面試經驗談專區

1.薪資、獎金、考核、出勤、保險等人事行政作業 2.辦理人員招募、甄選、報到、離職等人事作業。 3.勞動契約、任用規定及相關人事制度之執行與管理。 4.研擬及修訂人事管理制度與內部規章。 5.配合勞動法令及行政法人相關規定，確保制度合法合規。 6.其他主管交辦事項。

工作地點：內湖麗山學區，單一學區（單純版本） ⏰工作時間： 週一～五12:00-8:00 週二2:00-7:30 ✅工作內容： 1.獨立帶班，熟悉國小一、二年級課程內容檢查作業、學科輔導、課室管理及家長溝通 2.寒暑假需配合帶營隊，可輪值 ☀️條件：大學畢，需至少3年以上獨立帶班經驗， 愛小孩、有耐性，做事細心，熟悉國小課綱及文書作業為佳 可以混齡獨立帶班薪資另議

1.工作內容主要為租用的柴油發電機添加柴油及例行巡檢. 2.需會具備手排車汽車駕照，月休８日. 3.協助主管交辦事宜.

1.全面領導實驗室運作.確保測試活動符合ISO 認證標準與TAF認可要求 2.建立並維運品質管理系統.監控測試流程.並管理人員與設備 3.規劃並執行風險管理與持續改善機制.確保實驗室運作穩健且合規 4.擔任對外溝通窗口.負責稽核應對.客戶需求及文件管理 5.規劃與推動內部教育訓練及管理評審.持續提升團隊專業能力 6.完成上級交辦事項 7.負責品質手冊之行政管理事宜.包括: *內部稽核之規劃與執行 *稽核缺失矯正及追蹤 *管理審查之規劃與結果追蹤管理 8.指派並管理報告簽署人.確保其理解檢驗方法與程序. 落實報告簽屬職責.並對檢驗報告之有效性負最終責任 9.主管交辦事項

1. 用瓦斯氣體火焰、電弧、鋁熱劑化合物或其他方法焊接金屬。 2. 操作電阻熔接機器。 3. 用小型發焰裝置製作及修理鉛隔板、導管、地板及其他鋁製品。 4. 用銅鋅合金焊接金屬工件。 5. 用瓦斯氣體火焰、電弧切割金屬片。 6. 用手工焊接劑焊接金屬。 7. 完成上級交辦事項

1.負責TAF認證文件.SOP.檢驗規範的編製.修訂.發行與廢止 2.維護ISO認證.籌劃內部稽核及管理技術文件 3.監督數據正確性.儀器校正文件管理.確保測試活動合規 4.完成上級交辦事宜

★協助經驗豐富的維修技師進行日常機車維修、保養及故障檢查。 ★學習並熟悉機車維修所需的基礎技能與工具操作。 ★協助整理工具、車輛零件、維修記錄等日常工作。 ★在專業技師的指導下，逐步學習機車的維修流程和技術。 時薪月薪都可詳談

職掌: 1.掌握產品市場新趨勢，掌握並提升產品的競爭力，提供內部人員專業諮詢與建議。 2.規劃產品策略、藍圖以及管理產品生命週期。 3.管理產品開發與量產之相關協調工作或技術移轉專案(包括專案規劃、專案組織成立以及開發時程、成本、品質等之控管等)。 4.採購核價、議價、下單、成本掌控及交期控制、進行驗收作業。 5.建立、更新供應商資料（如：貨品價格、規格和到貨時間），以選擇最佳供應商。 6.供應商維護及管理，與良好供應商維持良好關係。 7.開發新產品，新供應商蒐集，找尋品質好、成本低、配合度高的優良供應商。 8.提供緊急措施，使需求業務可做緊急採購。 9. 解決商品瑕疵退貨等問題。 10. 具備國貿、熟悉進口/三角貿易實務流程及採購流程。 11.語文能力(JLPT N1或N2檢定程度) 12.電腦能力(包含邏輯、組織、文書及簡報)、Vlookup&函數試算能力。 13.表達溝通能力(包含說服力) 14.普世價值:配合度、團隊合作特質 加分條件: 具品牌概念與代理品牌經驗。 公司官方網站 https://www.wonson.com.tw/zh-TW

Please also apply through: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Tape-Out-Engineer_R-10063230 Role Overview, Responsibilities, and Qualifications The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes. Key Responsibilities 1. Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing. 2. Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors. 3. Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability. 4. Ensure all deliverables conform to foundry requirements. 5. Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement. Qualifications 1. Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred). 2. Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows. 3. Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines. 4. Willingness to work with flexible working hours to support critical Tape-outs. Effective communication in English for collaborating across technical teams. This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.

