交大專區

1. Field support to all customers in the Northern part of Taiwan. 2. The field support is to support systems or machines of products. Main task is related to hardware but might involve software troubleshooting in some occasions. 3. On a rotary basis, job holder is required for on-call duty. 4. Obligate to learn new products through daily work and training events； is required to attend training events upon arrangement. 5. Required to participate in customer service meetings, maintain positive relationship with customer contacts. 6. Writes reports on time for the purpose of administration, service events, technical data and improvement. 7. Proactively takes ownership on resolving service problems. 8. Assisting in application and sales to promote products toward customers. 9. Other service which management assign to him.

1. Field support to all customers in the Hsinchu part of Taiwan. 2. The field support is to support systems or machines of products. Main task is related to hardware but might involve software troubleshooting in some occasions. 3. On a rotary basis, job holder is required for on-call duty. 4. Obligate to learn new products through daily work and training events； is required to attend training events upon arrangement. 5. Required to participate in customer service meetings, maintain positive relationship with customer contacts. 6. Writes reports on time for the purpose of administration, service events, technical data and improvement. 7. Proactively takes ownership on resolving service problems. 8. Assisting in application and sales to promote products toward customers. 9. Other service which management assign to him.

1. Tool installation and service support based in Hsinchu office but not limited to work in Hsinchu area. 2. Preventive maintenance on Photo-Mask Equipment. 3. Participate on service review meetings at customer site. 4. On-call duty at night and weekend is required on rotary base. 5. Windows operation system skill is required for tool software update. 6. Obligate to learn new products and training on new tool abroad. 7. Assistance in application and sales to promote products. 8. Other service task assigned by management.

• Conduct and complete final acceptance test at customer site. • Establish process and qualify bonding systems with customer. • Collaborate with customer in defining problem statements, analyzing abnormal data, resolving process issues, and improving process conditions. • Provide both on-site and remote applications support to customers. • Participate in customer meetings and maintain positive relationship with customer contacts. • Provide expertise and advice to bonder business unit to help product improvement. • Participate in projects related to new product introduction: definition, characterization, alpha testing, beta testing and customer use case development • Learn new products through daily work and training events; is required to attend training events upon arrangement. • Take ownership of application projects assigned by supervisor. • Other tasks are assigned by supervisor

職責要求 • Demonstrate your expertise for trouble shooting and design mechatronic system per DSC lithography product roadmap. • Possess strong DOE ability for system error analysis and execute test plan. • Involved in NPI project to MFG team for new system, feature and technology. Perform trouble shooting, technical support and process improvements to fulfill the goal of production output. • Involved in CIP and maintenance project for mature product. • Initiate and validate engineering changes and familiar with ERP system for document management. • Strong mindset and experience of risk assessment, cost evaluation and cross function cooperation. 任職資格 Requirements: • Experienced in designing electrical system of an automation machine covering component survey, cost evaluation, schematic planning, system integration. • Familiar with CAD and drawing PDM tool (AutoCAD, E3, etc). • Background of PLC or related PC based coding skill. • Good ERP concept and BOM maintenance experience. • Fluent in English speaking and writing. • More than 3 years working experience. Characteristic: • Teamwork: Able to working in a cross function and international environment. • Self-learning: Able to collect information to improve your knowledge pool, and also help the growth of the team by sharing knowledge. • Proactive: Willing to tackle with technical challenges and the mindset of seeking solutions for continuous improvement. • Planning: Result oriented thoughts for assigned task and project.

- Assemble according to schematics and procedure. Test and verify accomplished tasks. - Identify systematic problems and provide solutions based on a data-driven approach. - Initiate and implement continuous improvement-projects to improve quality, reliability and safety and to reduce costs. - Other tasks assigned by supervisor

職責要求 • Design tasks for devices and equipment for semiconductor manufacturing • Design according to customer’s configuration and specification • Creation of drawings, schematics, documents, parts lists and materials in SAP • Production support in the assembly, purchasing support for technical queries • Creation and technical evaluation of self-developed concepts and designs • Creation of risk assessments, assembly and installation instructions, calculations and designs • Involved in ECR (Engineering Change Requests) and CIP (Continued Improvement Projects) • Design must be in compliance with national and international regulations and standards. • Communicate with our counterpart-location in Germany. • Other tasks are assigned by your supervisor. 任職資格 • Master Degree in Electrical Engineering • Minimum of 5 years’ experience in similar position • Experience using CAD ZUKEN e3 or a similar CAD Software • Experience using SAP • Experience using MS Office • Very good English skills • Excellent communication skills in both, verbal and writing • Ideally Semiconductor Equipment Experience

