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Please also apply through: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Tape-Out-Engineer_R-10063230 Role Overview, Responsibilities, and Qualifications The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes. Key Responsibilities 1. Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing. 2. Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors. 3. Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability. 4. Ensure all deliverables conform to foundry requirements. 5. Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement. Qualifications 1. Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred). 2. Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows. 3. Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines. 4. Willingness to work with flexible working hours to support critical Tape-outs. Effective communication in English for collaborating across technical teams. This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.

***Please upload English resume onto our official platform: https://reurl.cc/qpRoqg Job Description - To work with operation/maintenance to ensure production smoothly. - To assist action confirmations with system monitors. - To work with Engineers for yield improvements from the study of stable plasma cleaning as the leading indicator. Job Qualification: - Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structures - Bachelor‘s or Master‘s student in Material/Science/Electronic Engineering or related - Available to work at least 3 days/week. - Good verbal and written English communication skills - MS Office or Programming skill - Self-motivated, results oriented, willing and eager to learn, proactive attitude

***Please upload English resume onto our official platform: https://reurl.cc/Em0W00 Job Description - To work with IT and Equipment/Production team for MMS (Machine Maintenance Solution) spare part and tool management system build up - To assist Automation project of introducing AMHS (Automatic Material Handling System) for product transportation from wire bond stage to molding stage. Qualifications: - The candidate must be pursuing a Bachelor’s or Master’s degree in Mechanical/Electronic Engineering or related. - Available to work 3 days/ week. - Good verbal and written English communication skills - MS Office, AutoCAD or Programming skill - Self-motivated, results oriented, willing and eager to learn, proactive attitude

經典男女養生館）鳳山建國店誠徵專業優質按摩師 正職 兼職～19年老店品牌有穩定客人！ 高雄分店10家 包廂優美 Vip專屬個人衛浴設備 『經典 養生館』 誠徵 優質芳療師 (客源充足無經驗可) 友善工作環境 創立2005年高雄連鎖 無色情 無色情 無色情！ ※工作時段： 晚上6-11 晚上7-12 晚上8-12 假日班 ※ 月休6至8天 ※ 無限制出國假 ※平均月收4萬~12萬 ※不簽約、不扣押薪水、不話術 高抽成→七拆 10萬八拆 歡迎+Line詢問: 0975289885

1.冷凍庫作業 (入貨、出貨、儲位整理、開單、盤點)。 2.堆高機操作。 3.拆櫃、裝櫃。 4.需輪班，可配合加班。 5.協助客戶進出貨事宜。 6.工作環境清潔及維謢。 7.冷凍機具及設備基礎維護及保養。 8.其他主管交辦事項。

職掌: 1.掌握產品市場新趨勢，掌握並提升產品的競爭力，提供內部人員專業諮詢與建議。 2.規劃產品策略、藍圖以及管理產品生命週期。 3.管理產品開發與量產之相關協調工作或技術移轉專案(包括專案規劃、專案組織成立以及開發時程、成本、品質等之控管等)。 4.採購核價、議價、下單、成本掌控及交期控制、進行驗收作業。 5.建立、更新供應商資料（如：貨品價格、規格和到貨時間），以選擇最佳供應商。 6.供應商維護及管理，與良好供應商維持良好關係。 7.開發新產品，新供應商蒐集，找尋品質好、成本低、配合度高的優良供應商。 8.提供緊急措施，使需求業務可做緊急採購。 9. 解決商品瑕疵退貨等問題。 10. 具備國貿、熟悉進口/三角貿易實務流程及採購流程。 11.語文能力(JLPT N1或N2檢定程度) 12.電腦能力(包含邏輯、組織、文書及簡報)、Vlookup&函數試算能力。 13.表達溝通能力(包含說服力) 14.普世價值:配合度、團隊合作特質 加分條件: 具品牌概念與代理品牌經驗。 公司官方網站 https://www.wonson.com.tw/zh-TW

工作內容： • 與倉庫、報關行、快遞及貨運業者溝通，處理出口及提貨相關作業 • 執行每日成品與半成品出貨作業（含 SAP 系統操作、出口報單種類、統計方式、開立提單） • 接收內部出貨指令，協調倉庫進行包裝作業 • 與各單位協調，完成跨部門作業 • 與報關行及貨運代理（Forwarder）聯繫並進行工作協調 • 追蹤貨件遞送進度及異常狀況 • 執行主管交辦事項 • 每兩個月調整班表，輪值月份需於每週六上班，並於平日排休 應徵條件: • 大學畢業，國際貿易、運籌管理、企業管理相關科系尤佳 • 英文能力：聽略懂、說略懂、讀中等、寫中等 • 具 1 年以上相關工作經驗者佳 • 具英檢證書或 TOEIC 550 分以上者佳 • 熟悉 Microsoft Word（如函數及樞紐分析）及 Excel 等辦公軟體者優先

