越南留學生討論區

工作項目： 1. CPU & GPU Backend Implementation (APR) 2. CPU/GPU Backend Flow Development, Enhancement & Automation 3. Advanced CPU/GPU Technology Development: High-performance, Low Power, and PPA Optimization 應徵條件： 1. 碩士以上；電機、資工、電子相關科系畢業為主。 2. 熟悉 APR Tools (Innovus、ICC2、Fusion Compiler…)，有Synthesis、STA/IR Analysis、Physical Verification等相關經驗者佳。 3. 具備程式設計能力，熟悉 TCL/Perl/C++/Python。 4. 有 High Performance CPU/GPU APR經驗尤佳。 5. 個性積極負責、勇於迎接新挑戰，對於 High-Performance CPU/GPU Technology 有興趣者。

工作項目： 1. High-Performance CPU/GPU Timing & Power Integrity Signoff 2. High-Performance CPU/GPU Post-Silicon Validation & Debug, Sim-to-Silicon Correlation 3. 協同開發 CPU/GPU Advanced DFT, On-Chip PVT Sensor, Performance Improvement & Power Management 等先進技術 4. 支援產品 SoC Projects，協同執行 High-Performance CPU/GPU 專案開發，導入先進 IP 及技術 應徵條件： 1. 碩士以上；電機、資工、電子相關科系畢業為主。 2. 熟悉 SoC Integration & Design Flow、Frontend/Backend/DFT/Timing/IR Drop/Power Analysis EDA Tools。 3. 有 ARM Cortex-A CPU/Subsystem Design/Integration/PPA Optimization/Sign-off 經驗尤佳。 4. 有 Chip-Level, Package & PCB Power Integrity Optimization 經驗尤佳。 5. 有On-Chip PVT Sensor 開發經驗尤佳。 6. 有Post-Silicon Validation, Debug 及 RMA 分析經驗尤佳。 7. 積極負責、溝通協調能力強、勇於迎接挑戰，對於 High-Performance CPU/GPU Technology 有興趣者。

工作項目： SOC/IP(DDR/eMMC/SD card/Nand)驗證. 應徵條件： 1. 學士以上; 電機工程、電信工程、電子工程相關科系畢業為主。 2. 具 SOC/IP(DDR/eMMC/SD card/Nand)驗證相關經驗者為佳。

工作項目： 1. 開發FTL與客戶客製化需求。 2. 支援新NAND開發。 3. 支援客戶量產問題。 應徵條件： 1. 碩士以上; 電機工程、電子工程、資訊工程相關科系畢業為主。

工作項目： 1. SOC integrator! A challenging job for integrating the designs from over 100 digital designers and tens of analog designers. A challenging job of using deep submicron process. 2. Building & Improving the standard environment for digital designers to run front-end flow, such as synthesis, STA analysis, linting, and so on. 3. Cooperating with APR designers for backend timing closure. 4. Block / Whole-Chip CTS (Clock-tree Synthesis) analysis and improvement. 應徵條件： 1. 碩士以上; 電機工程、電信工程、電控工程、電子工程、資訊工程、資訊科學、動力機械、自動控制、通訊工程等相關科系畢業為主。 2. 熟悉 verilog, verdi, STA, synthesis. 3. 具 CTS(Clock tree synthesis) Design/Debug經驗者尤佳。 4. 會寫 script如 perl者更佳。 5. 具六年以上相關工作經驗。

工作項目： 1. Finding solutions for creative applications. 2. RTL coding for function implementation, including simulation. 3. Discuss function spec with system designer 4. Architecture planning for circuit design. 5. Completing front-end design flows, such as synthesis, linting, asynchronous checking, STA and so on. 應徵條件： 1. 碩士以上; 電機工程、電信工程、電控工程、電子工程、資訊工程、資訊科學、動力機械、自動控制、通訊工程等相關科系畢業為主。 2. 經驗不拘，具二年以上相關工作經驗者尤佳。 3. 對所有視覺相關產品有熱情、有想法。 4. 熟悉以下 HDL/Tool(愈多項或單項愈熟尤佳)： verilog, verdi, LEC, linting, perl, synthesis, static timing analysis, Clock tree architecture. 5. 對以下領域有了解更佳(不必全部)： 5.1 Video codec(AVS3, AV2, VP9, HEVC, H.264, and etc.) 5.2 High speed interface, such as HDMI, DDR, USB, and so on. 5.3 Image/Video processing. 5.4 CPU, GPU, and NPU.

