清大專區

• 新產品導入量產 (IC 封裝部分) • 良率持續改善 • 解決製程異常, 工程問題 • 技術開發與製程改善

Develop advanced package technologies for MediaTek‘s HPC business

1. ISP driver design and development 2. Optimize camera performance KPI - MIPS/CPU loading, Memory footprint, latency, power and bandwidth 3. ISP emulation (pre-silicon) & verification (post-silicon)

1. 高速信號介面及系統電源應用規劃整合、除錯等手機系統應用. 2. Baseband系統驗證方法開發、電源規格訂定及驗證規劃 3. 客戶參考設計文件訂定及量產相關技術支援.

Role Overview: Join the Tier-1 PC OEM team as a key driver of revenue growth and market expansion. You will not only manage long-term relationships with Tier-1 PC OEMs but also act as a demand creator, securing strategic design wins and ensuring MediaTek solutions are integrated into next-generation products. Key Responsibilities: • Drive Design Wins: Act as a proactive demand creator to secure strategic design wins and RFQs. Lead the design-in and RFQ process by engaging customers early in their development cycle and ensuring adoption of MediaTek solutions. • Account Management & Growth: Manage and prospect long-term business relationships with Tier-1 PC OEMs to achieve and exceed revenue goals. • Data Analysis & Executive Reporting: Analyze sales performance, pipeline metrics, and market data to create high-quality reports. Prepare and present regular business reviews and strategic insights for internal leadership. • CRM & Pipeline Management: Maintain accurate and up-to-date records in Salesforce. Ensure rigorous management of opportunities, account details, and forecast data to provide clear visibility into the sales pipeline. • Sales Operations Execution: Facilitate customer forecasting and oversee end-to-end sales operations, including communications with ODM, supply chain and hub service counterparts, shipment notifications, execution planning, rebate and legal documentation, and RMA processes. • Market Intelligence: Actively monitor customer growth, market movements, and trends within the PC/NB industries. Gain solid understanding of competitor activities and benchmarking to refine sales strategies. • Product Advocacy: Influence customers and internal stakeholders by clearly articulating the differentiation and value proposition of MediaTek-based products. • Cross-Functional Collaboration: Serve as the primary liaison between external partners and internal cross-functional teams to ensure seamless delivery and customer satisfaction.

此(資深)職缺需以軟體/韌體設計的角度，進行聯發科技無線通訊網路相關IC設計方案的韌體白盒測試，包含WiFi、Bluetooth相關的功能。 需要負責與MAC、PHY、System、SW 等工程團隊合作，進行韌體白盒測試的開發、建置，與問題的除錯分析。 需要設計與開發不同的韌體測試方法，包含自動化測試的開發與建置，並且不斷的精進改善，以期軟韌體的品質能夠符合內部開發及外部客戶的要求。

(請留意：為加快面試安排時間，僅限定投遞5個職缺)我們在找這樣的你：對行動通訊、無線及寛頻連結、家庭娛樂晶片解決方案有濃厚興趣；勇於表達意見，以團隊成功為目標，面對困難不輕易放棄，總是在想更好的做法，擁有創新及不斷學習的精神。聯發科技邀請您，與全球最頂尖的菁英一同合作，彼此激盪最新的創意與解法，共同挑戰每一個不可能。

1.自動化5G環境模擬工具開發 2.protocol 或 效能問題的分析與模擬系統設計 3. 5G system 系統驗證 與modem效能benchmark 與 系統穩定性監控 4.對 IOT/field test and protocol debug 有相關經驗尤佳

1. ARM Mali GPU 性能, 功耗優化與穩定性相關問題解決 2. Linux kernel driver and microprocessor firmware 開發, spec reading. 3. Android系統, 圖形知識, 及相關的driver 程式開發

1. 開發系統模型與功耗、效能及散熱 (PPT) 估算方法論，以引導嵌入式軟體堆疊的架構設計與實作。 2. 與 IP 及系統設計團隊合作，優化行動裝置與高效能運算平台的系統效能及使用者體驗。 3. 分析並調校電源/散熱管理策略與軟體行為，專注於高負載場景及業界標準跑分 (Benchmarks) 的優化。

1. 與外部IP/EDA合作夥伴、內部技術、業務及法務團隊合作，執行商務操作及合約流程。 2. 協調執行與IP/EDA廠商合作之策略性任務，包括高層會議、關鍵技術會議及年度活動等。 3. 彙整財務報表。

我們正在尋找高速傳輸介面專家, 尤其擁有 USB 和 PCIe 技術的專業知識。 理想的候選人應具有豐富的開發和優化 Windows 和 Linux 操作系統驅動程式的經驗。 此職位需要與硬體和軟體團隊密切合作，以確保高速介面的無縫整合和性能。

Design the 5G and next-generation modem processor with cost effective, high speed, and low power hardware performance. This position will develop the modem processor that optimized for modem system. Co-work closely with software and system architecture colleague to analysis the sweet point of system performance and low power. In this position, you will push the physical performance to next level and co-work with place-and-route (PAR) team resolving the bottleneck of speed and power.

1. 高速類比電路設計 2. 類比設計以及自動化流程開發顧問

(請留意：為加快面試安排時間，僅限定投遞5個職缺)我們在找這樣的你：對行動通訊、無線及寛頻連結、家庭娛樂晶片解決方案有濃厚興趣；勇於表達意見，以團隊成功為目標，面對困難不輕易放棄，總是在想更好的做法，擁有創新及不斷學習的精神。聯發科技邀請您，與全球最頂尖的菁英一同合作，彼此激盪最新的創意與解法，共同挑戰每一個不可能。

1. 系統應用電源需求與控制架構分析 2. 電源管理晶片規格制定與驗證 3. 類比電路開發與驗證 4. 驗證電路板設計 5. 自動化測試開發

IC 產品發展, 產品量產管理與良率改善, 除錯與問題的解決

1. 設計 5G/B5G 和新一代多模通訊協定架構，開發具有超高數據速率、低延遲和出色用戶體驗的通訊協定軟體，以廣泛運用在手機、人工智慧物聯網和車用系統上。 2. 與全球領先網路設備商（如：華為、中興、愛立信、諾基亞）進行互操作開發測試，以早期達成產品相容性目標。 3. 開發領先全球的網路運營商功能，與世界頂尖客戶合作，實現新一代出色的移動通訊產品。

1. Model development (includes behavior modeling/ cycle approximate modeling/ power modeling) 2. ESL platform and simulation technology development. 3. Next-generation processor architecure prototyping and design exploration 4. Next-generation modem platform architecure prototyping and design exploration

1. 開發emulation/prototyping 相關的技術及使用流程 2. 建立CPU/GPU emulation/prototyping 驗證平台 3. 協助project team導入emulation/prototyping 技術 4. emulation/prototyping 使用及工具問題的支持 5. 管理 emulator 及prototyping 硬體與使用分配