交大專區

弱電設備的安裝及維修。服務內容包括網路.電話.門禁.監視器及音響線路佈線及安裝施做。

協助弱電設備的安裝及維修。

搬運風管材料,工具準備和施工現場環境整理 學習各種工具,電動工具及半自動機械,教導看圖施工,了解風管走向籍管線配圖 指導風管組裝,固定,保溫及切割技術, 證照培訓6小時職安卡及高空作業 以個人學習進度調整薪資,薪資調幅大 工程案量大,北中南,收入穩定

***本職缺將安排完整的教育訓練*** 一、講座教育訓練(系統構成、機台構成、作業SOP) 二、實機教育訓練(操作教育、設備校正教育、品質檢查教育、電源盤調整教育) 【工作內容】 1.台積電F20廠 。 2. 執行自動化設備之相關安裝校正。 3. 維持廠內自動化系統之正常運作。 4. 進行自動化設備維護、保養、異常排除。 5.自動化設備耗材更換 6.無相關工作經驗 〝可〝 團隊裡有完善的新人教育訓練 【其他條件】 1.個性需積極、細心、負責、配合度高。 2.需有無塵室工作且著全套無塵衣經驗。 3.可配合設備導入常駐客戶端工作。 4.需配合常態性出差。

***本職缺將安排完整的教育訓練*** 一、講座教育訓練(系統構成、機台構成、作業SOP) 二、實機教育訓練(操作教育、設備校正教育、品質檢查教育、電源盤調整教育) 【工作內容】 1.台積電F18*F14廠 。 2. 執行自動化設備之相關安裝校正。 3. 維持廠內自動化系統之正常運作。 4. 進行自動化設備維護、保養、異常排除。 5.自動化設備耗材更換 6.無相關工作經驗 〝可〝 團隊裡有完善的新人教育訓練 【其他條件】 1.個性需積極、細心、負責、配合度高。 2.需有無塵室工作且著全套無塵衣經驗。 3.可配合設備導入常駐客戶端工作。 4.需配合常態性出差。

1.Spice model generation and verification for advanced and specialty technologies 2.Spice Model Parameter Extraction 3.Test key design 4.Internal and external customer support 5.Advanced modeling tools, extraction algorithms and model equation benchmarking

1.製程開發執行, 新技術開發之時程掌控，以符合製程整合新製程開發之需求，提高客戶之滿意度 2.開發模組製程, 使先進製程良率達到量產需求 3.維持製程穩定度, 降低製程缺陷數目及提高機台妥善率 4.線上異常處理及後續成效追蹤 5.建立標準規範(SOP)，改善現行系統漏洞 6.突破性製程研發改善，提高公司競爭力

負責 eNVM IP 開發 1.負責標準eNVM IP　電路模擬及驗證 2.負責Verilog Model 產生及驗證以確保品質 3.負責Testchip 電路設計及模擬，驗證 4.負責 Data Sheet 驗證以確保品質

1.執行統計大數據分析與開發資料科學演算法及設計與訓練深度學習模型，並運用技巧調適模型，使其具備最佳的預測能力。 2.利用深度學習模型開發系統雛形，並驗證可以提升廠內人員生產力，機台產能，產品良率，與降低產品 cycle time. 3.開發AI新技術與研發 AI 關鍵零組件，專案執行，產學合作

1.元件設計及開發 2.元件特性開發量測及評估 3.電腦輔助元件設計 4.Testkey設計及分析

提供客戶工程解決方案，提升客戶工程服務滿意度 1.承接業務需求, 導入並完成客戶專案(包含新客戶或新產品) 2.配合業務發展,不定時結合內部開發成果,主動提供客戶技術需求及解決方案,確保客戶競爭力 3.整合內部資源,提供客戶產品開發所需之工程服務 4.協助客戶產品順利進入量產, 整合工程資源,持續提升產品良率 5.完成產品Tape out及Pilot相關事宜

