清大專區

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16567&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel devices developing for specialty technology. 2. Device Simulation, Test-chip design tape out and measurement system developing. 3. Process flow developing for production. 4. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16566&source=1111&tags=AO+2026_1111 Description : At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development productivity/quality.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16565&source=1111&tags=AO+2026_1111 Description : R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. Responsibilities: 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16564&source=1111&tags=AO+2026_1111 因為期待無限可能，所以選擇台積電！ 台積公司致力於營造一個充滿挑戰、持續學習且充滿樂趣的工作環境，並提供高於業界平均水準的薪酬與福利。加入台積電，您將有機會與世界一流的卓越夥伴共事，透過最先進的製程技術，共同成就改變世界的偉大事業。每一項突破與創新，都凝聚了我們的努力與心血。 2026年台積電預辦登積計畫：招募2026年應屆畢業生與研發替代役 台積電誠摯邀請「志同道合」的您，透過「線上應徵」事先註冊履歷。符合資格者將享有優先面試的機會！ 參與2026年預聘暨研發替代役熱門職缺，您將可： ▪ 畢業前即拿到聘書 ▪ 與優秀產業菁英共事 ▪ 在國際舞台盡情發揮 截止收件日：2025/10/31 如您對此計畫感興趣，台積電將前往校園辦理實體行動徵才車活動；活動當天不僅請您喝咖啡，並安排畢業校友與同學們互動交流，機會難得敬請把握機會。校園場次與報名資訊請參考官網（如未報名成功，也歡迎至現場和台積人資互動，現場投遞履歷，還可抽《限量》積星神秘小禮！） 此外，我們特別為同學安排了校園徵才實體與線上說明會，歡迎踴躍報名參加，以便了解公司市場趨勢、組織概況，並掌握求職技巧！報名連結：請參考官網 建議您根據學習領域與專業，投遞申請以下2~4個職位。符合主管需求者，將會收到面談邀請通知。 ▋歡迎志同道合的你，一起加入台積電 ▋世界上的每一個夢，都由我們來圓夢 Because we believe in endless possibilities, we choose TSMC! TSMC offers a wide variety of fulfilling experience and opportunities across our organization in many different locations. By joining TSMC, you will work with the high-performing teams in the industry and achieve your full potential through a comprehensive and systemized learning program here. We are devoted to achieving technology advancement, pursuing manufacturing excellence, and optimizing customer service. 2026 TSMC Advanced Offer and R&D Substitute Service Program Welcome to submit your resume via our application systems and apply to the following vacancies : 2026 TSMC Advanced Offer(AO) and R&D Substitute Service Program (RDSS). You will then be able to: • Get the offer before graduation. • Work with professional experts in the industry. • Fulfill yourself on the world stage. Application Deadline: October 31, 2025 Attending Campus Recruitment events with TSMC to enjoy a coffee with the industry experts to find out what suit you the best. For campus event schedule and registration details, please refer to TSMC career website (even if you are unable to register successfully, feel free to visit our booth and have a chat with us.) Submit your resume now, and gain a chance to win a limited TSMC’s gift! We’re also organizing a series of 〝TSMC Campus Recruitment Online Briefing Session〝, where you can find out more about industry trend, career opportunities, and life at TSMC. Registration link: Please refer to the career website We’re also organizing a series of 〝TSMC Campus Recruitment On-Site & Online Briefing Session〝, where you can find out more about industry trend, career opportunities, and life at TSMC. Registration link: Please refer to the career website We recommend you applying for two to four positions based on your academic background and professional expertise. If your qualifications meet the position requirements, you will receive an invitation for interviews. ▋Join TSMC｜Together, We Grow ! 2026 TSMC AO&RDSS Recruitment Job (Please refer to the job in the career website for the details for each job below): R&D (研究與發展組織) 　1-1 Research and Development Engineer (R&D) 　1-2 Design and Technology Platform Engineer (DTP) 　1-3 Specialty Engineer (Specialty) 　1-4 Integrated Interconnect & Packaging Engineer (IIP) Operations (營運組織) 　2-1 Process Integration Engineer (PIE) 　2-2 Process Engineer (PE) 　2-3 Equipment Engineer (EQ) 　2-4 Intelligent Manufacturing Engineer (IMC/MFG) 　2-5 Facility Engineer (FAC) 　2-6 Product Engineer (PE) 　2-7 Advanced Packaging Technology and Service Engineer (APTS) 　2-8 Quality & Reliability Engineer (Q&R) 　2-9 Module Associate Engineer (MAE) Corporate Business (策略暨支援組織) 　3-1 Information Technology Engineer (IT) 　3-2 Corporate Planning Organization (CPO) 　3-3 Materials Management Engineer (MM) 　3-4 Human Resources Specialist (HR) 【履歷填寫重點提醒】 1. 請務必優先填寫完成「畢業學校、畢業年份、就讀科系」後再更新履歷細節資訊，在系統資料送出後，您仍可以在收到面試邀請前持續更新內文。 2. 請詳細填寫履歷資料，包括學歷、專業關鍵字及自傳等內容；若您非外籍人士，除專業關鍵字外，其他欄位請以全中文填寫即可。 3. 自傳與專業關鍵字欄位有字數限制(1000字)，請確認字數是否符合要求，以免導致網頁無法成功送出。 4. 若履歷欄位為下拉式選單，當找不到合適內容時，可點選「其他」手動資料送出。 更多2026預聘暨研發替代役招募活動，請密切關注台積電FB粉絲專頁@加入台積 共創奇蹟 【Notes for Resume Submission】 1. Please prioritize completing the 〝Graduation School, graduation year and major〝 sections when submitting your resume. You can continue to update the content before receiving an interview invitation after the system data has been submitted. 2. Please click “Apply” and provide detailed resume information, including your education level, profession (with keywords that best describe your domain expertise) and autobiography, etc. If you are not a foreigner, please fill out the form (except for the keywords) in Mandarin. 3. Please make sure that the total work counts of your autobiography and keywords (domain description) are within a maximum of 1,000 characters respectively to prevent technical issues. 4. If a resume field is presented as a dropdown menu and you cannot find a suitable option, you may select 〝Other〝 and manually submit the required information. For more information about the 2026 Advanced Offer (AO) and R&D Substitute Service Program (RDSS), please follow our TSMC Facebook fan page@加入台積 共創奇蹟

