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  • 3/3
  • 機電員-新店區安興路(薪46000)
  • 新北市新店區
  • 統揚公寓大廈管理維護有限公司(成奕清潔,東陽保全,統揚物業)
  • 工作經歷不拘,學歷不拘,月薪 46,000元0 ~ 10 人次主動應徵
  • ★須具備一年以上社區保養實務經驗★ ★上班時間:10:00~19:00(餐休一小時)★ ★休假方式:每週排休2日及國定假日排休(與公務人員休假天數一樣)★ ★需室內配線丙級 ★會使用電腦★ ★工作內容★ 1.大樓之水電工程保養維修 2.社區工程監督管理

  • 3/2
  • 國家太空中心-光學酬載組_數位電路設計工程師
  • 新竹市東區
  • 國家太空中心
  • 2年以上工作經歷,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 1.研讀、修改與撰寫RTL code (Verilog, VHDL) 2.數位電路設計。 3.承辦及參與委託給業界或學研團隊之研發案。

  • 3/2
  • 國家太空中心-衛星操控組-GNSS資料系統架構師
  • 新竹市東區
  • 國家太空中心
  • 3年以上工作經歷,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 1. GNSS資料處理系統架構設計、整合與維運 2. 協調與整合資料處理核心模組介面 3. 協調與整合系統外部介面 4. 系統管理作業流程精進與自動化

  • 3/2
  • 機械製圖人員-外埔廠
  • 台中市外埔區
  • 旭東機械工業股份有限公司
  • 工作經歷不拘,學歷不拘,月薪 32,000~35,000元0 ~ 10 人次主動應徵
  • 1.3D圖面細節繪製。 2.2D工程圖面標註。 3.拆圖。 4.建立BOM清單。 5.主管交辦事項。

  • 3/2
  • 新竹無塵室組立作業員 -需大學畢業無經驗可
  • 新竹市東區
  • 鉦寶企業社
  • 工作經歷不拘,學歷不拘,日薪 2,050~2,500元0 ~ 10 人次主動應徵
  • 我們是一家專注於通用機械設備設計、製造與維護的公司,致力於提供創新的設備解決方案,主要服務對象為高科技製造業客戶,特別是科技廠無塵室相關設備的需求。本公司秉持提升產品效能與客戶滿意度為核心目標,與業界共同邁向卓越。 工作內容: 1. 根據設備設計圖紙進行無塵室內科技廠自動化機械設備的組裝,確保作業精確。 2. 組裝與安裝機台及其零組件,並確保所有零件連接牢固與符合技術標準。 3. 執行設備組裝完成後的多項測試作業,確認性能穩定及正常運作。 4. 進行無塵室自動化設備的改造與定位,並針對工程技術問題提出改善建議。 5. 協助E84工程相關流程執行,確保作業流程合規並有效率。 6. 提供設備安裝後的現場支援(CS人員),處理操作中可能遇到的問題。 7. 從事自動化設備的組裝與基本維修,如有需求,參與設備維護與例行保養作業。 8. 配合加班及出差需求,確保專案能按時完成,無經驗者將提供專業培訓。 歡迎對機械與自動化設備領域充滿熱情的您加入我們團隊!無須相關經驗,本公司將提供完整的培訓計畫,幫助新進同仁熟悉無塵室操作規範及技術操作。我們期待與您共創未來,立即投遞履歷,成為我們重要的一員!

