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Please also apply through: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Tape-Out-Engineer_R-10063230 Role Overview, Responsibilities, and Qualifications The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes. Key Responsibilities 1. Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing. 2. Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors. 3. Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability. 4. Ensure all deliverables conform to foundry requirements. 5. Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement. Qualifications 1. Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred). 2. Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows. 3. Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines. 4. Willingness to work with flexible working hours to support critical Tape-outs. Effective communication in English for collaborating across technical teams. This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.

Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/APAC-Foundry-Operations-Senior-Principal-Engineer_R-10062827 Job Description The APAC Foundry Operation team works with foundry partners on technologies which are evaluated and/or subjected to production. The key areas of responsibility of the jobholder are: - Lead the release and transfer of process options at foundries. - Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process - Lead and steer the projects towards timely completion to support NXP business needs. - Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc. The requirement fulfilling the job: - Bachelor or MSc in physics, material engineering or electrical engineering. In-depth knowledge of semiconductor physics, process development and manufacturing. - ＞10 years of experience with semiconductor process integration, working in foundries’ production or development teams. - Hands on experience in being a lead; leading teams with responsibilities in development, transfer or production projects. - All rounded knowledge on process integration, product testing, reliability testing, tapeouts, device physics will be needed in the discharge of duties as a project/ integration lead. - Good communication skills. - Pro-active working attitude, creative, pragmatic, enterprising and result driven. - Having the ability to influence and steer a discussion. - Familiar in managing/working with foundries, maximizing leverage from foundries.

***Please upload English resume onto our official platform: https://reurl.cc/qpRoqg Job Description - To work with operation/maintenance to ensure production smoothly. - To assist action confirmations with system monitors. - To work with Engineers for yield improvements from the study of stable plasma cleaning as the leading indicator. Job Qualification: - Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structures - Bachelor‘s or Master‘s student in Material/Science/Electronic Engineering or related - Available to work at least 3 days/week. - Good verbal and written English communication skills - MS Office or Programming skill - Self-motivated, results oriented, willing and eager to learn, proactive attitude

***Please upload English resume onto our official platform: https://reurl.cc/Em0W00 Job Description - To work with IT and Equipment/Production team for MMS (Machine Maintenance Solution) spare part and tool management system build up - To assist Automation project of introducing AMHS (Automatic Material Handling System) for product transportation from wire bond stage to molding stage. Qualifications: - The candidate must be pursuing a Bachelor’s or Master’s degree in Mechanical/Electronic Engineering or related. - Available to work 3 days/ week. - Good verbal and written English communication skills - MS Office, AutoCAD or Programming skill - Self-motivated, results oriented, willing and eager to learn, proactive attitude

Job Description -　Main contact window with business lines (BLs) to deliver a high quality and manufacturable product for IC test production, meeting or exceeding the required time to market or product cost. -　Take lead of new product introduction (NPI) for IC test -　To coordinate with related BLs (business line) and align with wafer/final test factories to prepare the product transfer -　To improve new product introduction procedure to enable smooth product transfer -　To reduce risk and impact to customers and factories, escalation management, e.g. reduce risk and impact by right and timely escalation -　To ensure no gap on test tooling availability Facilitate IC test data review and process for planning forecast, take responsibility on test technical data (and improvement plan) in time and accuracy -　To follow up test improvement projects, hold lots, progress of New Product Introduction, test buy off…etc. -　Process of Test Engineering Notice and Enovia ECO Requirement -　Bachelor degree (or above), Engineering background is preferred. -　Excellent communication skills (English/Mandarin, TOEIC＞600) -　Good logic thinking -　Be familiar with MS Office tool -　1 yrs experience in IC testing or related working experience is preferred

