交大專區
職責要求 1.負責領導資訊部門,對公司ERP進行統籌運作與修正。 2.負責APP開發專案、資訊系統整合、策略規劃與發展方向。 3.負責公司資安政策,確保資訊安全。 4.管理網路、伺服器、機房等硬體設備的維護與優化,並維護內部使用者體驗。 任職資格 1.大學以上,5年以上管理經驗 2.需會Python或C#,熟ERP、APP開發流程
職責要求 1.BMC Firmware Development, maintaining existing codebase and resolving issues 2.Provide technical support to internal team member and customer 3.Willing to work in a dynamic and fast-paced environment 4.Friendly with OpenBMC or SPX arc 任職資格 1.Bachelor‘s degree in computer science or related field and 3+ years of software development experience 2.Familiar with Unix/Linux programming skill, including C/C++/Python 3.Hands on experience in Linux embedded system development 4.Understanding and Implementation of MCTP, PLDM, SPDM, Redfish, RDE, IPMI 5.Python and Robot Test framework for automation unit and functional test plans 6.Having self-learning ability, proactiveness, and innovative thinking
1.工程品質查核及物料管理。 2.文書製作、監工日報填寫與數量核算。 3.請款計價作業審核製作。 4.配合上級主管交辦事宜。
職責要求 1.新產品開發、既有產品維護 3.依需求開發API 4.系統故障排除 5.跨部門溝供開發功能性需求與技術可行性評估 任職資格 1.2年以上的實務開發經驗。 2.對程式物件導向與MVC架構有基本概念。 3.熟悉PHP, 資料庫, Linux基本指令, Git。 4.能夠根據不同的需求寫出安全性高、可讀性高、易擴充及維護的程式。 5.具備獨立開發能力及良好溝通能力,能有效收斂問題並提出解決方案。 6.願意嘗試學習新的技術。
職責要求 1.產品設計與模擬。 2.協助工廠生產產品執行改善分析及提出合適解決方案。 3.產品工程圖面規格的製作與核對確認。 4.開發階段 模具 生產製程問題檢討及改善。 5.協助業務定義客戶規格需求並提出解決方案。 6.專案進度追蹤規劃、主管交辦事項。 任職資格 1. 具connector經驗10年以上 2. 有工程塑膠材料及銅/鐵材料、電鍍相關知識 3. 具有2D、3D繪圖能力 4. 具有塑膠模具、連接器模具、沖壓模具等經驗 5. 具獨立思考能力,與廠商問題檢討能力 6. 配合工作任務出差
職責要求 1. 醫療器材開發前設計概念發想及技術可行性評估 2. 醫療器材整機或模組機構規劃,風險分析,設計,開發及驗證 3. 醫療器材先期評估、風險分析、設計、開發、驗證、量產導入之相關文件製作 4. 針對特定工程主題蒐集相關機構知識,進行專業分析 5. 協助產線解決量產中製造及製程中的機構相關問題 任職資格 1. 負責內視鏡之主機開發 2. 具備10年以上產品機構設計經驗(設備機構類別不考慮) 3. 具備3年以上管理經驗 4. 能配合海外出差 5. 英文-須能與海外客戶開會口語溝通 6 碩士學位以上
1. Field support to all customers in the Northern part of Taiwan. 2. The field support is to support systems or machines of products. Main task is related to hardware but might involve software troubleshooting in some occasions. 3. On a rotary basis, job holder is required for on-call duty. 4. Obligate to learn new products through daily work and training events; is required to attend training events upon arrangement. 5. Required to participate in customer service meetings, maintain positive relationship with customer contacts. 6. Writes reports on time for the purpose of administration, service events, technical data and improvement. 7. Proactively takes ownership on resolving service problems. 8. Assisting in application and sales to promote products toward customers. 9. Other service which management assign to him.
1. Field support to all customers in the Hsinchu part of Taiwan. 2. The field support is to support systems or machines of products. Main task is related to hardware but might involve software troubleshooting in some occasions. 3. On a rotary basis, job holder is required for on-call duty. 4. Obligate to learn new products through daily work and training events; is required to attend training events upon arrangement. 5. Required to participate in customer service meetings, maintain positive relationship with customer contacts. 6. Writes reports on time for the purpose of administration, service events, technical data and improvement. 7. Proactively takes ownership on resolving service problems. 8. Assisting in application and sales to promote products toward customers. 9. Other service which management assign to him.