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16579&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Our key responsibilities include: 1. We ensure customers‘ demands are well satisfied in the rapid market, win customer trust, enhance operation efficiency and reach profit maximization. 2. We drive for business effectiveness to bring world changing innovation into reality. 3. Our resources, production and demand planning, pricing, and system integration team develop flexible planning and provide quick responsiveness to coordinate needs between factories and customers. 4. We seek individuals who meet the following criteria: (1) Possess experience in Business, Industrial Engineering, Computer Science, Information Systems, Information Science, or Semiconductor Industry. (2) Have skills in logic thinking and communication, learning agility, and business acumen. Opening roles for you: 1. Account PC Planner 2. Fab Production Control Planner 3. Fab Rationalization Engineer 4. Operation Resources Planning Engineer 5. DevOps Engineer 6. ML/AI Engineer 7. Corporate Planning Associate For detailed job description, please refer to: https://careers.tsmc.com/careers/JobDetail?jobId=16579&source=1111&tags=AO+2026_1111 Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16580&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: Opening roles for you: 1. Global Procurement and Supply Planning Professionals 2. Global Logistics Digital Transformation Engineer 3. Responsible Supply Chain Management Engineer 4. Supply Chain Auditor 5. Resource Recovery Management Engineer For detailed job description, please refer to: https://careers.tsmc.com/careers/JobDetail?jobId=16580&source=1111&tags=AO+2026_1111 Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16660&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Automatic Material Handling System (AMHS) Engineer, Normal Shift. 2. Responsible for the installation of automated equipment, assembly of power systems, equipment tuning, testing, and trouble shooting. 3. Install the most advanced material handling and transportation system worldwide at a new site from day one. 4. A highly motivated individual with a strong technical background and capability to planning and sustain AMHS devices. 5. Working with a team which may include MFG, module, facility, quality team to achieve productivity, efficiency, quality excellence. 6. Lead and drive external supplier in Taiwan, Japan, Europe, America area to develop new devices and delivery on time. 7. Analysis and optimize AMHS transportation bottleneck. 8. Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16693&source=1111 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2024年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等不同製程技術，為500多個客戶生產超過11,000種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 說明: 1. 營建工地安全稽核與管理工作 2. 制定並執行安全檢查計劃 3. 工地稽核缺失之統計分析與追蹤 4. 協助處理工地安全相關的突發事件調查 5. 監督工地安全規範的落實 6. 安全教育訓練及宣導 7. 