- Ensure compliance with Taiwan electrical regulations, SEMI standards, and safety codes. 負責廠區電力系統之運轉、維護及管理，確保符合台灣電業法規、SEMI規範及相關安全要求。 - Manage and maintain facility electrical systems, including: High/low voltage distribution (HV/LV), Switchgear, transformers, UPS, and generators. 負責廠務電力系統設備之日常管理與維護，包括：高低壓配電系統（HV/LV）/ 開關設備（Switchgear）/ 變壓器（Transformer）/ UPS不斷電系統 / 緊急發電機系統（Generator） - Proficient in AutoCAD for electrical drawings and single line diagrams 繪製及維護電力系統圖面，包含 AutoCAD 電氣圖及單線圖（Single Line Diagram）。 - Strong knowledge of high-voltage power systems, including: Protective relay operation, Single line diagram development and interpretation, Familiar with motor control systems. 負責高壓電力系統規劃、操作與分析，包括：保護電驛（Protective Relay）設定與應用 / 單線圖建立與判讀 / 馬達控制系統（Motor Control System）管理與改善 - Handle emergency response for power-related incidents and recovery planning. 處理廠區電力異常事件，執行緊急應變、故障排除及復電計畫。 - Ensure power reliability and quality to support critical manufacturing tools 確保廠區關鍵電力系統穩定運作，維持生產設備供電可靠度與電力品質。 - Monitor and improve system performance, capacity, and efficiency. 監控電力系統運轉績效，持續改善系統容量、可靠度與能源使用效率。 - Lead preventive maintenance (PM), especially annual electricals PM activity and troubleshooting for power systems. 規劃及執行預防保養（PM）作業，包含年度高低壓停電保養、設備點檢及電力系統故障分析。 - Coordinate power system upgrades, expansions, and projects 負責電力系統擴充、升級及改善專案規劃與執行。 - Support new tool installation(Hook-up) and capacity ramp-up planning. 配合產線及機台建置需求，執行廠務配電規劃、Hook-up二次配支援及產能擴充評估。 - Analyze power consumption and drive energy-saving initiatives. 分析廠區用電數據，推動節能改善專案及能源管理措施，提升整體能源使用效率。 Qualifications: - Bachelor‘s degree or above, preferable in Electrical Engineering 大學以上學歷，電機工程、電力工程等相關科系尤佳。 - At least 3+ years of experience in industrial or semiconductor facilities. 具 3 年以上廠務電力系統、工業配電系統或半導體廠務相關工作經驗。 - Relevant certifications is a plus. (Electrical Engineer license, HV certification, etc.) 具電機技師、高壓電工作業相關證照者優先。 - Familiar with PLC operation and basic control logic is a plus. 熟悉 PLC 操作及基礎控制邏輯者佳。 - Experience in Energy Management Systems (EMS), such as ISO 50001, and HVAC systems is a plus. 具能源管理系統EMS(Energy Management System)或 ISO 50001 能源管理系統導入經驗者佳。 - Experience in facility utility systems such as central air conditioning and chilled water systems is preferred. 具 中央空調、冰水系統等廠務公用系統經驗者佳。 - Experience in facility operations within semiconductor Assembly & Test (A&T) plants is highly preferred. 具半導體封裝測試廠（Assembly & Test）廠務經驗者尤佳。

***Please apply for this position on NXP official website: https://pse.is/8ms2kr Role Purpose Lead the development and optimization of high-voltage (HV) and BCD device architectures. This role requires a deep understanding of device physics and a data-driven approach to ensure industry-leading performance and reliability for power management solutions. Key Responsibilities － Device Development: Lead the architecture design and optimization of HV devices (LDMOS, EDMOS, ESD) on 180nm to 55nm BCD nodes. － Physics Analysis: Analyze and optimize Device Physics parameters, including BV, Rdson, SOA, and reliability (HCI/NBTI). － Simulation & Modeling: Utilize TCAD for 2D/3D process and device simulations to accelerate development cycles. － Device Verification: Define verification plans and execute statistical analysis using JMP for DOE and WAT data. － Design Integration: Work within Cadence environments for layout review and test structure design. － Cross-functional Collaboration: Partner with PI and PE teams to resolve yield, reliability, and manufacturing bottlenecks. Required Qualifications － Experience: Master‘s or Ph.D. in EE, Physics, or related field with 10+ years of semiconductor industry experience. － Technical Expertise: 1. Profound knowledge of Device Architecture and Device Physics. 2. Hands-on experience in 180nm to 55nm BCD process nodes. － Tools: 1. Expertise in TCAD (Sentaurus / Silvaco). 2. Expertise in JMP for statistical data analysis. 3. Proficiency in Cadence (Layout/Virtuoso). Preferred Qualifications (Plus) － Advanced Power Devices: Experience with GaN, SiC, or IGBT development. － Silicon Photonics: Knowledge of Photonics integration and device physics. － Domain Knowledge: 1. Process Integration (PI): Understanding of mask flow and doping profiles. 2. Product Engineering (PE): Experience in CP/FT data correlation and yield enhancement. Competencies － Accountability: Strong ownership of project milestones and outcomes. － Critical Thinking: Ability to identify root causes in complex device failures. － Interpersonal Skills: Effective communication across design and foundry teams. － Data-driven: Committed to objective decision-making through rigorous data analysis.

