清大專區

1. 無線通訊系統韌體開發 2. 無線通訊系統驅動程式開發 3. 無線通訊系統軟體穩定性 4. 無線通訊晶片驗證

1. WiFi/BT/GPS/FM connectivity IC驗證及系統應用 2. PMIC or PCIe 系統設計及驗證 3. Connectivity 系統性能優化及驗證 4. Connectivity參考電路設計及驗證 5. 協助客戶量產過程時提供技術支援

Android平台相關軟體問題，SCM, Code line管理等...主要客戶聯絡窗口。 分析、釐清並解決或轉交客戶回報的系統層級問題。 進行問題根因分析，並提供即時解決方案或替代方案。 與內部工程團隊協作，確保問題有效解決 進行Android系統的性能分析與優化。 支援Android平台的整合，包括問題排查、除錯與驗證。 撰寫問題分析、解決方案及實踐文件，供內外部參考。 與國內外客戶（包含美國）有效溝通，了解需求並提供技術支持。 參與客戶會議、技術討論及專案檢討等相關活動。

AI處理器系統軟體工程師將負責MediaTek AI處理器的系統軟體和固件開發。主要職責包括: 1. 開發和優化 AI 處理器的驅動程式, 以提升系統性能. 2. 進行硬體 IP 裝置驗證, 確保AI引擎功能正常. 3. 建立 middleware 軟體, 最大化多核心 AI 處理器利用率.

1. 支援客戶產品的開發 2. LCD Monitor 或Retimer FW的開發與應用 3. 協助產品的推廣 4. LCD Monitor UI 的設計 以及訊號的處理

• 執行5G/B5G基帶算法設計，包括(但不限於)波束成形機制、校準方法、射頻暴露控制等。 • 進行機器學習/人工智慧算法研究，尋找系統性能優化的潛在應用。 • 能夠在申請技術經理職位時指導初級工程師。 • 能夠協調多地點運營並參加跨時區會議(優先考慮)。

1. Wired or wireless communication system transceiver architecture or algorithm design. 2. RF/Analog front end & baseband system spec definition 3. Channel and impairment modeling 4. Baseband algorithm development 5. System performance verification

1.PCB 電路及layout 的設計及驗證 2. 客戶端平台之開發驗證

1. LCD Monitor IC相關的韌體開發 2. 影像處理相關應用與支援客戶產品開發 3. LCD Monitor周邊軟體tool開發

1. HW platform系統電路設計及系統應用 2. PMIC or PCIe or USB 系統電路設計 3. SoC參考電路設計及驗證 4. 協助客戶量產過程時提供技術支援

作為客製化IC軟體工程師，您將負責產品系統單晶片(SoC)上 Linux Kernel/Zephyr 作業系統的開發與優化。此職位需針對Kernel相關系統軟體及開機流程進行開發、優化或改良，以提供最佳系統效能。 主要職責包括： 1. 將最新的 Linux Kernel 移植至 SoC 上開機。 2. 解決系統問題，優化 Linux Kernel 以提升效能。 3. 熟悉 Linux 或開源軟體(如Zephyr)及其開發環境。 4. 熟悉 GCC 及相關 toolchain 工具。 5. 建立跨平台開發環境。 6. 開發及修改 Kernel 驅動程式與 boot loader。

1. Modem and AP SOC product planning, market analysis and technical feasibility evaluation. 2. Product go to market planning, product marketing. 3. Business engagement and project execution with Worldwide tier-one customers.

1. Identify and analyze critical market and technology trends to conduct MediaTek multimedia SoC product planning. 2. Drive customer and 3rd party engagement, strategize, and implement product technology strategies, including vendor and ecosystem planning.

1. Work on 3~7nm design implementation, methodology, and sign-off 2. Perform synthesis, DFT, floorplan, clock planning, place and route, timing closure, ECO, IR signoff, and physical verification 3. Manage schedule, resolve design and flow issues, drive methodologies and execution

Do you want to be part of a smart and passionate team of researchers, advancing artificial intelligence to the next level of end-user experience in their daily lives? MediaTek is seeking driven and brilliant young students to join our efforts by providing Internship placements. We are currently working to expand the frontiers of Deep Learning frameworks for Computer Vision and Natural Language Processing and we hope you can join us! The ideal candidate is open-minded, passionate about learning theory, and looks forward to both practical and challenging problems. • You will be working towards or recently have completed a PhD in a quantitative field such as Computer Science, Mathematics, Physics or Engineering. • You have a good knowledge of the foundations of Deep Learning and Neural Networks, including some experience with Machine Learning frameworks (Tensorflow, PyTorch, JAX) • You are a proficient scientific communicator. You are committed to your goals and working in a team. • You are eager to tackle the state of the art problems in the field. We want your ideas to shine! As a Deep Learning Researcher in our team, you will collaborate with our Researchers and with worldwide colleagues, stay up and above the state of the art, initiate with novel ideas, and develop them into algorithms and applications that make the real difference in everyday devices. You will also push your contribution by publishing at top-tier conferences, such as NeurIPS, ICML, ICLR, CVPR, ACL, ICRA, ACM.

1. Smart phone系統low speed (SPI/SPMI/I2C/I3C/…)和SerDes (CSI)驗証 2. 系統驗証方法研究與開發 3. 規畫驗証計畫 (test plan, test case) 4. 自動化測試環境開發

1. Package related structure stress analysis including warpage, material study. 2. Package and board level stress modeling for TCT, drop and vibration. 3. IC and package thermal analysis, modeling and characterization 4. Chip-Package-PCB thermal co-simulation and design. 5. System level thermal simulation 6. System level stress simulation

Requirements Elicitation, Requirements Analysis, and Architectural Design - Analyze product requirements from customer - Discuss the expectations and requests with customer - Agree or reject the requirements - Make architectural design proposals

* 資深SI/PI工程師 * 封裝/電路板 SI/PI設計與晶片開發於消費型產品, 車用以及企業級高效運算產品 * 記憶體以及高速Serdes SI/PI設計 * 高效能CPU/GPU/APU PI以及PDN設計 * 建立封裝/電路板的高速序號設計準則, PDN電氣規格, 以利產品進行

1.CP/FT/SLT testing flow development 2.負責CP/FT/SLT/Burn-in 測試配件開發與驗證