Job Responsibilities - To be the owner for manufacturing test on the released products. - Responsible for test program introduce to mass production - Responsible for NPI (after R-gate released) test data analysis and feedback to BL/PETE if any improvement needed - To be the owner for duplicated test hardware by performing debug and qualification, MSC (Gage R&R) analysis and release report - Responsible for 1st line hold lot disposition, including low yield, QA fail .......etc - To initial and work with related process owners on testing processes, documentation, and best practices - Participate in or drive test automation initiatives when applicable Required Qualifications - 3+ years of experience as a Test Engineer - Solid understanding of software/system testing methodologies - Familiarity with Linux environments and command-line operations - Experience with machine language (e.g., Java, C++) - Experience in system, embedded, hardware, or manufacturing testing - Strong analytical and problem-solving skills - Strong sense of ownership and responsibility for product quality English communication, reading, writing

Role Summary: The NVM Reliability team is responsible for characterizing, modeling, and enabling next-generation Non-Volatile Memory technologies, enabling new product creation company-wide. Job Responsibility: －Interface with foundries and other external suppliers of technology and IP to assess reliability margin to product applications. －Establish qualification requirements for new technology and product introduction. －Perform rigorous statistical analysis of reliability characterization data. －Enable high reliability during volume production by working with product groups to address risk areas. －Support business groups with customer requests for technical information, including reliability characterization results, risks assessments, and consultation on issues. －Communicate study conclusions and recommendations to internal and external teams. Job Qualification: －Bachelor‘s, Masters, or Doctoral degree in Electrical Engineering, Applied Physics, or equivalent, with 10 years of industry experience. －Experienced in data processing and analysis (e.g. Python, JMP, Matlab, Exensio). －Software development experience, such as familiarity with microcontroller software development (C/C++) is desired. －Interest in statistics and solid-state device fundamentals, especially as applied to emerging non-volatile memory technologies like MRAM and RRAM. －Must be curious, proactive, and detail-oriented. －Able to work in a team environment, communicate effectively in English and Mandarin, and solve problems.

***Please apply for this position on NXP official website: https://pse.is/8ms2kr Role Purpose Lead the development and optimization of high-voltage (HV) and BCD device architectures. This role requires a deep understanding of device physics and a data-driven approach to ensure industry-leading performance and reliability for power management solutions. Key Responsibilities － Device Development: Lead the architecture design and optimization of HV devices (LDMOS, EDMOS, ESD) on 180nm to 55nm BCD nodes. － Physics Analysis: Analyze and optimize Device Physics parameters, including BV, Rdson, SOA, and reliability (HCI/NBTI). － Simulation & Modeling: Utilize TCAD for 2D/3D process and device simulations to accelerate development cycles. － Device Verification: Define verification plans and execute statistical analysis using JMP for DOE and WAT data. － Design Integration: Work within Cadence environments for layout review and test structure design. － Cross-functional Collaboration: Partner with PI and PE teams to resolve yield, reliability, and manufacturing bottlenecks. Required Qualifications － Experience: Master‘s or Ph.D. in EE, Physics, or related field with 10+ years of semiconductor industry experience. － Technical Expertise: 1. Profound knowledge of Device Architecture and Device Physics. 2. Hands-on experience in 180nm to 55nm BCD process nodes. － Tools: 1. Expertise in TCAD (Sentaurus / Silvaco). 2. Expertise in JMP for statistical data analysis. 3. Proficiency in Cadence (Layout/Virtuoso). Preferred Qualifications (Plus) － Advanced Power Devices: Experience with GaN, SiC, or IGBT development. － Silicon Photonics: Knowledge of Photonics integration and device physics. － Domain Knowledge: 1. Process Integration (PI): Understanding of mask flow and doping profiles. 2. Product Engineering (PE): Experience in CP/FT data correlation and yield enhancement. Competencies － Accountability: Strong ownership of project milestones and outcomes. － Critical Thinking: Ability to identify root causes in complex device failures. － Interpersonal Skills: Effective communication across design and foundry teams. － Data-driven: Committed to objective decision-making through rigorous data analysis.