安全與衛生改善專案，如：承攬商管理、施工現場安全、暴露評估、安全衛生培訓、人因工程評估、緊急應變等 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16819&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The AI4BI team serves as the central intelligence hub within the Corporate Planning Organization (CPO). Our mission is to empower business users with AI-driven solutions that enhance customer satisfaction and streamline operational efficiency. We work closely with stakeholders who blend deep domain expertise in areas like demand and capacity planning with strong analytical capabilities. As an AI Engineer in the Product Innovation department, you will collaborate closely with product managers, designers, and internal business users to prototype and integrate new features into products. You are self-motivated and naturally curious, driven to innovate and deliver impactful results. Responsibilities: 1. Drive Innovation and Impact: Pioneer novel AI/ML solutions from initial concept to functional prototype. Shape the future of our internal product with your discoveries. 2. Collaborate with Business Users: Work closely with internal stakeholders to understand needs and translate them into actionable AI-driven solutions that create measurable value. 3. Apply Smart AI Techniques: Choose and implement the appropriate methods—classic machine learning, deep learning, or generative AI—to effectively solve diverse problems. 4. Partner Across Teams and Geographies: Collaborate with cross-functional, global teams including AI researchers, engineers, and domain experts to integrate AI into production systems. 5. Share Knowledge and Stay Current: Communicate insights through data storytelling, mentor colleagues, and proactively adopt emerging AI/ML trends to continuously improve solutions. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16820&source=1111&tags=AO+2026_1111 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2024年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等不同製程技術，為500多個客戶生產超過11,000種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 說明: 1. 你喜歡動手解決精密機械、設備問題嗎？ 2. 你想要突破半導體機台量產技術的極限，並持續挑戰未來科技的無限可能嗎？ 3. 〝儲備模組副工程師〝就是最適合你的位置，你將運用最先進的操作系統及AI人工智慧界面來進行設備維修、保養，與公司一起成長，共同突破機台的生產極限，成為推動半導體領域解決問題的工程專業人才！ 儲備模組副工程師職位，旨在培育未來的工程專業人才。您將參與至多十二個月的全面性訓練課程，當通過考核展現您的技術能力與問題解決能力後，您將正式成為模組副工程師。在訓練期間，您將接受全面性的技術課程與實務操作，並參加相關考核，包括技術測試及工作績效評估。若考核結果未完全符合要求，公司將提供額外指導與學習資源，並安排您進入績效改善計畫，協助您提升技能並發揮潛力。若最終未達成預期目標，公司將與您討論職涯規劃的下一步安排。 ※此職缺不適用於「2026預聘暨研發替代役」之計畫到職獎金 工作內容: 1. 負責半導體產品線機台設備維修及保養 2. 管理及改善機台零件系統、包含廠商與下包商之零件備品管理 3. 設計機台保養制具及流程改善以增進機台穩定性依公司需求公司需求需配合日、夜/假日班輪值(約每四週輪值一次大夜班，一次輪值六天)，實際安排將依工作需求及培訓進度調整 5. 加入台積電，您將享有: A. 挑戰百萬年薪: (1) 高競爭力的薪資水準及獎酬機制 (2) 夜班獎金：擔任儲備模組副工程師期間，若跟值夜班，將發放跟值獎金NT$4,500；正式成為模組副工程師後，每月獨立輪值大夜班一次(六天)，將發放大夜獎金NT$8,000。(上述獎金若大夜班未滿六天將依比率計算) (3) 分紅獎勵：每季依公司營運獲利分享業績獎金, 讓您1年、4季、12個月都能領取豐厚的薪資獎酬 B. 豐富寬廣的培訓發展，以及職涯升遷: (1) 專業訓練：全球最先進的中科訓練中心，十二吋廠儲備模組副工程師安排六周全職訓練課程 (2) 職涯升遷：垂直往上或水平轉換的職務機會，永不設限 C. 高規格的工作環境: (1) 美食饗宴：24小時提供多樣化異國美食 (2) 休假優給：給予優於勞基法之彈性休假及病假 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。