1. Tool installation and service support based in Hsinchu office but not limited to work in Hsinchu area. 2. Preventive maintenance on Photo-Mask Equipment. 3. Participate on service review meetings at customer site. 4. On-call duty at night and weekend is required on rotary base. 5. Windows operation system skill is required for tool software update. 6. Obligate to learn new products and training on new tool abroad. 7. Assistance in application and sales to promote products. 8. Other service task assigned by management.
• Conduct and complete final acceptance test at customer site. • Establish process and qualify bonding systems with customer. • Collaborate with customer in defining problem statements, analyzing abnormal data, resolving process issues, and improving process conditions. • Provide both on-site and remote applications support to customers. • Participate in customer meetings and maintain positive relationship with customer contacts. • Provide expertise and advice to bonder business unit to help product improvement. • Participate in projects related to new product introduction: definition, characterization, alpha testing, beta testing and customer use case development • Learn new products through daily work and training events; is required to attend training events upon arrangement. • Take ownership of application projects assigned by supervisor. • Other tasks are assigned by supervisor
職責要求 - Lead and manage application engineering teams focusing on lithography and wafer bonding technologies for semiconductor advanced package fabrication. - Provide technical expertise and support to customers in Taiwan regarding the usage and optimization of equipment, including mask aligners, coaters, developers, and wafer bonding tools. - Collaborate with R&D teams to implement customer-specific solutions, improving product performance and enhancing customer satisfaction. - Drive the development and integration of new processes for 3D packaging, TSV (Through-Silicon Via) bonding, and other advanced semiconductor applications. - Conduct customer training sessions, troubleshooting, and technical support to ensure optimal equipment performance. - Oversee process validation and testing, ensuring compliance with industry standards. - Regularly interface with customers to understand their challenges and tailor solutions that meet their needs. - Stay updated on the latest industry trends and technical advancements, ensuring the company‘s offerings remain competitive. 任職資格 - Master’s degree in Engineering related field or Material Science. - Minimum 6 years of experience in semiconductor lithography and bonding processes. - Minimum 3 years of team management experience. - Strong problem-solving skills, with the ability to troubleshoot technical issues in semiconductor processing. - Excellent communication and interpersonal skills to effectively interact with customers and cross-functional teams. - Fluent in English; knowledge of Mandarin is an advantage.
職責要求 • Design tasks for devices and equipment for semiconductor manufacturing • Design according to customer’s configuration and specification • Creation of drawings, schematics, documents, parts lists and materials in SAP • Production support in the assembly, purchasing support for technical queries • Creation and technical evaluation of self-developed concepts and designs • Creation of risk assessments, assembly and installation instructions, calculations and designs • Involved in ECR (Engineering Change Requests) and CIP (Continued Improvement Projects) • Design must be in compliance with national and international regulations and standards. • Communicate with our counterpart-location in Germany. • Other tasks are assigned by your supervisor. 任職資格 • Master Degree in Electrical Engineering • Minimum of 5 years’ experience in similar position • Experience using CAD ZUKEN e3 or a similar CAD Software • Experience using SAP • Experience using MS Office • Very good English skills • Excellent communication skills in both, verbal and writing • Ideally Semiconductor Equipment Experience
職責要求 • Demonstrate your expertise for trouble shooting and design mechatronic system per DSC lithography product roadmap. • Possess strong DOE ability for system error analysis and execute test plan. • Involved in NPI project to MFG team for new system, feature and technology. Perform trouble shooting, technical support and process improvements to fulfill the goal of production output. • Involved in CIP and maintenance project for mature product. • Initiate and validate engineering changes and familiar with ERP system for document management. • Strong mindset and experience of risk assessment, cost evaluation and cross function cooperation. 任職資格 Requirements: • Experienced in designing electrical system of an automation machine covering component survey, cost evaluation, schematic planning, system integration. • Familiar with CAD and drawing PDM tool (AutoCAD, E3, etc). • Background of PLC or related PC based coding skill. • Good ERP concept and BOM maintenance experience. • Fluent in English speaking and writing. • More than 3 years working experience. Characteristic: • Teamwork: Able to working in a cross function and international environment. • Self-learning: Able to collect information to improve your knowledge pool, and also help the growth of the team by sharing knowledge. • Proactive: Willing to tackle with technical challenges and the mindset of seeking solutions for continuous improvement. • Planning: Result oriented thoughts for assigned task and project.