The key areas of responsibility of the jobholder are: - Collaborate closely with foundries, NXP technology teams, and business lines to qualify and release advanced FinFET processes. - Provide technical leadership in semiconductor device physics, especially in FinFET architecture and behavior. - Interface with internal and external stakeholders on critical development and transfer projects. - Lead and steer projects to meet timelines and business objectives. - Make key decisions on process integration, balancing technical, logistical, and strategic factors. - Support NTI process transfers within foundries and NXP joint ventures Requirements / preferences: - Bachelor‘s or Master‘s degree in Electrical Engineering, Physics, or related field. - Minimum 10 years of experience in semiconductor device engineering, with a strong focus on advanced logic/RF devices. - Proven hands-on experience with HKMG and FinFET technologies in production or development environments. - Deep understanding of semiconductor device physics, especially HKMG and FinFET. - Strong analytical skills in yield enhancement and electrical data analysis. - Fluent in English and Mandarin. - Demonstrated leadership in development, transfer, or ramp-up projects. - Excellent communication and influencing skills. - Proactive, pragmatic, and results-driven mindset. - Experience working with foundries and leveraging external manufacturing capabilities .

- Data analysis to ensure handler work on baseline. Ex. MCBA, index time, temperature control and HW interface maintenance 資料分析確保機台運作在基準條件, 包含作動不順, 作動時間, 溫度控制, 及機台介面維護 - SOP, OCAP, PM document creation. 建立標準化流程,異常處理文件,及保養維護文件 - Responsible for the performance of handler. 負責機台性能及相關報告 - Handle the improvement project on handler. 持續進行機台的改善計畫 - Management recipes of handler and spare parts 機台參數管理及備品管理 - Provide technology and operation training to shift assistant engineer and operators in manufacture lines to support production smoothly. 訓練助理工程師與作業員以利生產線順利運作 - Co-work with worldwide handler team for evaluation/improvement 與其他機台團隊跨國合作, 導入評估, 問題改善

***Please upload English resume onto our official platform: https://reurl.cc/1bbx6m Job Descriptions - The selected candidate will participate in Wi-Fi/BT software/firmware design , implementation, integration, validation and maintenance phases for standard based and non-standard based Wi-Fi/BT/BLE products for IOT and automotive markets. - Lead/participate in complex feature integrations/enhancements, Wi-Fi/BT/BLE SoC bring up, and technical issue solving. - Research, design and develop cutting edge technologies for industrial features and IEEE/WFA/BT/BLE spec. Ranging from Wi-Fi enterprise access point, embedded clients and other wireless technologies. - Participate the full life cycle of IC – spec designing, pre-silicon validation, chip bring-up, software development, customer engaging and supporting. Support customers remotely or onsite as needed. Qualifications - MS in EE, CE, or CS. - Proficient in C programming language. - Experience on Linux / Android programming is a plus - Knowledge on real-time OS (FreeRTOS / ThreadX) programming is a plus - Knowledge of ARM assembly is a plus - Team player and excellent interpersonal, communication and writing skills - Independent, self-motivated and willing to learn

Please apply for this position on NXP official website: https://pse.is/836k2a Job Responsibilities: APAC Central Competence Team works with external foundries to ensure stable chip supply for business lines across NXP. The primary responsibility of this role is to locally drive the lead products ramp up under new technology introduction (NTI). The key areas of responsibility of the jobholder are: 1. Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process 2. Front end process safe launch owner. Closely work with foundries at ramp up phase and drive for manufacturability and yield improvement. 3. Interface with key customers on critical projects. 4. Lead and steer the projects towards timely completion to support NXP business needs 5. Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc Requirements / preferences: 1. Bachelor or MSc in physics or electrical engineering. 2. ＞10 years of experience with front-end IC process integration, working in foundries’ production or development teams 3. In-depth knowledge of IC devices and processes. FinFET and NVM knowledge is a plus. 4. Strong understanding of yield enhancement techniques and data analysis 5. Must be fluent in English and Mandarin 6. Hands on experience in being a lead; leading teams with responsibilities in development / transfer projects or production ramp up. 7. Good communication skills. Having the ability to influence and steer a discussion 8. Pro-active working attitude, creative, pragmatic, enterprising and result driven. 9. Familiar in managing/working with foundries, maximizing leverage from foundries