***Please upload English resume onto our official platform: https://reurl.cc/9WEqOV NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 45,000 employees in more than 35 countries. Opportunity Join a world class team working on state of the art Tier 1 automotive products. NXP‘s Highly Profitable Business Line Advanced Power Solutions is seeking experienced Mobile Power Analog Designers. We engage directly with the most visible and successful mobile companies. Site Job Description Working in the Power Delivery group of the Advanced Power Solutions business line, candidate will be part of a team developing fast charging and power delivery solutions for mobile applications. Task and responsibilities - Responsible for technical executions from block design, verification, and validation for mixed signal integrated circuits, Guarantee the technical deliverables of his jobs in terms of quality and performance; - This includes system definition, block architecture, circuit design, simulation and layout. All aspects require good engineering skills together with analysis, creativity, collaboration and customer interaction. - Must have strong expertise in analog design theory and device physics, and be capable of applying these to original and novel techniques that can provide significant value. - Write articles for technical publications and conferences, and provide email and phone support for assigned products. - Documentation for design reviews and design notes, layout guidance, and other cell design activities. - Our work culture encourages engineering innovation and creativity. Engineers are expected to file patents, publish papers or technical articles and to maintain awareness of current technical developments. Design engineers are part of a team and interact globally and locally with customers, design partners, product, test and packaging engineers, program management, quality, and business teams. Qualifications - Candidate needs to hold a minimum of a B.S. degree in electrical engineering. M.S. degree is preferred. - At least 10 years direct experience designing analog and mixed-signal transistor level circuitry for power management applications. - Ability to design traditional analog MOS and BJT circuits such as bandgap references, amplifiers, oscillators, detection circuits, linear LDO and switching regulators. - Ability to design multiphase DC-DC switching converter and experienced in current balance circuit. - Knowledge in digital controlled loop design. - Other desirable skills include experience with mixed-signal design tools and flow, reading and writing Verilog AMS models.

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在飛豬，我們不只是一個團隊，更是一個大家庭。 無論是否有相關經驗，只要您願意挑戰，我們都歡迎您成為我們的夥伴。 【職務描述】 1. 管理國際地產買賣案件，維護客戶關係 2. 協助解決國際地產相關問題，提供專業建議和支持 3. 積極協助拓展國際地產業務 4. 規劃與執行品牌行銷內容，包含社群貼文、EDM、活動宣傳等 5. 發想文案創意，執行影音內容規劃、影片剪輯與後製，提升品牌曝光與互動率 6. 協助活動企劃及相關行銷專案 7. 完成主管交辦事項 8. 精通英文者佳 【需具備的能力】 設計工具：熟悉 Canva 或其他平面設計、製圖軟體，可製作圖文素材與宣傳品 影片剪輯：具備剪輯軟體操作能力 共同成長：在我們這個大家庭，我們一起成長、互相支持，實現個人和團隊目標。 服務熱忱：我們熱愛幫助客戶，成為他們信任的夥伴，並提供最佳的顧問服務。 面對挑戰：我們勇於面對困難與迎接挑戰，並通過努力實現成功的目標。 我們期待您的加入，一起創造成功的故事！

1.冷凍庫作業 (入貨、出貨、儲位整理、開單、盤點)。 2.堆高機操作。 3.拆櫃、裝櫃。 4.需輪班，可配合加班。 5.協助客戶進出貨事宜。 6.工作環境清潔及維謢。 7.冷凍機具及設備基礎維護及保養。 8.其他主管交辦事項。

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1.擔任列車內安全維護工作。 2.月休6-7天,日夜皆可。 其他福利： 1.中秋, 端午禮金, 生日禮金。 2.年終獎金。 3.提撥6％退休金。

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