研發替代役

1.內部控制程序了解、確認及建立 2.內部稽核計劃擬定及執行 3.稽核專案的規範及執行 4.子公司稽核報告及相關業務審查及督導 5.相關稽核業務的擴展及推行

英語專任教師 1.負責教學活動規劃與執行。 2.訂定教學目標、課程範圍、授課內容。 3.準備課程教材、課程資料以及課後作業、落後加強等。 4.依據教學目標授課，並評估學生學習狀況以調整授課進度。 5.批改作業及測驗輔導 ★★歡迎所有求職者及應屆畢業生加入★★ ☆☆相關科系畢佳☆☆

1.進行例行性售後服務（如：客戶拜訪、產品狀況了解及客訴處理）。 2.建立售後服務制度。 3.回覆客戶應用技術的問題，提供產品技術諮詢。 4.提供客戶技術服務，必要時外勤至客戶處安裝、檢修儀器設備。 5.接聽客戶電話，回應並處理產品客訴抱怨。 6.曾任職機械設備廠經驗佳。 7.熟PLC (三菱，基恩斯) 7.具備英文能力尤佳

開刀房相關業務

上下腹部超音波檢查、甲狀腺超音波檢查、頸動脈超音波檢查、乳房超音波檢查、

1.倉庫物品、物料進出管理品、確認品質，與請購單、發票及其他憑證是否相符 2.定期清點物料，並將物料標示並放於正確位置 3. 主管交辦事項

1.Identify and target potential customers for server solutions. 2.Analyze competitors and understand their offerings to better position our products. 3.Prepare and deliver sales presentations tailored to the client‘s needs. 4.Manage sales projects, including coordinating with cross-functional teams to deliver products and solutions that comply with client requirements. 5.Prepare regular reports on sales performance, market feedback, and customer needs. 6.Develop and implement strategic sales plans to achieve sales targets.

1. Mechanical Design 2. Project Management 3. Issue Analysis and Solution Capability 4. Cross Function Communication

1. 研發、設計server及storage等系統散熱。 2. 熟悉各類散熱器及散熱產品之應用。 3. 依系統所需，制定散熱器之規格。 4. 開發新的散熱技術。 5. 進行熱傳分析及溫度量測。 內湖廠：台北市內湖區瑞光路581號 平鎮廠：桃園市平鎮區南東路8號

1. NB主機板之電路設計、掌控線路及layout 2. 訊號量測及異常分析、排除 3. 線路圖檢查與問題修正 4. 協助工廠提升產品良率 ※依學經歷、工作年資敘薪

•Component mean MOSFET、Dr.MOS、DC-DC IC Controller、Inductor and Capacitor. 1.Develop component level spec、test conditions and criteria. 2.Review component datasheet、spec and reliability report. 3.Enhance component quality with supplier. 4.Survey new material. •This includes new technology assessment, creation of technology roadmaps, specification development, and application engineering knowledge for both surface mounted and through hole components. • Additional duties include evaluating product performance and reliability test data as part of the component/supplier approval process for both new and existing components • Work with design engineers, procurement and suppliers to determine component requirements and drive component selection and second source identification. • Understand supplier and/or design requested changes to components and drive these changes through the formal component release and control procedures. • Work with design engineers on the resolution of component related issues, such as timing, design margining. • Analyze and evaluate component specifications to determine suitable alternate sources when required. This will occur for both development and sustaining products. Work with the design team, cross functional team and suppliers to ensure that components selected meet the requirements for feature set, functionality, cost, reliability, regulatory compliance, and industry standards compliance. • Ensure components selected meet manufacturability, reliability and testability goals ※依學經歷、工作年資敘薪

1.系統散熱與噪音設計(System Thermal and Acoustic Design) 2.專案在散熱部分的執行(Project execution on thermal related portion) 3.散熱驗證(Thermal validation) 4.開發新技術(Develop new thermal technology) ※依學經歷、工作年資敘薪

1.5G RF circuit/layout design implement 2.5G RF system architecture evaluation, RF related calibration calculation evaluation 3.5G RF overall system performance verification and process analysis 4.Overall RF certification debugging and solution 5.LTE/WCDMA/WiFi/BT/NFC performance tuning, measurement and debugging 6.Desense debugging and solution 7.Product production on site support 8.Related BOM&Document preparation

1.從事PC產品軟/韌體程式開發及問題解決、除錯、維護。 2.BIOS應用規格及流程撰寫。 3.C語言程式設計及作業系統及周邊設備控制。 4.對x86,ARM相關先進技術的軟體開發。 ※依學經歷、工作年資敘薪

1. 執行專案負責產品開發 2. 負責NB/PAD等產品RF設計、性能驗證與相關問題排除 3. 協助工廠 RD排除產線RF問題 4. 確保產品品質符合客戶規範要求 ※依學經歷、工作年資敘薪

1.System Software Issue Analysis 2.BIOS and Driver Evaluation Test 3.WHQL Certification 4.Driver and Application Management. 5. New Technology Survey and Research. ※依學經歷、工作年資敘薪

1.NB主機板之電源設計、掌控線路及layout 2.電源訊號量測及異常分析、排除 3.線路圖檢查與問題修正 4.協助工廠提升產品良率 ※依學經歷、工作年資敘薪

1.針對NB/PC產品進行前期熱模組細部設計與評估 2.NB熱模組測試規劃，提供實驗數據結果 3.進行issue debug以確保產品品質 4.執行研發階段驗證產品功能,以確保產品功能之完整性 ※依學經歷、工作年資敘薪

1. 負責軟體之分析、設計以及程式撰寫 2. 規劃執行軟體架構及模組之設計，並控管軟體設計進度　 3. 開發與維護 Notebook EC 程式碼 4. 工作內容需要與BIOS, 硬體, 電源工程師充分合作 ※依學經歷、工作年資敘薪