1.與內容授權部門共同規畫重點片單，同時與行銷團隊合作並規畫推廣重點，以提升用戶數 2.分析平台影音內容與用戶觀看行為，針對特定類別內容提出優化計畫 3.根據平台相關觀看指標，提出相關的收視提升計畫 【薪資待遇】月薪依能力與經歷核敘；若績效達平均水準者，年薪約77~95萬，績效優者年薪將更高。

1. 廣告投放與優化：操作廣告提升轉換與品牌曝光，並能有效運用GA4、GTM 等工具，追蹤成效、優化並提升廣告成長 2. 廣告策略制定：擬定受眾、並進行預算配置，與團隊確認每月目標，主動提出優化及改進方向 3. 素材與文案企劃：主導整體廣告素材文案並與設計團隊合作，產出具有吸引力的素材內容 4. 成效追蹤與數據分析：以數據為決策基礎，製作每日報表，並定期製作成效報告，分析及改善廣告成效 5. 跨單位協作：與不同類別PM進行溝通並合作推廣(例如，電影、戲劇、動漫) 【薪資待遇】月薪依能力與經歷核敘；若績效達平均水準者，年薪約77~95萬，績效優者年薪將更高。

橫跨 數位與實體行銷、品牌公關、P&L 營運管理，協助推動智慧家庭、電動車充電與儲能等新興業務，帶動產品成長與品牌影響力。 一、數位與實體行銷、品牌經營 •數位行銷：規劃與經營官網、Line@ 官方帳號，推動官網改版與後台優化。 •行銷策略與活動：與行銷（IMC）團隊合作，擬定整體行銷策略、執行整合行銷活動，含 CRM 發送規劃與用戶經營。 •品牌與視覺設計：視覺規劃/設計管理，維護一致品牌形象。 •會員經營與數據洞察：與數據團隊合作，進行用戶互動經營，數據分析，優化建議提案。 •公關與展會：規劃並執行品牌 PR 專案，包含智慧城市展、資訊月及其他產業展覽。 •永續與企業形象：支援 ESG / DJSI / EGDC 等相關計畫及品牌永續專案。　 二、營運支援 •預算與數據管理：協助年度/滾動式預算編列，定期追蹤與差異分析，提交成效報告。 •專案效益評估：對產品及行銷專案進行成本試算與 ROI 分析。 •跨部門協作：協助內外部單位（行銷、合作夥伴）進行資料整合與專案協調，確保營運流程順暢。 【薪資待遇】月薪依能力與經歷核敘；若績效達平均水準者，年薪約77~95萬，績效優者年薪將更高。

【工作內容】 1. 制度與流程管理：建立並優化內部制度與SOP，確保合規、降低風險 2. 營運監控：追蹤營收、用戶數、ARPU、退租率等KPI，進行分析並提出改善方案 3. 專案與跨部協調：推動新方案，整合跨部門資源，加速執行效率 4. 風控與稽核：檢核補貼、促案、異常流程，回報並配合稽核調查，確保合規 5. 系統與工具：協助提出IT需求，導入自動化、BI報表、CRM優化 6. 預算與資源：規劃並管控年度預算，合理配置行銷資源，評估效益 7. 業務支援：協助促案上市作業（文案、簡報、FAQ），提供決策支持 8. 銷售與電商：規劃行動產品銷售策略，經營電商平台提升業績 9. 提案與專案分析：獨立完成提案、追蹤績效並提出優化方案 【薪資待遇】月薪面議，依績效另有豐厚年終獎金與員工紅利。

1. 業務團隊負責主管 2. 行網／固網／SaaS服務等產品上市推廣作業及營運成本控制 3. 管理與制定團隊方針與月度／季度／年度目標 4. 帶領團隊進行業務推展與跨部門橫向溝通 【薪資待遇】月薪面議，依績效另有豐厚年終獎金與員工紅利