  • 3/2
  • CNC機台操作技術員
  • 台中市西屯區
  • 振鋒企業股份有限公司
  • 工作經歷不拘,學歷不拘,月薪 38,000~48,000元0 ~ 10 人次主動應徵
  • 1. CNC機台操作、上下料 2. 品質抽檢、尺寸檢查與記錄 3. 生產與品質異常處理或回報 4.日常保養與清潔 5.作業文件遵循 6.安全操作與5S 7.刀具研磨

  • 3/2
  • IT Security Risk Assessment Engineer
  • 新竹縣寶山鄉
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 5年以上工作經歷,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=3971&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Act as the IT security Purple team to identify and validate exploitable vulnerabilities for IT continuous improvement ahead of real adversaries. 2. Develop and enable Security Assessment Automation capability for IT security risk assessment. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 3/2
  • 廠務助理工程師(裝機工程)
  • 台南市善化區
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,月薪 33,800~0元0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=505&source=1111 台積公司成立於1987年,率先開創了專業積體電路製造服務之商業模式,自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展,以此釋放全球半導體產業的創新。身為全球的企業公民,台積公司的營運範圍遍及亞洲、歐洲及北美,致力成為企業社會責任的行動者。2024年,台積公司提供最廣泛的先進製程、特殊製程及先進封裝等不同製程技術,為500多個客戶生產超過11,000種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 說明: 1. 負責廠務系統與半導體機台連接配管、佈線工程、現場施工、安全及品質管理。 2. 施工配管物料估算及領料、進料管理。 3. 焊接機具及施工工具操作、校正、維護與管理。 營造一個合乎台積公司核心價值與經營理念的全球共融職場,對於公司未來成功至關重要。台積公司對全球共融職場的承諾,旨在讓每位員工無論性別、年齡、身心障礙、宗教、種族、族群、國籍、政治立場或性傾向,都能將其自身的觀點與經驗帶入工作,促進企業推升獲利、增加生產力並釋放創新。我們致力於創建一個公平無障礙的工作場所。台積公司承諾促進文化共融,讓每一位員工都覺得被重視且有能力為企業使命提供貢獻,並為全球各戶提供卓越服務。