The key areas of responsibility of the jobholder are: - Collaborate closely with foundries, NXP technology teams, and business lines to qualify and release advanced FinFET processes. - Provide technical leadership in semiconductor device physics, especially in FinFET architecture and behavior. - Interface with internal and external stakeholders on critical development and transfer projects. - Lead and steer projects to meet timelines and business objectives. - Make key decisions on process integration, balancing technical, logistical, and strategic factors. - Support NTI process transfers within foundries and NXP joint ventures Requirements / preferences: - Bachelor‘s or Master‘s degree in Electrical Engineering, Physics, or related field. - Minimum 10 years of experience in semiconductor device engineering, with a strong focus on advanced logic/RF devices. - Proven hands-on experience with HKMG and FinFET technologies in production or development environments. - Deep understanding of semiconductor device physics, especially HKMG and FinFET. - Strong analytical skills in yield enhancement and electrical data analysis. - Fluent in English and Mandarin. - Demonstrated leadership in development, transfer, or ramp-up projects. - Excellent communication and influencing skills. - Proactive, pragmatic, and results-driven mindset. - Experience working with foundries and leveraging external manufacturing capabilities .

***Please apply for this position on NXP official website: https://pse.is/8ms2kr Role Purpose Lead the development and optimization of high-voltage (HV) and BCD device architectures. This role requires a deep understanding of device physics and a data-driven approach to ensure industry-leading performance and reliability for power management solutions. Key Responsibilities － Device Development: Lead the architecture design and optimization of HV devices (LDMOS, EDMOS, ESD) on 180nm to 55nm BCD nodes. － Physics Analysis: Analyze and optimize Device Physics parameters, including BV, Rdson, SOA, and reliability (HCI/NBTI). － Simulation & Modeling: Utilize TCAD for 2D/3D process and device simulations to accelerate development cycles. － Device Verification: Define verification plans and execute statistical analysis using JMP for DOE and WAT data. － Design Integration: Work within Cadence environments for layout review and test structure design. － Cross-functional Collaboration: Partner with PI and PE teams to resolve yield, reliability, and manufacturing bottlenecks. Required Qualifications － Experience: Master‘s or Ph.D. in EE, Physics, or related field with 10+ years of semiconductor industry experience. － Technical Expertise: 1. Profound knowledge of Device Architecture and Device Physics. 2. Hands-on experience in 180nm to 55nm BCD process nodes. － Tools: 1. Expertise in TCAD (Sentaurus / Silvaco). 2. Expertise in JMP for statistical data analysis. 3. Proficiency in Cadence (Layout/Virtuoso). Preferred Qualifications (Plus) － Advanced Power Devices: Experience with GaN, SiC, or IGBT development. － Silicon Photonics: Knowledge of Photonics integration and device physics. － Domain Knowledge: 1. Process Integration (PI): Understanding of mask flow and doping profiles. 2. Product Engineering (PE): Experience in CP/FT data correlation and yield enhancement. Competencies － Accountability: Strong ownership of project milestones and outcomes. － Critical Thinking: Ability to identify root causes in complex device failures. － Interpersonal Skills: Effective communication across design and foundry teams. － Data-driven: Committed to objective decision-making through rigorous data analysis.

Job Responsibilities - To be the owner for manufacturing test on the released products. - Responsible for test program introduce to mass production - Responsible for NPI (after R-gate released) test data analysis and feedback to BL/PETE if any improvement needed - To be the owner for duplicated test hardware by performing debug and qualification, MSC (Gage R&R) analysis and release report - Responsible for 1st line hold lot disposition, including low yield, QA fail .......etc - To initial and work with related process owners on testing processes, documentation, and best practices - Participate in or drive test automation initiatives when applicable Required Qualifications - 3+ years of experience as a Test Engineer - Solid understanding of software/system testing methodologies - Familiarity with Linux environments and command-line operations - Experience with machine language (e.g., Java, C++) - Experience in system, embedded, hardware, or manufacturing testing - Strong analytical and problem-solving skills - Strong sense of ownership and responsibility for product quality English communication, reading, writing