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=18545&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Overview of Role As a pivotal AI Engineer within our Corporate Planning Organization, you will leverage cutting-edge AI and engineering principles to transform complex business planning and operational challenges into robust, intelligent solutions. This unique opportunity places you at the intersection of business strategy, AI research, and robust system development, enabling you to deliver high-impact applications. We are actively building agentic AI solutions, integrating advanced LLM models with sophisticated software engineering and system design techniques. Your contributions will span the entire product lifecycle, from initial concept to production deployment, within a dynamic and collaborative environment. Responsibilities 1. Partner closely with business intelligence users and project managers to deeply understand the business challenges, translating them into actionable AI development roadmaps. 2. Research, evaluate, and integrate state-of-the-art AI and LLM algorithms and technical solutions to optimize performance and innovation. 3. Build both prototypes and high-quality products iteratively to deliver user-centric services. 4. Actively contribute to every stage of the product development lifecycle, from ideation and architectural design to deployment, monitoring, and continuous improvement. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=18671&source=1111 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2024年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等不同製程技術，為500多個客戶生產超過11,000種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 說明: 1. 負責廠務系統配管、佈線工程、現場施工、安全及品質管理。 2. 施工配管物料估算及領料、進料管理。 3. 焊接機具及施工工具操作、校正、維護與管理。 4. 執行廠務系統施工過程所需安全設施計畫、使用、維護、管理。 5. 薪資範圍: 高中/職畢業$33,800起，大學畢業$40,000以上，以實際施工經驗進行核算。 營造一個合乎台積公司核心價值與經營理念的全球共融職場，對於公司未來成功至關重要。台積公司對全球共融職場的承諾，旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向，都能將其自身的觀點與經驗帶入工作，促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融，讓每一位員工都覺得被重視且有能力為企業使命提供貢獻，並為全球各戶提供卓越服務。

【為什麼要加入台灣大哥大 IT 攻城精英團隊】 1.我們有穩定的福利制度，也有新創公司般的工作挑戰 2.我們致力打造一起學習、正向鼓勵回饋的工作環境 3.我們有體貼的居家上班制度 4.我們不是傳統的電信公司!正加速往區域級科技電信集團目標大步邁進 5.我們能讓你從「攻城師」升級為「攻城精英」，這裡絕對是個讓你可以升級武器、切磋技能、激發潛能的難得機會 6.我們還有一位跨領域身經百戰、兼具感性與知性、熱愛分享的超強 CIO 隊長！ 【我們喜歡什麼樣的人】 1.具備團隊合作精神的 team player 2.優異的溝通及表達能力 3.開創性思考的能力 4.極端正面的工作態度、積極進取 5.具備優異的技術專案規劃、統籌與實作能力 6.對新興技術展現優異的理解能力及應用思維 工作不是人生的全部，但是一份精彩的工作會豐富成就你更好的人生 請給自己也給我們一個機會，加入我們一同持續精進IT專業技術，改寫自己的人生與改寫世界，讓我們一起變得更好，歡迎登艦！ 【工作內容】 1.系統需求架構規劃、設計、開發。負責前後端技術整合，協助開發 Web API 與 RESTful API 服務。進行 SQL 資料庫查詢、效能調優與資料建模，優化數據存取效率。 2.善用 AI coding tools 加速開發並提升品質的經驗。 【必備技能】 1. 熟悉 C# / ASP.NET / NET Core 程式開發 2. 熟悉 API / Web API 架構設計 3. 熟悉 Entity Framework / Entity Framework Core 4. 熟悉 SQL 資料庫開發與設計 5. 孰悉網頁開發 (HTML5、CSS3、JavaScript) 【加分條件】 1. 有 CI / CD 使用經驗 2. 有 Dcoker 開發管理經驗 3. 有前端框架使用經驗，Angular 尤佳 4. 有 AI 工具使用經驗 【薪資待遇】面議，依績效另有豐厚年終獎金與員工紅利。