工作項目： Maintain並開發 SD Card相關 IP design. 應徵條件： 1. 熟悉 SD Card、UHS1、UHS2相關 Spec. 2. 具 SD Card UHS1與 UHS2 IP設計開發經驗。 3. 具 UHS2 PHY/MAC或 USB3/PCIe PHY/MAC之IP整合經驗。 4. 具備 SoC晶片整合能力。

工作項目： 1. Maintain並開發 USB3、USB4與 PCIe之 DPHY/MAC相關 design. 2. 整合 USB3、USB4、PCIe等 SerDes PHY與 MAC. 應徵條件： 1. 熟悉 USB3.2、PCIe、PIPE4/5等 Spec. 2. 具 USB3.2 or PCIe Gen3/Gen4 DPHY/MAC設計經驗。 3. 具 USB3.2 or PCIe Gen3/Gen4等 PHY IP整合經驗。 4. 具備 SoC晶片整合能力。

工作項目： 1. Lead and manage all Realtek‘s commercial activities including engaging in various stages of the sales cycle, setting up account strategy, executing the account plan, developing multi-level customer relationship across functions of product planning, procurement and senior management, to meet or exceed annual and quarterly revenue and design targets, along with business objectives. 2. Identify the key solution and product requirement from project development and design win perspective and promote Realtek‘s solution advantage. 3. Clearly articulate customer needs, along with industry trends to sales management and Realtek product lines. 4. Understand the competitive landscape, obtain feedback and work with PMs/engineering teams to provide our offerings to customers. 5. Focus customers from various market segments: IOT, Distributor&Sales Representative, Automotive, Home Networking. 6. Legal Agreement Handling such as NDA, Purchasing Agreement and MOU. 應徵條件： 1. BS in engineering or business required, advanced degree (i.e.) MBA/MS desired. 2. 5-10 years of strategic account(OEM/ODM/Telco/MSO) sales experience in semiconductor or RF/networking/carrier industry, specifically managing foreign accounts. 3. Must be fluent in written and spoken English & Chinese. 4. Multi-cultural experience is desirable. 5. Must demonstrate ability to address multiple product lines and product segments. 6. Experience and knowledge of key account inner organization to work with the influencers, blockers, and decision makers. 7. Ability to present a compelling business case to internal and external. 8. Great Interpersonal Skill and Ability to work cross departments and product groups.

工作項目： 1. 開發維護 in-house VIP 2. 支援產品線 IC 驗證計劃 工作地點：台南科學園區 應徵條件： 1. 大學、碩士以上；電機、電機與控制、資訊科學、自動控制、通訊工程、電信、資訊工程、電子、動力機械相關科系畢業為主。 2. 熟悉 SystemVerilog 驗證語言和 perl 相關 scripts。 3. 熟悉 UVM 或 VMM methodology 。 4. 熟悉 PCIE/USB/SATA 等 protocol 。 5. 具4年以上 IC 驗證相關經驗。 6. 有 VIP 開發經驗者尤佳。

