清大專區

1. CPU Architecture Exploration 2. MCU System Level PPA Modeling

1. Benchmark效能分析/系統功耗/熱平衡模型化工具設計與開發 2. xPU benchmark的效能/功耗/熱平衡的系統分析與研究 3. xPU 異質運算架構的benchmark最佳化

1. Market Analysis: Co-work with market research institutions and internal marketing teams for market data and future trend analysis 2. Business operation: Co-work with teams for solid business operation

We are looking for a technical expert who has profound knowledge in CPU/Low power Technology and smartphone system. Key responsibility 1. Identify and anticipate key market/technology trend and contribute the result to product planning of MediaTek smartphone SoC 2. Lead customer engagement, define and execute product strategy in the area in CPU/low power area 3. Develop technology roadmap and selling points to contribute the success of MediaTek products.

• Integral part of Tier-1 OEM team – communicate, manage and prospect long term business relationships with North American tier-1 OEMs, and the related ODMs, hub service providers, distributors and internal teams to achieve revenue goal • Coordinate customer forecast and supply fulfillment plan cross customers and internal functional teams, and provide forecast analysis reports aligning with complex sales cycle •Facilitate and track customer forecast, and execute sales operation activities including shipment notification, PCN, NPI, new product sample arrangement, RMA, execution plan, documentation, system database update, etc. • Build instant rapport and achieve customer satisfaction by ensuring a smooth sales process • Ability to manage complex sales cycle and forecast cycle and complete other sales assignments

1. WiFi/BT 電路系統分析、IC驗證除錯、公板製作、數據蒐集及分析 2. PCB公版設計, 除錯 3. EMI 防治對策 4. 高速數位介面應用及除錯 5. 客戶支持

1.顯示器/Branch 產品driver研發 2.Driver porting 與改善driver效能 3.負責Display Port driver開法跟問題排除 4.分析相容性問題

1. 架構和數位電路設計 2. RTL實做和驗證 3. SoC chip整合和RTL到gate level實現, 包含timing分析跟量產測試 4. 設計方法和整合流程改善

1. 研究IP開發測試計畫, 環境, 驗證與除錯. 2. IP開發驗證. 3. 研究分析IP比較與效能評比. 4. 制定IP驗證機制與強化重複性測試環境以提供給產品使用. 5. 負責在計畫時程規劃內完成IP驗證與除錯.

1. 熟悉ISP和相機架構流程，以開發ISP調適算法 2. ISP調適算法自動化開發 1. Familiar with ISP & whole camera system, and developing ISP tuning methodology 2. Tuning methodology automation development

• Leading 802.11BE & wearable software structure & algorithm development • Leading customer requirement implement and support

1. Windows on ARM system analysis: find out critical path of platform performance/energy and workload behavior 2. Plan and develop scenario-base abstract models of Windows for power and performance estimation

1. 主要處理28nm及以下之先進製程 2. 負責後段APR flow 3. 需參與團隊, 合作完成專案 4. 需撰寫程式

1. Work on 7nm~3nm design implementation, methodology, and sign-off 2. Perform IR signoff and Chip-Package Co-Design 3. Manage schedule, resolve design and flow issues, drive methodologies and execution

•Architecture definition and analysis •SOC performance modeling, studies and analysis •Power and Performance trade-off analysis •Research on performance/power/area •Chip partition analysis

1.從系統應用功秏分析, 與 IP, SoC 與軟體團隊合作, 推進 SoC low power 軟硬體架構的演進. 2.產品規格定義時, 分析不同架構與 IP 選項, 在系統應用功秏體驗的差異, 產出產品應用 power dash board, 提供產品規格決策的依據. 3.執行或協助功秏量測, 與power model預估的功秏做校正 4.分析PMIC/Power rail 設計, SoC power state 與 data-path power等, 並且提出SOC 設計優化方案 5.提出系統優化的方向, 達到最佳的產品電池使用續航時間與使用體驗

1. 數位電路開發設計與整合 2. IP與系統層級驗證，包含FPGA和實際晶片 3. 數位流程執行與優化 4. IP文件與功能維護

Baseband手機系統應用與電源規格制定, 包含modem, PMIC and AP.

[職缺一] 1.IC 整合 2.IC設計整合流程改善 3. 數位IP設計/IC整合/系統驗證 [職缺二] 1.執行晶片sign-off流程 2.發展降低晶片功耗流程 3.整體晶片的靜態時序分析與收斂

1. TV IC 架構設計與 RTL 實現 2. TV SoC 整合 3. Bus 與周邊整合 4. SoC 效能評估與改善