交大專區

1. BPM/電子表單系統開發及維運、與其他(ERP、MES...)系統整合 2. RPA 流程自動化場景規劃與開發 3. 企業協同合作資訊系統開發、整合及維運 4. 與使用者需求訪談、跨部門需求整合、規劃、分析、設計、測試與上線

(1)機械組立需會看圖 (2)機械零件製作 (3)焊接(電焊、氬焊)

***本職缺將安排完整的教育訓練*** 一、講座教育訓練(系統構成、機台構成、作業SOP) 二、實機教育訓練(操作教育、設備校正教育、品質檢查教育、電源盤調整教育) 【工作內容】 1.台積電F20廠 。 2. 執行自動化設備之相關安裝校正。 3. 維持廠內自動化系統之正常運作。 4. 進行自動化設備維護、保養、異常排除。 5.自動化設備耗材更換 6.無相關工作經驗 〝可〝 團隊裡有完善的新人教育訓練 【其他條件】 1.個性需積極、細心、負責、配合度高。 2.需有無塵室工作且著全套無塵衣經驗。 3.可配合設備導入常駐客戶端工作。 4.需配合常態性出差。

有無經驗皆可，歡迎學習一技之長 由於主管不常看信箱，意者請直接電洽06-5552217應徵，謝謝 ★無經驗者36000元起 ，有經驗者起薪45000元

1.Spice model generation and verification for advanced and specialty technologies 2.Spice Model Parameter Extraction 3.Test key design 4.Internal and external customer support 5.Advanced modeling tools, extraction algorithms and model equation benchmarking

1.製程開發執行, 新技術開發之時程掌控，以符合製程整合新製程開發之需求，提高客戶之滿意度 2.開發模組製程, 使先進製程良率達到量產需求 3.維持製程穩定度, 降低製程缺陷數目及提高機台妥善率 4.線上異常處理及後續成效追蹤 5.建立標準規範(SOP)，改善現行系統漏洞 6.突破性製程研發改善，提高公司競爭力

負責 eNVM IP 開發 1.負責標準eNVM IP　電路模擬及驗證 2.負責Verilog Model 產生及驗證以確保品質 3.負責Testchip 電路設計及模擬，驗證 4.負責 Data Sheet 驗證以確保品質

1.執行統計大數據分析與開發資料科學演算法及設計與訓練深度學習模型，並運用技巧調適模型，使其具備最佳的預測能力。 2.利用深度學習模型開發系統雛形，並驗證可以提升廠內人員生產力，機台產能，產品良率，與降低產品 cycle time. 3.開發AI新技術與研發 AI 關鍵零組件，專案執行，產學合作

1.自動化與品質系統的管理與改善, 提昇部門生產效率 2.品質與自動化專案推行 3.PT 品質系統管理-稽核 , 教育訓練 , 改善專案 4.FAB 應用系統管理 - 報廢 , 復活 , PN , SOP , 攜出入 5.自動化需求開發與整合 6.自動化系統管理與改善

1.Lead the development of advanced RFSOI and RFSOI-3DIC technology platforms for next-generation communication solutions. 2.Design and qualify new process modules and RF device structures to enhance platform capability and performance. 3.Establish and validate new process flows in Design-Start Modules (DSM) for customer-specific applications. 4.Collaborate closely with customers on new product verification, process customization, and technical alignment. 5.Coordinate cross-functional activities from design to qualification, ensuring robust integration and yield performance.

1.Develop and optimize 300mm Silicon Photonics (SiPh) technology platforms, including pluggable modules, co-packaged optics (CPO), and photonic interposer solutions. 2.Collaborate with internal R&D and module engineering teams to define and execute SiPh process flows. 3.Align device and process requirements with customers through technical discussions and solution deep dives. 4.Coordinate with external OSATs and partners for PIC/EIC characterization and packaging integration. 5.Apply DOE, FMEA, and control plan methodologies to ensure robust development and effective risk mitigation across all phases

1.Drive R&D and process integration for 2.5D and 3DIC packaging platforms. 2.Lead the development and qualification of new unit modules and device structures. 3.Establish and validate new process flows in Design Start Modules (DSM) to support custom product platforms. 4.Collaborate directly with customers on product requirements, verification testing, and technical solutions. 5.Apply structured methodologies such as FMEA, DOE, and control plans to optimize performance and mitigate risks.

