗測試與符合性確認 3.跨部會討論與執行環保策略 4.執行相關認證申請與排程 5.蒐集國內外ESG發展與趨勢 6.協助ESG相關準則導入、規劃與建構ESG管理系統 ※依學經歷、工作年資敘薪

1.System Software Issue Analysis 2.BIOS and Driver Evaluation Test 3.WHQL Certification 4.Driver and Application Management. 5. New Technology Survey and Research. (相關科系無相關經驗可，公司有完整培訓制度) ※依學經歷、工作年資敘薪

1.CTO/BTO/CHV/CVN/TAA/TCO/ICC/BCC BOM申請及paper pilot訂單驗証 2.跨部門討論BOM架構 3.配合工廠生產要求，定義BOM架構及申請 4.依工廠生產流程及組裝方式，與客戶討論BOM架構，及相關訂單與BOM設定 5.負責客人資料建立維護 ※上班地點可選擇台北內湖或者桃園龜山近林口

1.負責 Notebook、AI PC、Desktop 及各類 3C 電子產品散熱方案規劃與技術決策。 2.帶領散熱團隊執行產品開發，確保設計品質、專案時程及量產目標達成。 3.主導熱流模擬、散熱測試驗證及技術問題分析與改善。 4.制定散熱設計規範、設計流程及技術標準，提升團隊設計能力與開發效率。 5.跨部門協調機構、電子、BIOS、聲學、工廠及供應商資源，推動專案順利進行。 6.參與客戶技術討論，提供散熱解決方案並建立良好客戶關係。 7.評估與導入新散熱技術，支援 AI PC、高效能運算及新世代產品開發。 8.培育團隊成員，建立人才梯隊及技術傳承機制。

1.針對NB/PC產品進行前期熱模組細部設計與評估 2.NB熱模組測試規劃，提供實驗數據結果 3.進行issue debug以確保產品品質 4.執行研發階段驗證產品功能,以確保產品功能之完整性 ※依學經歷、工作年資敘薪

1.從事PC產品軟/韌體程式開發及問題解決、除錯、維護。 2.BIOS應用規格及流程撰寫。 3.C語言程式設計及作業系統及周邊設備控制。 4.對x86,ARM相關先進技術的軟體開發。 ※依學經歷、工作年資敘薪

1.領導伺服器PCB佈局設計與開發，確保最佳性能、可製造性和成本效益。 2.獨立完成PCB元件佈局、約束條件管理、佈線及設計輸出(G/O)。 3.為Layout設計團隊提供技術指導與領導，確保專案進度及品質標準的達成。 4.掌握行業趨勢及新興技術，將創新的PCB設計技術應用於工作中。 ※依學經歷、工作年資敘薪

1. Project technical lead and technical management of cross functions 2. Lead project EE team members 3. Lead project design process and issue management 4. Lead critical HW debug ※依學經歷、工作年資敘薪