Job Description -　Main contact window with business lines (BLs) to deliver a high quality and manufacturable product for IC test production, meeting or exceeding the required time to market or product cost. -　Take lead of new product introduction (NPI) for IC test -　To coordinate with related BLs (business line) and align with wafer/final test factories to prepare the product transfer -　To improve new product introduction procedure to enable smooth product transfer -　To reduce risk and impact to customers and factories, escalation management, e.g. reduce risk and impact by right and timely escalation -　To ensure no gap on test tooling availability Facilitate IC test data review and process for planning forecast, take responsibility on test technical data (and improvement plan) in time and accuracy -　To follow up test improvement projects, hold lots, progress of New Product Introduction, test buy off…etc. -　Process of Test Engineering Notice and Enovia ECO Requirement -　Bachelor degree (or above), Engineering background is preferred. -　Excellent communication skills (English/Mandarin, TOEIC＞600) -　Good logic thinking -　Be familiar with MS Office tool -　1 yrs experience in IC testing or related working experience is preferred

- Ensure compliance with Taiwan electrical regulations, SEMI standards, and safety codes. 負責廠區電力系統之運轉、維護及管理，確保符合台灣電業法規、SEMI規範及相關安全要求。 - Manage and maintain facility electrical systems, including: High/low voltage distribution (HV/LV), Switchgear, transformers, UPS, and generators. 負責廠務電力系統設備之日常管理與維護，包括：高低壓配電系統（HV/LV）/ 開關設備（Switchgear）/ 變壓器（Transformer）/ UPS不斷電系統 / 緊急發電機系統（Generator） - Proficient in AutoCAD for electrical drawings and single line diagrams 繪製及維護電力系統圖面，包含 AutoCAD 電氣圖及單線圖（Single Line Diagram）。 - Strong knowledge of high-voltage power systems, including: Protective relay operation, Single line diagram development and interpretation, Familiar with motor control systems. 負責高壓電力系統規劃、操作與分析，包括：保護電驛（Protective Relay）設定與應用 / 單線圖建立與判讀 / 馬達控制系統（Motor Control System）管理與改善 - Handle emergency response for power-related incidents and recovery planning. 處理廠區電力異常事件，執行緊急應變、故障排除及復電計畫。 - Ensure power reliability and quality to support critical manufacturing tools 確保廠區關鍵電力系統穩定運作，維持生產設備供電可靠度與電力品質。 - Monitor and improve system performance, capacity, and efficiency. 監控電力系統運轉績效，持續改善系統容量、可靠度與能源使用效率。 - Lead preventive maintenance (PM), especially annual electricals PM activity and troubleshooting for power systems. 規劃及執行預防保養（PM）作業，包含年度高低壓停電保養、設備點檢及電力系統故障分析。 - Coordinate power system upgrades, expansions, and projects 負責電力系統擴充、升級及改善專案規劃與執行。 - Support new tool installation(Hook-up) and capacity ramp-up planning. 配合產線及機台建置需求，執行廠務配電規劃、Hook-up二次配支援及產能擴充評估。 - Analyze power consumption and drive energy-saving initiatives. 分析廠區用電數據，推動節能改善專案及能源管理措施，提升整體能源使用效率。 Qualifications: - Bachelor‘s degree or above, preferable in Electrical Engineering 大學以上學歷，電機工程、電力工程等相關科系尤佳。 - At least 3+ years of experience in industrial or semiconductor facilities. 具 3 年以上廠務電力系統、工業配電系統或半導體廠務相關工作經驗。 - Relevant certifications is a plus. (Electrical Engineer license, HV certification, etc.) 具電機技師、高壓電工作業相關證照者優先。 - Familiar with PLC operation and basic control logic is a plus. 熟悉 PLC 操作及基礎控制邏輯者佳。 - Experience in Energy Management Systems (EMS), such as ISO 50001, and HVAC systems is a plus. 具能源管理系統EMS(Energy Management System)或 ISO 50001 能源管理系統導入經驗者佳。 - Experience in facility utility systems such as central air conditioning and chilled water systems is preferred. 具 中央空調、冰水系統等廠務公用系統經驗者佳。 - Experience in facility operations within semiconductor Assembly & Test (A&T) plants is highly preferred. 具半導體封裝測試廠（Assembly & Test）廠務經驗者尤佳。