1.Support new customer product introduction into the FAB, ensuring smooth pilot and tape-out processes. 2.Improve yield and ensure stability in in-line, wafer acceptance test (WAT), and chip probe (CP) results. 3.Define and implement standard operating procedures (SOPs) for production. 4.Collaborate with module engineers to resolve production issues related to yield, reliability, and in-line parameters. 5.Work cross-functionally to develop customized process flows that meet customer need.

1.Monitor in-line process parameters, address abnormalities, and make disposition decisions on lots to ensure smooth production flow. 2.Assist in productivity and yield improvement projects through data analysis and process experiments. 3.Support the establishment and maintenance of key process parameters for semiconductor tools. 4.Evaluate new materials, tools, and methods to enhance manufacturing quality and efficiency.

1 了解使用者需求及資訊技術的應用,及各項品質管理,專案管理的技能,以做好系統的日常管理,專案管理,及軟體工程。 2.執行專案及主管交付任務,達成專案目標及日管目標,以滿足客戶需求並符合公司營運需求及提高用戶滿意度 承接部門專案,與相關單位溝通，了解需求,爭取資源,做好專案管理。 處理客戶需求,提供最佳的服務品質與效率 培養技術能力:相關 domain knowledge，軟體工程能力,IT 技術。 改善品質問題,並建立標準流程

1.Monitor and resolve in-line SPC (Statistical Process Control) issues, equipment abnormalities, and lot handling in a timely manner. 2.Maintain equipment capability and ensure availability to meet production demand. 3.Collaborate with production and process teams on tool usage for troubleshooting, maintenance, and output. 4.Participate in troubleshooting and quality improvement projects to enhance equipment reliability and production outcomes. 5.Evaluate new equipment, materials, and retrofits to drive performance gains and production efficiency.

1.Conduct TCAD-based research and simulations to explore novel device concepts and architectures. 2.Develop, document and calibrate TCAD simulation decks in collaboration with cross-functional project teams. 3.Execute TCAD design of experiments (DOE) and generate tuning decks to support device optimisation. 4.Design test keys and layout structures for silicon validation, including bench-level electrical measurements and performance analysis. 5.Run structured experiments to fine-tune device parameters while safeguarding long-term reliability.

1.Day to Day monitoring and ownership to timely address in-line defect abnormality escalation, handling and disposition 2.Render support in Production ramp-up, New process implementation and process characterization for project success 3.Evaluate and implement productivity projects for DM Production, Tool and Cost index improvement 4.Define and deploy inspection tool recipes BKM to ensure detection capability 5.Assist in Customer audits on inspection strategy deployment and execution 6.Perform baseline defect improvement

1.New Device Introduction: Perform tape-out/tooling operations for customer design database and achieve the goal of first pilot success. 2.Project coordination: Customer interface and cross department coordination with seamless communications. 3.Manage conference calls, meetings and customer visits with professional presentation skills and logistics arrangement for project success. 4.Project management: Documentation, summary, meeting minutes and ability to recap keynote of meetings for management team review.

1.Work with cross-functional teams from Process Integration, Modelling, PDK, and Design Enablement to develop advanced BCD (Bipolar-CMOS-DMOS) technologies for 300mm fabrication. 2.Lead technical engagement with consumer and automotive customers to understand and define device requirements. 3.Generate BCD active and passive device P-cell layouts based on application specifications. 4.Collaborate with the Modelling team to develop accurate SPICE models. 5.Drive implementation of specialised device features into PDKs and ensure timely communication and technical validation with customers. 6.Enhance BCD device performance to meet evolving application needs.