- Assemble according to schematics and procedure. Test and verify accomplished tasks. - Identify systematic problems and provide solutions based on a data-driven approach. - Initiate and implement continuous improvement-projects to improve quality, reliability and safety and to reduce costs. - Other tasks assigned by supervisor
職責要求 1. 線路設計/分析/功能測試 2. 產品EMC/EMI/ESD/FCC等相關對策處理 3. 協同韌體工程師設計偵錯PCB 4. 協同機構工程師進行Layout設計 5. 協同法規部門產出FDA 510(k)/TFDA等相關需求文件 6. 協同製程工程師進行產品轉移製造 7. BOM表管理、鼎新ERP系統操作 任職資格 1. 良好的溝通及協調能力 2. 熟悉Altium Designer 3. 工作經驗3年以上 4. 英文中等
職責要求 1. 分配與管理部門團隊任務,確保工作達成。 2. 蒐集、分析與提報化學品相關議題並優化既有作業。 3. 新化學品試作、測試,協助化工專案驗證,並導入量產。 3. 跨單位溝通以達成共識,改善化工作業流程,預防問題產生,確保產品品質合乎要求。 4. 培訓團隊內夥伴,提升其專業知識技能。 任職資格 1. 大學畢業(數/理/化學相關科系尤佳) 2. 具高分子、接著劑與基礎化學化工知識 3. 具鞋業化工工作經驗、生產安全知識者尤佳 4. 5年以上鞋廠化工經驗,具化學、化工知識,熟悉製鞋生產技術,擅長PPT簡報 5. 英文中等
職責要求 1.糖果、餅乾、餅類、蛋糕、西點類烘焙獨立作業 2.新品研發、成本計算管控、產製與規劃、訂定標準作業流程 3.進行市場資訊蒐集、分析,並建立資料庫 4.具有創新研發的熱忱,可獨立作業 5.提出有關操作、原料分配、設備安排等相關的修正建議,增加生產量或提升品質 6.年度新產品開發設計與規劃 7.食品原料分析與資料蒐集 8.產品打樣、製作與紀錄 9.客製化配方設計、研發及製作 10.ISO文件建立及成本計算 11.主管交辦任務事項 任職資格 1.熟悉食品原料性質及保質期、官能品評測試 2.大量化生產及製程控管能力 3.必須有3年以上烘焙產業經驗/廠房工作經驗,注重衛生及食安 4.溝通力佳、積極負責 5.具基礎電腦文書業能力 6.具耐壓性及抗壓性
職責要求 1.麵包類烘焙獨立作業 2.新品研發、成本計算管控、產製與規劃、訂定標準作業流程 3.進行市場資訊蒐集、分析,並建立資料庫 4.具有創新研發的熱忱,可獨立作業 5.提出有關操作、原料分配、設備安排等相關的修正建議,增加生產量或提升品質 6.年度新產品開發設計與規劃 7.食品原料分析與資料蒐集 8.產品打樣、製作與紀錄 9.客製化配方設計、研發及製作 10.ISO文件建立及成本計算 11.主管交辦任務事項 任職資格 1.熟悉食品原料性質及保質期、官能品評測試 2.大量化生產及製程控管能力 3.必須有3年以上烘焙產業經驗/廠房工作經驗,注重衛生及食安 4.溝通力佳、積極負責 5.具基礎電腦文書業能力 6.具耐壓性及抗壓性
職責要求 1. 內部、外部、整機之鈑金設計 2. 整機模組機構設計 3. 構成圖、組立圖、部品表等繪製及建立 4. 開發與量產機型設計優化 5. 其他主管交辦事項 任職資格 1.有3年銑車,整機設計經驗
職責要求 1.負責專案系統導入規劃與執行 2.負責專案流程進度控管 3.負責資源協調與管理 4.預估各專案成本,並擬定預算 5.新系統需求訪談/尋商/開發/客製化/介接/測試/導入 6.資訊服務政策之擬定與執行 7.資訊工作計劃及目標擬定 8.具多領域溝通及整合能力,能處理個項突發事件 任職資格 1.有 5 年以上的專案管理經驗 2.具硬體規劃建置經驗(資訊主機、網路設備) 3.具軟體開發導入經驗(系統整合) 4.抗壓性強且有責任感 5.邏輯良好且思路清晰