***Please upload English resume onto our official platform: https://reurl.cc/1bbx6m Job Descriptions - The selected candidate will participate in Wi-Fi/BT software/firmware design , implementation, integration, validation and maintenance phases for standard based and non-standard based Wi-Fi/BT/BLE products for IOT and automotive markets. - Lead/participate in complex feature integrations/enhancements, Wi-Fi/BT/BLE SoC bring up, and technical issue solving. - Research, design and develop cutting edge technologies for industrial features and IEEE/WFA/BT/BLE spec. Ranging from Wi-Fi enterprise access point, embedded clients and other wireless technologies. - Participate the full life cycle of IC – spec designing, pre-silicon validation, chip bring-up, software development, customer engaging and supporting. Support customers remotely or onsite as needed. Qualifications - MS in EE, CE, or CS. - Proficient in C programming language. - Experience on Linux / Android programming is a plus - Knowledge on real-time OS (FreeRTOS / ThreadX) programming is a plus - Knowledge of ARM assembly is a plus - Team player and excellent interpersonal, communication and writing skills - Independent, self-motivated and willing to learn

Please apply for this position on NXP official website: https://pse.is/836k2a Job Responsibilities: APAC Central Competence Team works with external foundries to ensure stable chip supply for business lines across NXP. The primary responsibility of this role is to locally drive the lead products ramp up under new technology introduction (NTI). The key areas of responsibility of the jobholder are: 1. Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process 2. Front end process safe launch owner. Closely work with foundries at ramp up phase and drive for manufacturability and yield improvement. 3. Interface with key customers on critical projects. 4. Lead and steer the projects towards timely completion to support NXP business needs 5. Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc Requirements / preferences: 1. Bachelor or MSc in physics or electrical engineering. 2. ＞10 years of experience with front-end IC process integration, working in foundries’ production or development teams 3. In-depth knowledge of IC devices and processes. FinFET and NVM knowledge is a plus. 4. Strong understanding of yield enhancement techniques and data analysis 5. Must be fluent in English and Mandarin 6. Hands on experience in being a lead; leading teams with responsibilities in development / transfer projects or production ramp up. 7. Good communication skills. Having the ability to influence and steer a discussion 8. Pro-active working attitude, creative, pragmatic, enterprising and result driven. 9. Familiar in managing/working with foundries, maximizing leverage from foundries

1.學習醫療軟體系統與健保相關規定。 2.透過連線或通訊遠端協助醫療院所排除系統故障與健保相關業務。 【其它條件】 1.具備服務熱忱與耐心，不會對與客戶互動恐懼. 2.具備相關經驗者，優先錄用 . 【發展與福利】 1.可依興趣與能力輪調系統研發、業務、輔導師、硬體工程師。 2.公司台北、桃園、台中、高雄、花蓮、嘉義有分公司，可依需要調整。 3.採360度評量，三節獎金依績效0.5-2.5萬，2萬國外旅遊補助、個人月績效獎金，部門月獎金與年終獎金。 4.★★滿一年以上平均含獎金(包含年終)與其他給付,月薪約為月薪之1.4-1.6倍★★

1.需駕駛三噸半貨車，運送物品具備良好的駕駛應對禮儀，良好的時間管理及危機處理能力。 2.開車技術佳、沉穩有耐心反應快、遵守交通規則。

1. 開發潛在客戶，拓展市場，以達成業績目標。 2. 定期拜訪經銷客戶，維繫穩定客戶關係。 3. 負責國內業務接洽及訂單處理。 4. 負責產品報價及產品展示。 5. 負責業務推展，傳達及說明公司各項業務重大訊息、活動及產品。 6. 進行商品行銷，產品特色分析介紹，並提供產品購買的建議。 7. 提供售後服務，處理客戶端之問題，給予完善的處理。

1. 開發潛在客戶，拓展市場，以達成業績目標。 2. 定期拜訪經銷客戶，維繫穩定客戶關係。 3. 負責國內業務接洽及訂單處理。 4. 負責產品報價及產品展示。 5. 負責業務推展，傳達及說明公司各項業務重大訊息、活動及產品。 6. 進行商品行銷，產品特色分析介紹，並提供產品購買的建議。 7. 提供售後服務，處理客戶端之問題，給予完善的處理。 8. 面試地點:台南市佳里區子龍路103號。

注意並病患的用藥習慣,需有緊急護理經驗等........工作地點:三民區.鼓山區.左營區.前鎮區.小港區(以上須調派其它單位) ※需執登,另有獎金 AM:08:00~PM:12:00