在飛豬，我們不只是一個團隊，更是一個大家庭。 無論是否有相關經驗，只要您願意挑戰，我們都歡迎您成為我們的夥伴。 職務描述： 1.負責管理國際地產買賣案件，並維護客戶關係。 2.協助客戶解決國際地產買賣相關問題，並提供專業建議和支持。 3.積極拓展國際地產相關業務。 4.與客戶建立長期合作關係。 5.高效處理國際地產買賣相關事宜，以確保客戶滿意度。 6.完成主管交辦事項。 7.精通英文者佳。 共同成長：在我們這個大家庭，我們一起成長、互相支持，實現個人和團隊目標。 服務熱忱：我們熱愛幫助客戶，成為他們信任的夥伴，並提供最佳的顧問服務。 面對挑戰：我們勇於面對困難與迎接挑戰，並通過努力實現成功的目標。 我們期待您的加入，一起創造成功的故事！

在飛豬，我們不只是一個團隊，更是一個大家庭。 無論是否有相關經驗，只要您願意挑戰，我們都歡迎您成為我們的夥伴。 【職務描述】 1. 管理國際地產買賣案件，維護客戶關係 2. 協助解決國際地產相關問題，提供專業建議和支持 3. 積極協助拓展國際地產業務 4. 規劃與執行品牌行銷內容，包含社群貼文、EDM、活動宣傳等 5. 發想文案創意，執行影音內容規劃、影片剪輯與後製，提升品牌曝光與互動率 6. 協助活動企劃及相關行銷專案 7. 完成主管交辦事項 8. 精通英文者佳 【需具備的能力】 設計工具：熟悉 Canva 或其他平面設計、製圖軟體，可製作圖文素材與宣傳品 影片剪輯：具備剪輯軟體操作能力 共同成長：在我們這個大家庭，我們一起成長、互相支持，實現個人和團隊目標。 服務熱忱：我們熱愛幫助客戶，成為他們信任的夥伴，並提供最佳的顧問服務。 面對挑戰：我們勇於面對困難與迎接挑戰，並通過努力實現成功的目標。 我們期待您的加入，一起創造成功的故事！

在飛豬，我們不只是一個團隊，更是一個大家庭。 無論是否有相關經驗，只要您願意挑戰，我們都歡迎您成為我們的夥伴。 職務描述： 1.負責向客戶介紹國際地產，並協助完成購屋流程(含線上或實體說明會)。 2.依照客戶需求提供專案分析、物件推薦與資產配置建議。 3.定期聯繫潛在客戶，經營CRM名單並安排洽談或視訊會議。 4.協助國際地產買賣案件之行政協調與付款流程追蹤。 5.配合公司行銷部門參與說明會、展會與自媒體拍攝活動。 6.提供售後服務與客戶關係維護(如:產權過戶、租賃代管銜接…等)。 7.對不動產、資產配置有高度興趣者佳。 8.需具備良好的口語表達能力與客戶應對能力。 9.積極進取，樂於挑戰業績與自我成長者佳。 10.具備基礎英文溝通能力者優先。 共同成長：在我們這個大家庭，我們一起成長、互相支持，實現個人和團隊目標。 服務熱忱：我們熱愛幫助客戶，成為他們信任的夥伴，並提供最佳的顧問服務。 面對挑戰：我們勇於面對困難與迎接挑戰，並通過努力實現成功的目標。 我們期待您的加入，一起創造成功的故事！

1. 不動產買賣仲介服務 2. 不動產租賃仲介服務 3. 客戶售後服務 4. 土地開發、中古屋開發 5. 不動產稅務問題及房價諮詢 有無經驗皆可，只要您有強烈的企圖心，公司有一系列超過250小時完整教育訓練，歡迎您~加入我們的行列吧！ 房屋仲介業是一個以大量的時間和心力付出，換取報酬所得的行業，贏取同工不同酬的機會，須具有強烈的企圖心以及服務熱忱，勇於面對挑戰的人 房地產買賣從數百萬到上億元，只要肯努力打拼，短時間即可達成百萬年薪的夢想，是最有錢景的產業；我們團隊需要有共識願意一起打拼的好人才，心動不如馬上行動，趕快投履歷加入我們喔！