工作項目： 1. ARM Architecture based Complex CPU Subsystem Platform Design & Integration, Add-on Features Enablement and IP Development 2. SoC Architecture Exploration, Performance Projection and Bottleneck Analysis 3. Benchmark/Power Characterization on Emulation Platform, Result Analysis and Optimization 4. CPU Architecture/Micro-architecture Research 5. Involvement of Post-silicon Bring-up and Debug 應徵條件： 1.碩士以上；電機、資工、電子相關科系畢業為主。 2.具IP開發經驗，熟悉 SoC Integration & Design Flow、Frontend Timing/Power Analysis EDA Tools。 3.熟悉ARMv7/v8-A CPU 架構及AMBA protocol，有 ARM Cortex-A CPU/Subsystem Design/Integration/PPA Optimization/Sign-off 經驗尤佳。 4.具Emulation platform (Zebu, Palladium)經驗尤佳。 5.有 Low Power Design & Verification、Post-Silicon Validation & Debug 經驗尤佳。 6.積極負責、溝通協調能力強、勇於迎接挑戰，對於 High-Performance CPU Technology 有興趣者。

工作項目： 1.High-Performance CPU & GPU & Armv9 & Server-class Compute SubSystem (CSS) Frontend Implementation (including STD cells/SRAM analysis & selection, DFT insertion, Synthesis, low power cells insertion & verification) 2.Advanced ASIC Implementation Flow Development & Automation: High-performance, Low Power, and PPA (Performance, Power, Area) Optimization 3.Physical Synthesis and Collaboration with P&R in Timing/Congestion Analysis and PPA Optimization 4.Perform Power Replay and Power Analysis 5.Perform Pre-layout/Post-layout Quality Checks (including LEC, CLP, ATPG, GCA, PPA quality) 應徵條件： 1.碩士以上；電機、電機與控制、資訊工程、電子相關科系畢業為主。 2.熟悉 Frontend EDA Tools、Synthesis、Timing Analysis、Low Power Implementation Flow & PPA (Performance, Power, Area) Optimization。 3.有開發Automation Flow的經驗，熟悉 TCL/Perl/Python。 4.英文能力良好，聽說讀寫精通。 5.有 CPU、GPU、Multi-Core Processor、Compute SubSystem Implementation 經驗尤佳，例如 Synthesis/Floorplan/CLP/DFT等。 6.積極負責、勇於迎接挑戰，對於 High-Performance CPU/GPU/CSS、Advanced PPA Optimization、Energy Efficiency Technology 有興趣者。

工作項目： 1. CPU & GPU Backend Implementation (APR) 2. CPU/GPU Backend Flow Development, Enhancement & Automation 3. Advanced CPU/GPU Technology Development: High-performance, Low Power, and PPA Optimization 應徵條件： 1. 碩士以上；電機、資工、電子相關科系畢業為主。 2. 熟悉 APR Tools (Innovus、ICC2、Fusion Compiler…)，有Synthesis、STA/IR Analysis、Physical Verification等相關經驗者佳。 3. 具備程式設計能力，熟悉 TCL/Perl/C++/Python。 4. 有 High Performance CPU/GPU APR經驗尤佳。 5. 個性積極負責、勇於迎接新挑戰，對於 High-Performance CPU/GPU Technology 有興趣者。

工作項目： 韌體撰寫及解決客戶問題 應徵條件： 1. 碩士以上;電機工程、電信工程、電控工程、電子工程、資訊工程、資訊科學、動力機械、自動控制、通訊工程相關科系畢業為主 2. 熟悉 C語言 3. 熟悉 Orcad

工作項目： Monitor/translator韌體開發，客戶問題解決。 應徵條件： 1. 碩士以上;電機工程、電信工程、電控工程、電子工程、資訊工程、資訊科學、動力機械、自動控制、通訊工程相關科系畢業為主。 2. 熟悉 C語言,　C++。 3. 熟悉 MCU, orcad。

工作項目： 1. 執行 system team之工作。 2. 負責 TV certification測試，以及測試一些系統tool、分析效能，幫忙複製問題並進行問題初步整理及分析。 應徵條件： 1. 專科以上; 電機工程、電信工程、電控工程、資訊工程、資訊科學、自動控制等相關科系畢業為主。 2. 具基本程式概念，有編過code、寫過code及1年以上相關經驗者為佳。