職責要求 - Lead and manage application engineering teams focusing on lithography and wafer bonding technologies for semiconductor advanced package fabrication. - Provide technical expertise and support to customers in Taiwan regarding the usage and optimization of equipment, including mask aligners, coaters, developers, and wafer bonding tools. - Collaborate with R&D teams to implement customer-specific solutions, improving product performance and enhancing customer satisfaction. - Drive the development and integration of new processes for 3D packaging, TSV (Through-Silicon Via) bonding, and other advanced semiconductor applications. - Conduct customer training sessions, troubleshooting, and technical support to ensure optimal equipment performance. - Oversee process validation and testing, ensuring compliance with industry standards. - Regularly interface with customers to understand their challenges and tailor solutions that meet their needs. - Stay updated on the latest industry trends and technical advancements, ensuring the company‘s offerings remain competitive. 任職資格 - Master’s degree in Engineering related field or Material Science. - Minimum 6 years of experience in semiconductor lithography and bonding processes. - Minimum 3 years of team management experience. - Strong problem-solving skills, with the ability to troubleshoot technical issues in semiconductor processing. - Excellent communication and interpersonal skills to effectively interact with customers and cross-functional teams. - Fluent in English; knowledge of Mandarin is an advantage.

職責要求 1. 規劃集團SAP系統整體架構 2. SAP資訊系統管理及維護 3. SAP系統管理報表建立、分析、優化 4. 團隊管理、集團資料庫相關專案管理 任職資格 1. 至少8年資訊領域相關工作經驗 2. 具備團隊管理經驗，擅長溝通協調 3. 熟悉系統管理邏輯及善於解決問題(Windows/Linux/AIX) 4. 有SAP Basis及Oracle DB系統經驗者佳

職責要求 - 負責 Backend 程式設計並擬定開發計畫 - 檢視並優化服務安全性穩定性 - 持續增加測試以及重構來優化效能與改善程式品質 - 撰寫技術文件、內部流程SOP - 軟體工作環境以及軟體流程持續改善 任職資格 - 英文閱讀撰寫能力中級以上 - 三年以上程式開發經驗 - 熟悉 Node.js / Javascript ES6 / TypeScript - 熟悉 MongoDB, Redis - 瞭解 Distributed Services - 瞭解網路OSI七層架構與基本協定（http, https, websocket, tcp/ip ...等) - 擅長溝通協調，會使用不同的方式（如文件，畫圖，敘事）幫助溝通更順暢 加分項目 - 參與 open source 專案 - 瞭解 DevOps 服務部署方法和流程，使用過雲端服務經驗，如 AWS, GCP, Digital Ocean 等 - 暸解 System monitoring 實務 - 熟悉容器化部署 (Docker) - 有管理經驗，協助處理部門內外溝通事務，並分配部門工作與調配資源 - 有Devops相關工具與部署的持續優化經驗 - 熟悉其他中低階語言（c, c++, rust, golang...等) - 熟悉其他database - 有即時連線遊戲開發經驗 - 有前端經驗 - 喜歡玩撲克牌遊戲或是各種益智型桌遊/電玩

職責要求 1.基本程式撰寫。 2.與企劃人員討論專案內容與設計，使用Excel建立數學模型及工具。 3.計算遊戲理論值，分析、驗證數據。 4.遊戲數值參數設定調整及優化。 5.大量數據分析市場生態。 任職資格 1.一年以上遊戲機率經驗

職責要求 1. 使用AWS Cost Explorer進行詳細的成本和使用分析。 2. 利用AWS API開發客制化的工具與解決方案，以實現更自動化的資源管理和監控。 3. 進行RI (Reserved Instances) 和Saving Plans的深入分析，並提供購買建議以最大化節省。 4. 與團隊緊密合作，確保雲端資源的最佳配置且合乎財務目標。 任職資格 1. 資訊技術、電腦科學或相關領域。 2. 至少2年以上的AWS相關工作經驗。 3. 熟悉AWS Cost Explorer, AWS API, RI, 和Saving Plans。 4. 具備出色的分析、問題解決和溝通能力。

職責要求 1.擔任資訊部系統開發單位主管 2.協助資訊部主管進行系統分析、程式開發相關業務管理 3.維護系統以維持現有系統之正常運作 4.程式寫作指導 5.開發委託及外包廠商管理、規範擬定 6.新技術及新工具之引進及評估 7.負責督導部門內系統架構分析、系統設計、程式開發設計、系統測試、資料處理工作的正確性及人員差勤督導 任職資格 1.學歷：大專以上資訊科系畢 2.工作經驗：具程式設計師10年以上經驗、有需求訪談及系統設計分析5年以上經驗、具零售業經驗 3.工作技能或條件： (1)專業項目：具備系統規劃及設計能力、瞭解各項業務特性、掌握系統資訊化需求、熟悉使用者業務、資料庫管理知識、邏輯分析能力、熟悉Office、Visio、Project等軟體操作，至少熟悉3種開發工具(.NET、C#、java…)及資料庫 (2)管理項目：組織能力強，善於資源分配，時間、品質管理能力 (3)語文能力：中、英文聽說讀寫能力 (4)其他：高EQ、高抗壓、配合度佳、協調及溝通能力強，具談判技巧

