清大專區

* 資深SI/PI工程師 * 封裝/電路板 SI/PI設計與晶片開發於消費型產品, 車用以及企業級高效運算產品 * 記憶體以及高速Serdes SI/PI設計 * 高效能CPU/GPU/APU PI以及PDN設計 * 建立封裝/電路板的高速序號設計準則, PDN電氣規格, 以利產品進行

1.CP/FT/SLT testing flow development 2.負責CP/FT/SLT/Burn-in 測試配件開發與驗證

1. Design and RTL implementation of SoC debug modules 2. Integration and verification of debug components (e.g., trace, monitor, access port) 3. Debug signal capture, trace, and analysis for SoC platforms 4. Support SoC debug flow and issue localization 5. Collaborate with cross-functional teams to optimize debug performance 6. Documentation and test specification for SoC debug features 7. Location: Taipei/Hsinchu

In a flexible and supportive environment, one of your major responsibilities is to push the state of the art of learning theory, to obtain insights beyond mythical theories as well as to apply the right solution to novel application areas such as AI-designed IC and General Intelligence Conversation. Furthermore, you shall actively engage with worldwide colleagues and academics to nurture and build a collaborative and effective R&D environment. We welcome all ML/DL backgrounds, including computer vision, speech and NLP, and robotics.

• 負責高速SerDes的開發，包括韌體設計與演算法實現、IC功能驗證、系統效能優化以及客戶支援（熟悉架構、韌體、除錯、優化及測試相關工作） • 開發自動化驗證（使用C++、Python、C#和MATLAB） • 與類比/數位團隊合作，從原型設計到量產共同開發晶片 •協助客戶設計導入並支援量產

• 新產品導入量產 (IC 封裝部分) • 良率持續改善 • 解決製程異常, 工程問題 • 技術開發與製程改善

Develop advanced package technologies for MediaTek‘s HPC business

1. ISP driver design and development 2. Optimize camera performance KPI - MIPS/CPU loading, Memory footprint, latency, power and bandwidth 3. ISP emulation (pre-silicon) & verification (post-silicon)

1. 高速信號介面及系統電源應用規劃整合、除錯等手機系統應用. 2. Baseband系統驗證方法開發、電源規格訂定及驗證規劃 3. 客戶參考設計文件訂定及量產相關技術支援.

Role Overview: Join the Tier-1 PC OEM team as a key driver of revenue growth and market expansion. You will not only manage long-term relationships with Tier-1 PC OEMs but also act as a demand creator, securing strategic design wins and ensuring MediaTek solutions are integrated into next-generation products. Key Responsibilities: • Drive Design Wins: Act as a proactive demand creator to secure strategic design wins and RFQs. Lead the design-in and RFQ process by engaging customers early in their development cycle and ensuring adoption of MediaTek solutions. • Account Management & Growth: Manage and prospect long-term business relationships with Tier-1 PC OEMs to achieve and exceed revenue goals. • Data Analysis & Executive Reporting: Analyze sales performance, pipeline metrics, and market data to create high-quality reports. Prepare and present regular business reviews and strategic insights for internal leadership. • CRM & Pipeline Management: Maintain accurate and up-to-date records in Salesforce. Ensure rigorous management of opportunities, account details, and forecast data to provide clear visibility into the sales pipeline. • Sales Operations Execution: Facilitate customer forecasting and oversee end-to-end sales operations, including communications with ODM, supply chain and hub service counterparts, shipment notifications, execution planning, rebate and legal documentation, and RMA processes. • Market Intelligence: Actively monitor customer growth, market movements, and trends within the PC/NB industries. Gain solid understanding of competitor activities and benchmarking to refine sales strategies. • Product Advocacy: Influence customers and internal stakeholders by clearly articulating the differentiation and value proposition of MediaTek-based products. • Cross-Functional Collaboration: Serve as the primary liaison between external partners and internal cross-functional teams to ensure seamless delivery and customer satisfaction.

此(資深)職缺需以軟體/韌體設計的角度，進行聯發科技無線通訊網路相關IC設計方案的韌體白盒測試，包含WiFi、Bluetooth相關的功能。 需要負責與MAC、PHY、System、SW 等工程團隊合作，進行韌體白盒測試的開發、建置，與問題的除錯分析。 需要設計與開發不同的韌體測試方法，包含自動化測試的開發與建置，並且不斷的精進改善，以期軟韌體的品質能夠符合內部開發及外部客戶的要求。

(請留意：為加快面試安排時間，僅限定投遞5個職缺)我們在找這樣的你：對行動通訊、無線及寛頻連結、家庭娛樂晶片解決方案有濃厚興趣；勇於表達意見，以團隊成功為目標，面對困難不輕易放棄，總是在想更好的做法，擁有創新及不斷學習的精神。聯發科技邀請您，與全球最頂尖的菁英一同合作，彼此激盪最新的創意與解法，共同挑戰每一個不可能。

1.自動化5G環境模擬工具開發 2.protocol 或 效能問題的分析與模擬系統設計 3. 5G system 系統驗證 與modem效能benchmark 與 系統穩定性監控 4.對 IOT/field test and protocol debug 有相關經驗尤佳

1) 訂定通訊系統使用的CPU及系統架構 2) 開發RTOS、記憶體管理等系統相關服務 3) 開發CPU及平台模擬器 4) 分析軟體行為並增進系統效能 5) 開發CPU及系統相關的驅動及開機流程 6) 開發自動診斷系統問題的工具

1. ARM Mali GPU 性能, 功耗優化與穩定性相關問題解決 2. Linux kernel driver and microprocessor firmware 開發, spec reading. 3. Android系統, 圖形知識, 及相關的driver 程式開發

1. 開發系統模型與功耗、效能及散熱 (PPT) 估算方法論，以引導嵌入式軟體堆疊的架構設計與實作。 2. 與 IP 及系統設計團隊合作，優化行動裝置與高效能運算平台的系統效能及使用者體驗。 3. 分析並調校電源/散熱管理策略與軟體行為，專注於高負載場景及業界標準跑分 (Benchmarks) 的優化。

1. 與外部IP/EDA合作夥伴、內部技術、業務及法務團隊合作，執行商務操作及合約流程。 2. 協調執行與IP/EDA廠商合作之策略性任務，包括高層會議、關鍵技術會議及年度活動等。 3. 彙整財務報表。

我們正在尋找高速傳輸介面專家, 尤其擁有 USB 和 PCIe 技術的專業知識。 理想的候選人應具有豐富的開發和優化 Windows 和 Linux 操作系統驅動程式的經驗。 此職位需要與硬體和軟體團隊密切合作，以確保高速介面的無縫整合和性能。

Design the 5G and next-generation modem processor with cost effective, high speed, and low power hardware performance. This position will develop the modem processor that optimized for modem system. Co-work closely with software and system architecture colleague to analysis the sweet point of system performance and low power. In this position, you will push the physical performance to next level and co-work with place-and-route (PAR) team resolving the bottleneck of speed and power.

1. 高速類比電路設計 2. 類比設計以及自動化流程開發顧問