1.自動化與品質系統的管理與改善, 提昇部門生產效率 2.品質與自動化專案推行 3.PT 品質系統管理-稽核 , 教育訓練 , 改善專案 4.FAB 應用系統管理 - 報廢 , 復活 , PN , SOP , 攜出入 5.自動化需求開發與整合 6.自動化系統管理與改善

1.Lead the development of advanced RFSOI and RFSOI-3DIC technology platforms for next-generation communication solutions. 2.Design and qualify new process modules and RF device structures to enhance platform capability and performance. 3.Establish and validate new process flows in Design-Start Modules (DSM) for customer-specific applications. 4.Collaborate closely with customers on new product verification, process customization, and technical alignment. 5.Coordinate cross-functional activities from design to qualification, ensuring robust integration and yield performance.

1.Develop and optimize 300mm Silicon Photonics (SiPh) technology platforms, including pluggable modules, co-packaged optics (CPO), and photonic interposer solutions. 2.Collaborate with internal R&D and module engineering teams to define and execute SiPh process flows. 3.Align device and process requirements with customers through technical discussions and solution deep dives. 4.Coordinate with external OSATs and partners for PIC/EIC characterization and packaging integration. 5.Apply DOE, FMEA, and control plan methodologies to ensure robust development and effective risk mitigation across all phases

1.Drive R&D and process integration for 2.5D and 3DIC packaging platforms. 2.Lead the development and qualification of new unit modules and device structures. 3.Establish and validate new process flows in Design Start Modules (DSM) to support custom product platforms. 4.Collaborate directly with customers on product requirements, verification testing, and technical solutions. 5.Apply structured methodologies such as FMEA, DOE, and control plans to optimize performance and mitigate risks.

1.Support new customer product introduction into the FAB, ensuring smooth pilot and tape-out processes. 2.Improve yield and ensure stability in in-line, wafer acceptance test (WAT), and chip probe (CP) results. 3.Define and implement standard operating procedures (SOPs) for production. 4.Collaborate with module engineers to resolve production issues related to yield, reliability, and in-line parameters. 5.Work cross-functionally to develop customized process flows that meet customer need.

1.Monitor in-line process parameters, address abnormalities, and make disposition decisions on lots to ensure smooth production flow. 2.Assist in productivity and yield improvement projects through data analysis and process experiments. 3.Support the establishment and maintenance of key process parameters for semiconductor tools. 4.Evaluate new materials, tools, and methods to enhance manufacturing quality and efficiency.

1 了解使用者需求及資訊技術的應用,及各項品質管理,專案管理的技能,以做好系統的日常管理,專案管理,及軟體工程。 2.執行專案及主管交付任務,達成專案目標及日管目標,以滿足客戶需求並符合公司營運需求及提高用戶滿意度 承接部門專案,與相關單位溝通，了解需求,爭取資源,做好專案管理。 處理客戶需求,提供最佳的服務品質與效率 培養技術能力:相關 domain knowledge，軟體工程能力,IT 技術。 改善品質問題,並建立標準流程

1.Monitor and resolve in-line SPC (Statistical Process Control) issues, equipment abnormalities, and lot handling in a timely manner. 2.Maintain equipment capability and ensure availability to meet production demand. 3.Collaborate with production and process teams on tool usage for troubleshooting, maintenance, and output. 4.Participate in troubleshooting and quality improvement projects to enhance equipment reliability and production outcomes. 5.Evaluate new equipment, materials, and retrofits to drive performance gains and production efficiency.

1.Conduct TCAD-based research and simulations to explore novel device concepts and architectures. 2.Develop, document and calibrate TCAD simulation decks in collaboration with cross-functional project teams. 3.Execute TCAD design of experiments (DOE) and generate tuning decks to support device optimisation. 4.Design test keys and layout structures for silicon validation, including bench-level electrical measurements and performance analysis. 5.Run structured experiments to fine-tune device parameters while safeguarding long-term reliability.