職責要求 -Design and develop software solutions that meet the needs of the business in a microservice architecture for fintech and blockchain products -Lead the design and development of new features and functionality -Provide technical leadership and mentorship to junior team members -Ensure the quality and scalability of software solutions -Collaborate with cross-functional teams to gather requirements and deliver software solutions -Stay up-to-date with the latest software development trends and technologies 任職資格 -Bachelor‘s degree in Computer Science or a related field -5+ years of experience in software development -Strong programming skills in Java Spring Boot -Experience with Agile development methodologies -Experience with software design patterns and best practices -Strong problem-solving skills and ability to think creatively -Strong communication skills in English and ability to work well in a team environment -Experience with managing distributed systems and databases -Experience with AWS cloud computing platform -Experience with containerization technologies such as Docker or Kubernetes -Experience with continuous integration and continuous delivery (CI/CD)

職責要求 1. 開發並設計具有商業性質的後端服務系統。 2. 撰寫單元測試及整合測試。 3. 開發/部屬微服務。 4. 透過分析、設計、開發、維護系統獨立完成項目。 5. 與前端工程師、手機工程師、項目管理者、軟體測試工程師合作，並適時支援其他研發團隊。 6. 分析需求並協助完成開發規格與規劃。 7. 優化現有的編碼品質與表現。 8. 透過評估新技術與新開源軟體優化應用程式、服務及系統。 9. 積極參與產品特色及系統架構的集體研討。 10. 於後端開發方面指導其他組員。 任職資格 1. 具備五年以上Java開發的相關經驗。 2. 熟悉Spring framework, Spring boot與JPA。 3. 熟悉網頁相關科技(e.g. HTTP, REST, TCP/IP)。 4. 熟悉版本控制之工具(e.g. Git, SVN)。 5. 熟悉UML, OOP 與設計模式。 6. 熟悉 AWS 與阿里雲。 7. 熟悉分散式緩存、消息中介軟體。

職責要求 1. 線路設計/分析/功能測試 2. 產品EMC/EMI/ESD/FCC等相關對策處理 3. 協同韌體工程師設計偵錯PCB 4. 協同機構工程師進行Layout設計 5. 協同法規部門產出FDA 510(k)/TFDA等相關需求文件 6. 協同製程工程師進行產品轉移製造 7. BOM表管理、鼎新ERP系統操作 任職資格 1. 良好的溝通及協調能力 2. 熟悉Altium Designer 3. 工作經驗3年以上 4. 英文中等

職責要求 1.糖果、餅乾、餅類、蛋糕、西點類烘焙獨立作業 2.新品研發、成本計算管控、產製與規劃、訂定標準作業流程 3.進行市場資訊蒐集、分析，並建立資料庫 4.具有創新研發的熱忱，可獨立作業 5.提出有關操作、原料分配、設備安排等相關的修正建議，增加生產量或提升品質 6.年度新產品開發設計與規劃 7.食品原料分析與資料蒐集 8.產品打樣、製作與紀錄 9.客製化配方設計、研發及製作 10.ISO文件建立及成本計算 11.主管交辦任務事項 任職資格 1.熟悉食品原料性質及保質期、官能品評測試 2.大量化生產及製程控管能力 3.必須有3年以上烘焙產業經驗/廠房工作經驗,注重衛生及食安 4.溝通力佳、積極負責 5.具基礎電腦文書業能力 6.具耐壓性及抗壓性

職責要求 1.麵包類烘焙獨立作業 2.新品研發、成本計算管控、產製與規劃、訂定標準作業流程 3.進行市場資訊蒐集、分析，並建立資料庫 4.具有創新研發的熱忱，可獨立作業 5.提出有關操作、原料分配、設備安排等相關的修正建議，增加生產量或提升品質 6.年度新產品開發設計與規劃 7.食品原料分析與資料蒐集 8.產品打樣、製作與紀錄 9.客製化配方設計、研發及製作 10.ISO文件建立及成本計算 11.主管交辦任務事項 任職資格 1.熟悉食品原料性質及保質期、官能品評測試 2.大量化生產及製程控管能力 3.必須有3年以上烘焙產業經驗/廠房工作經驗,注重衛生及食安 4.溝通力佳、積極負責 5.具基礎電腦文書業能力 6.具耐壓性及抗壓性

職責要求 1. 內部、外部、整機之鈑金設計 2. 整機模組機構設計 3. 構成圖、組立圖、部品表等繪製及建立 4. 開發與量產機型設計優化 5. 其他主管交辦事項 任職資格 1.有3年銑車，整機設計經驗

職責要求 1.負責專案系統導入規劃與執行 2.負責專案流程進度控管 3.負責資源協調與管理 4.預估各專案成本，並擬定預算 5.新系統需求訪談/尋商/開發/客製化/介接/測試/導入 6.資訊服務政策之擬定與執行 7.資訊工作計劃及目標擬定 8.具多領域溝通及整合能力，能處理個項突發事件 任職資格 1.有 5 年以上的專案管理經驗 2.具硬體規劃建置經驗(資訊主機、網路設備) 3.具軟體開發導入經驗(系統整合) 4.抗壓性強且有責任感 5.邏輯良好且思路清晰