1. Summary Realtek Semiconductor Corp., located in the Hsinchu Science-based Industrial Park, Taiwan‘s 〝Silicon Valley〝, established in 1987. Realtek‘s efforts to provide the ultimate in pioneering IC technology — along with its firm commitment to creating unique and innovative designs for a broad range of high-tech applications — have won the company a worldwide reputation and made possible a favorable and consistent growth rate in the years since its establishment. In line with the Realtek culture of 〝Self-confidence and trust in people〝, we believe that we can achieve our best, and trust our colleagues can also do the same. Working and learning in Realtek, we openly share knowledge and experience with one another to inspire innovation and pursue growth of the company, as well the individuals. Talent is the important capital of Realtek. Welcome to Join Realtek Family! 2. Essential Job Functions ‧Locate in Southern part of Germany (Frankfurt to Stuttgart, or Stuttgart to Munich) ‧Provide pre-sales and post-sales support. ‧Understand customer requirements, and deliver technical presentations, reports, documents and technology demonstrations. ‧Support customer product development and design. ‧Support customer issue analysis and resolve. ‧On-site support for debug or certification test. ‧Cross-functional collaboration with Realtek internal resources. 3. Education, Skills, Abilities, And Experience Required ‧M.S. or B.S. in Engineering or equivalent. ‧3 to 5 years of progressive professional technical experience in IC design or related areas, direct experience in IC design house FAE is preferred. ‧Strong analytical and problem solving skills. ‧Strong written/verbal communication and negotiation skills. ‧Being proactive and willing to take initiatives. ‧Ability to work independently to achieve goals. ‧Ability to understand and explain technical issues and solutions to technical and non-technical personnel. ‧Native German skill. ‧Medium or higher English skill. ‧Familiar with Ethernet protocols will be a plus. ‧Familiar with Automotive ecosystem will be a plus. ‧Basic or higher Chinese skill will be a plus. ‧Experience of Linux system will be a plus. 4. Industry Automotive Ethernet, Semiconductor 5. Employment Type Full-time 6. Job Functions Engineering, Business Development

工作項目： 1. Bluetooth SoC Firmware Development. 2. FPGA/ASIC Verification. 3. Customer Support. 應徵條件： 1. 碩士以上；電機、電機與控制、資訊科學、自動控制、通訊工程、電信、資訊工程、電子相關科系畢業為主。 2. 有 RTOS 相關開發經驗。 3. 精通 ARM / MIPS assembly, C or C++ programming language。 4. 積極, 自我挑戰, 善協調, 有創造力。 5. 需出差協助客戶解決問題。

工作項目： WiFi 6/7/8 MAC System Design and Verification 應徵條件： 1. 學士以上;電機工程、電信工程、電控工程、電子工程、資訊工程、資訊科學、通訊工程相關科系畢業為主 2. 熟悉 Embedded System, ARM/MIPS CPU, Linux, C, Script, Makefile, and etc. 3. 熟悉 LA, Scope, CatC, and etc. 4. 具3年以上主要工作內容: a.) WiFi IP Verification b.) WiFi Design Spec & Architecture for Performance / System scenario / ... c.) Uboot / Linux development for WiFi d.) FW developement for WiFi internal CPU and SoC Netowork Sub-System e.) Research spec and test plan from IEEE-802.11 and WiFi-Alliance f.) Debug g.) ... 另有以下條件由為佳: a.) IC 開發經驗 b.) Computer Architecture c.) C Programming d.) Network protocol & concept e.) Embedded System f.) Uboot / Linux development experience g.) 個性好相處，能融入團隊 h.) 相關經驗者為佳

工作項目 : 1. Camera ISP影像處理及3A演算法開發。 2. Computer Vision (CV)電腦視覺演算法開發。 3. Artificial intelligence (AI) 機器學習演算法開發。 4. 帶領小組團隊研發。 應徵條件: 1. 碩士以上；電機電子工程相關、資訊工程相關。 2. 熟悉常用程式設計語言如C/C++/Matlab。 3. 具訊號處理或IC設計工作經驗者為佳。