  • 3/2
  • 3DIC flow engineer
  • 新竹市
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 3年以上工作經歷,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=451&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Advanced 2.5D and 3D packaging technology development. 2. Design flows, including APR, EM/IR, Thermal, and SI/PI, enablement. 3. Design kits generation and QA. 4. 3DIC solution adoption support with key customers. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 3/2
  • A10/A14 RD Integration Engineer
  • 新竹市
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=353&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. Responsibilities: 1. Development of world-class cutting-edge technology, and responsible for the success of the A10/A14 technology: (1) Process integration across process modules, including test key design, tape out, device analysis, simulation, model, and robust. (2) Test key designs for design rule validation, electrical modeling, and yield learning. (3) Characterization of state-of-the-art devices, spice targets‘ setting for modelling, occasional bench measurement. (4) Lot handling: periodically serves as on-duty engineer to coordinate device lots‘ handling. 2. Advanced process integration development: integration and baseline sustaining to meet process KPIs on performance/ yield/ reliability/ manufacturability in A10/A14 program. 3. Advanced integration baseline process transfer to volume production. 4. Data analysis to identify the issue and issue owner. 5. Co-work with various teams to evaluate new processes and solve the issue. 6. Routine integration logistic job. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 3/2
  • APR Engineer
  • 新竹市
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=545&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Hands on SOC chip/ block implementation from gate level netlist to GDS tape-out. 2. Develop IC design methodology 3. Chip tape-out; Design methodology development Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 3/2
  • Backend Software Engineer
  • 新竹市
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=541&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The Role: Software Engineer, Backend Development at TSMC IT focus on designing the most flexible, scalable backend architecture with optimized performance to support TSMC world-class manufacture, engineering and business systems. The ideal candidate has a highly technical multi-discipline engineering skillset that can push the limits of complex system design at large scale. Responsibilities: 1. Implement the features and services of backend for TSMC software products 2. Develop state-of-the-art code 3. Continue to refactor existing applications 4. Contribute to write tests to ensure software quality 5. Apply software design principles to ensure software quality 6. Ensure sustainability and performance of software applications 7. Willing to learn new IT technologies Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 3/2
  • Digital Design and Automation Engineer
  • 新竹市
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=532&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: Front-end to back-end large scale digital circuit design for system-on-chips and 3DICs, responsible for designing with the state-of-the-art process technologies and developing corresponding CAD flows that explores cutting edge design methodologies and latest EDA tools, either for internal first-in-the-industry testchips or leading customer’s products Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 3/2
  • IT Software Engineer
  • 新竹市
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=461&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Role: Building world-class cloud native infrastructure and ramping to high-volume production is key to enabling TSMC to scale worldwide. We are looking for a highly motivated engineer to join our global systems development team to support TSMC fabrication worldwide. The ideal candidate is highly technical with multi-discipline engineering skillset, that can push the limits of complex system design at large scale. Responsibility: 1. Develop state-of-the-art applications 2. Continue to refactor existing applications 3. Write and pass various kinds of tests (unit/feature/integration) to ensure software quality 4. Apply software design principles, such as 12-factor app, to ensure software quality 5. Ensure sustainability and performance of applications by working with SRE to define SLI/SLO and providing metrics for monitoring/alerting 6. Collaborate with peers in design, pair programming and code reviews 7. Willing to learn new IT technology Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 3/2
  • Layout Designer
  • 新竹市
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=399&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Support Layout production and quality verification for advanced node 2. Advanced node path finding for best speed, power and area by using layout technique. 3. Methodology development for layout optimization, productivity and quality enhancement. 4. Machine Learning/AI exploratory for layout quality and productivity enhancement. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 3/2
  • Mask Process Engineer
  • 台南市善化區
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=286&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Responsible for Mask process 2. Smooth product pilot run for next generation process 3. Continue improvement in tools reliability and stability. 4. Advanced technology transfer and Continuous Improvement Plan(CIP). 5. A highly motivated individuals with a strong technical background and capabilities to develop and sustain process technologies for flash memory and logic products. 6. Working with a team which may include device, integration, yield, lithography or external suppliers to drive leading-edge integrated module development, control, and improvements. 7. Be responsible for sustaining ownership, such as day-to-day operations, equipment troubleshooting, and mentoring technicians. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 3/2
  • Specialty Technology Module R&D Engineer_台南
  • 台南市善化區
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 1年以上工作經歷,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=392&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. In R&D, special technologies and mature processes are necessary for the continuous stable growth of TSMC. Specialty Technology builds on this firm foundation to develop new technologies, expand into new fields, and develop diverse product applications such as image sensing components, embedded technology, analog power and special technology, analog and sensing components, and special modules. Responsibilities: 1. R&D Process Engineer (Etch) (1) Be highly motivated and possess a strong technical background, demonstrating capabilities to develop and sustain etch process technologies for R&D specialty products. (2) Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians. (3) Co-work with other module, integration, or external suppliers to drive leading-edge integrated module development, control and improvements. 2. R&D Process Engineer (1) Responsible for CVD/PVD/CMP/Grind/Trim/DIF/BOND development activities in R&D specialty module. (2) Deliver innovation and solution to conquer the problems in wafer stacking processes. (3) Maintain processes POR and SPC control. 3. R&D Integration Engineer (1) Responsible for lot handling and process flow setup. (2) Process flow optimization to improve WAT or yield performance. (3) Need support holiday on-duty. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 3/2
  • A10 RD Device Engineer
  • 新竹市
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=302&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. Responsibilities: 1. 10 Å CMOS platform technology development. 2. With focus on transistor characterization, design, targeting, and performance step-up. 3. Lot handling & on-duty (night shift and weekend) rotation. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

  • 3/2
  • A10 RD Engineer (Coding)
  • 新竹市
  • 台灣積體電路製造【股】(台積電)(台積電)
  • 工作經歷不拘,學歷不拘,面議(經常性薪資達4萬元或以上)0 ~ 10 人次主動應徵
  • 【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=328&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. Responsibilities: 1. Develop AI rule generator and QC pattern generator for complex design rule. 2. Automation for Design Rule Quality Check flow by python. 3. Automation for Design Rule Quality Check flow by excel VBA. 4. Advance technology and design co-optimization for manufacturing & PPAC. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.