清大專區
AI處理器系統軟體工程師將負責MediaTek AI處理器的系統軟體和固件開發。主要職責包括: 1. 開發和優化 AI 處理器的驅動程式, 以提升系統性能. 2. 進行硬體 IP 裝置驗證, 確保AI引擎功能正常. 3. 建立 middleware 軟體, 最大化多核心 AI 處理器利用率.
1. 支援客戶產品的開發 2. LCD Monitor 或Retimer FW的開發與應用 3. 協助產品的推廣 4. LCD Monitor UI 的設計 以及訊號的處理
• 執行5G/B5G基帶算法設計,包括(但不限於)波束成形機制、校準方法、射頻暴露控制等。 • 進行機器學習/人工智慧算法研究,尋找系統性能優化的潛在應用。 • 能夠在申請技術經理職位時指導初級工程師。 • 能夠協調多地點運營並參加跨時區會議(優先考慮)。
1. Wired or wireless communication system transceiver architecture or algorithm design. 2. RF/Analog front end & baseband system spec definition 3. Channel and impairment modeling 4. Baseband algorithm development 5. System performance verification
1.PCB 電路及layout 的設計及驗證 2. 客戶端平台之開發驗證
1. LCD Monitor IC相關的韌體開發 2. 影像處理相關應用與支援客戶產品開發 3. LCD Monitor周邊軟體tool開發
1. HW platform系統電路設計及系統應用 2. PMIC or PCIe or USB 系統電路設計 3. SoC參考電路設計及驗證 4. 協助客戶量產過程時提供技術支援
作為客製化IC軟體工程師,您將負責產品系統單晶片(SoC)上 Linux Kernel/Zephyr 作業系統的開發與優化。此職位需針對Kernel相關系統軟體及開機流程進行開發、優化或改良,以提供最佳系統效能。 主要職責包括: 1. 將最新的 Linux Kernel 移植至 SoC 上開機。 2. 解決系統問題,優化 Linux Kernel 以提升效能。 3. 熟悉 Linux 或開源軟體(如Zephyr)及其開發環境。 4. 熟悉 GCC 及相關 toolchain 工具。 5. 建立跨平台開發環境。 6. 開發及修改 Kernel 驅動程式與 boot loader。
1. Modem and AP SOC product planning, market analysis and technical feasibility evaluation. 2. Product go to market planning, product marketing. 3. Business engagement and project execution with Worldwide tier-one customers.
1. Identify and analyze critical market and technology trends to conduct MediaTek multimedia SoC product planning. 2. Drive customer and 3rd party engagement, strategize, and implement product technology strategies, including vendor and ecosystem planning.
1. Work on 3~7nm design implementation, methodology, and sign-off 2. Perform synthesis, DFT, floorplan, clock planning, place and route, timing closure, ECO, IR signoff, and physical verification 3. Manage schedule, resolve design and flow issues, drive methodologies and execution
Do you want to be part of a smart and passionate team of researchers, advancing artificial intelligence to the next level of end-user experience in their daily lives? MediaTek is seeking driven and brilliant young students to join our efforts by providing Internship placements. We are currently working to expand the frontiers of Deep Learning frameworks for Computer Vision and Natural Language Processing and we hope you can join us! The ideal candidate is open-minded, passionate about learning theory, and looks forward to both practical and challenging problems. • You will be working towards or recently have completed a PhD in a quantitative field such as Computer Science, Mathematics, Physics or Engineering. • You have a good knowledge of the foundations of Deep Learning and Neural Networks, including some experience with Machine Learning frameworks (Tensorflow, PyTorch, JAX) • You are a proficient scientific communicator. You are committed to your goals and working in a team. • You are eager to tackle the state of the art problems in the field. We want your ideas to shine! As a Deep Learning Researcher in our team, you will collaborate with our Researchers and with worldwide colleagues, stay up and above the state of the art, initiate with novel ideas, and develop them into algorithms and applications that make the real difference in everyday devices. You will also push your contribution by publishing at top-tier conferences, such as NeurIPS, ICML, ICLR, CVPR, ACL, ICRA, ACM.
1. Smart phone系統low speed (SPI/SPMI/I2C/I3C/…)和SerDes (CSI)驗証 2. 系統驗証方法研究與開發 3. 規畫驗証計畫 (test plan, test case) 4. 自動化測試環境開發
1. Package related structure stress analysis including warpage, material study. 2. Package and board level stress modeling for TCT, drop and vibration. 3. IC and package thermal analysis, modeling and characterization 4. Chip-Package-PCB thermal co-simulation and design. 5. System level thermal simulation 6. System level stress simulation
Requirements Elicitation, Requirements Analysis, and Architectural Design - Analyze product requirements from customer - Discuss the expectations and requests with customer - Agree or reject the requirements - Make architectural design proposals
* 資深SI/PI工程師 * 封裝/電路板 SI/PI設計與晶片開發於消費型產品, 車用以及企業級高效運算產品 * 記憶體以及高速Serdes SI/PI設計 * 高效能CPU/GPU/APU PI以及PDN設計 * 建立封裝/電路板的高速序號設計準則, PDN電氣規格, 以利產品進行
1.CP/FT/SLT testing flow development 2.負責CP/FT/SLT/Burn-in 測試配件開發與驗證
1. Design and RTL implementation of SoC debug modules 2. Integration and verification of debug components (e.g., trace, monitor, access port) 3. Debug signal capture, trace, and analysis for SoC platforms 4. Support SoC debug flow and issue localization 5. Collaborate with cross-functional teams to optimize debug performance 6. Documentation and test specification for SoC debug features 7. Location: Taipei/Hsinchu
In a flexible and supportive environment, one of your major responsibilities is to push the state of the art of learning theory, to obtain insights beyond mythical theories as well as to apply the right solution to novel application areas such as AI-designed IC and General Intelligence Conversation. Furthermore, you shall actively engage with worldwide colleagues and academics to nurture and build a collaborative and effective R&D environment. We welcome all ML/DL backgrounds, including computer vision, speech and NLP, and robotics.
• 負責高速SerDes的開發,包括韌體設計與演算法實現、IC功能驗證、系統效能優化以及客戶支援(熟悉架構、韌體、除錯、優化及測試相關工作) • 開發自動化驗證(使用C++、Python、C#和MATLAB) • 與類比/數位團隊合作,從原型設計到量產共同開發晶片 •協助客戶設計導入並支援量產