【為什麼要加入台灣大哥大 IT 攻城精英團隊】 1.我們有穩定的福利制度，也有新創公司般的工作挑戰 2.我們致力打造一起學習、正向鼓勵回饋的工作環境 3.我們有體貼的居家上班制度 4.我們不是傳統的電信公司!正加速往區域級科技電信集團目標大步邁進 5.我們能讓你從「攻城師」升級為「攻城精英」，這裡絕對是個讓你可以升級武器、切磋技能、激發潛能的難得機會 6.我們還有一位跨領域身經百戰、兼具感性與知性、熱愛分享的超強 CIO 隊長！ 【我們喜歡什麼樣的人】 1.具備團隊合作精神的 team player 2.優異的溝通及表達能力 3.開創性思考的能力 4.極端正面的工作態度、積極進取 5.具備優異的技術專案規劃、統籌與實作能力 6.對新興技術展現優異的理解能力及應用思維 工作不是人生的全部，但是一份精彩的工作會豐富成就你更好的人生 請給自己也給我們一個機會，加入我們一同持續精進IT專業技術，改寫自己的人生與改寫世界，讓我們一起變得更好，歡迎登艦！ 【工作內容】 1.系統需求架構規劃、設計、開發。負責前後端技術整合，協助開發 Web API 與 RESTful API 服務。進行 SQL 資料庫查詢、效能調優與資料建模，優化數據存取效率。 2.善用 AI coding tools 加速開發並提升品質的經驗。 【必備技能】 1. 熟悉 C# / ASP.NET / NET Core 程式開發 2. 熟悉 API / Web API 架構設計 3. 熟悉 Entity Framework / Entity Framework Core 4. 熟悉 SQL 資料庫開發與設計 5. 孰悉網頁開發 (HTML5、CSS3、JavaScript) 【加分條件】 1. 有 CI / CD 使用經驗 2. 有 Dcoker 開發管理經驗 3. 有前端框架使用經驗，Angular 尤佳 4. 有 AI 工具使用經驗 【薪資待遇】面議，依績效另有豐厚年終獎金與員工紅利。

【為什麼要加入台灣大哥大 IT 攻城精英團隊】 1.我們有穩定的福利制度，也有新創公司般的工作挑戰 2.我們致力打造一起學習、正向鼓勵回饋的工作環境 3.我們有體貼的居家上班制度 4.我們不是傳統的電信公司!正加速往區域級科技電信集團目標大步邁進 5.我們能讓你從「攻城師」升級為「攻城精英」，這裡絕對是個讓你可以升級武器、切磋技能、激發潛能的難得機會 6.我們還有一位跨領域身經百戰、兼具感性與知性、熱愛分享的超強 CIO 隊長！ 【我們喜歡什麼樣的人】 1.具備團隊合作精神的 team player 2.優異的溝通及表達能力 3.開創性思考的能力 4.極端正面的工作態度、積極進取 5.具備優異的技術專案規劃、統籌與實作能力 6.對新興技術展現優異的理解能力及應用思維 工作不是人生的全部，但是一份精彩的工作會豐富成就你更好的人生 請給自己也給我們一個機會，加入我們一同持續精進IT專業技術，改寫自己的人生與改寫世界，讓我們一起變得更好，歡迎登艦！ 【工作內容】 將參與以下專案的開發與維運，需熟悉Android或iOS ，及有 Flutter的開發經驗尤佳 1. AI 代理與生成式應用專案 2. EIM 企業通訊軟體 【必備技能】 1.熟悉Java和Kotlin語言, 挑戰快速開發 2.熟悉 版控、Firebase、Android Studio等開發工具，享受團隊合作樂趣 3.熟悉MVVM、MVP等Model, 彈性係數無敵 4.熟悉 Android Jetpack能輕鬆地編寫優質應用 5.熟悉Material Design設計UI經驗 6.擁有好的除錯技巧並具有良好的程式撰寫習慣 7.具備良好溝通能力，重視團隊合作, 最強隊友! 【加分條件】 1.具完整APP上架經驗 2.熟悉多執行緒處理 3.跨平台語言開發與研究 4.具備 CI/CD 、單元測試，自動化測試經驗尤佳 5.具備良好的開發習慣，產出有彈性且易維護的程式 6.喜歡研究與分享新技術 7.具備重構專案經驗 8.具備APP資安開發設計經驗尤佳 【薪資待遇】面議，依績效另有豐厚年終獎金與員工紅利