研發替代役專區

職責要求 1.總務及營繕工程等企劃及相關制度流程規劃與管理 任職資格 1.熟現場工程圖繪製 2.相關工作經驗5年以上 3.具營造實務經驗者佳

職責要求 1、生產排程管理、進度追蹤及交期協調 2、倉儲管理督導 3、原料之市場分析、採購、合約管理 4、進口免稅申請文件審核 5、新供應商審核 6、原物料客訴審核 7、人員作業相關稽核 8、公司政策及上級主管交辦事項 任職資格 1、製造業年資5年以上 2、擁有3年以上主管、團隊管理經驗 3、英文閱讀能力 4、高分子合成、塑膠原料、石化原料、紡織、物流、製造相關產業

職責要求 1、作業安全及生産品質監管 2、生產排程協調與進度掌控 3、設備保養計劃制定和實施 4、製程生產工序修訂及精進 5、夜間查廠檢核製程生產區域 6、人員作業相關稽核 任職資格 1、製造業年資5年以上 2、擁有3年以上主管、團隊管理經驗 3、英文閱讀能力 4、高分子合成、塑膠原料、石化原料、紡織、物流、製造相關產業

職責要求 1.審視客戶圖面與要求。 2.規劃及控管樣品測試驗證報告。 3.溝通、協調並制定新產品品質標準。 4.檢具設計溝通。 5.整合提交PPAP相關文件。 6.客訴處理及8D回覆。 7.品質異常分析與對策 任職資格 1.大學以上，日文流利 2.熟悉 6 Sigma、SPC、IATF16949 3.具品保經驗2年以上 4.熟悉車廠五大核心工具佳

職責要求 1. 推動公司品質維持與改善活動。 2. 確保產品品質符合標準需求。 3. 顧客服務、客訴案件掌控處理及矯正措施追蹤。 4. 實現顧客承諾與技術服務。 5. 實驗室相關認證申請及維持與精進。 6. 部門內所屬課室各項工作規劃及推行。 7. 訓練、督導、考核及指派所屬人員之工作。 8. 品質稽核業務之推行及相關訓練規劃。 9. 品管圈活動推行。 任職資格 1. 3 年(含)以上課級管理經驗 2. 3 年(含)以上客訴處理經驗 3. 熟 ISO 9001 管理系統 4. 具相關取證經驗佳(如 TAF / JIS Mark / NSF…等) 5. 具品管圈推動經驗佳 6. 英文精通，TOEIC700 以上 7. 大學以上，材料、機械或理工相關科系

職責要求 • app 開發維護架構設計，iOS / Android 平台 • 與同仁溝通協調去設計和交付功能 • 重構來優化效能與改善程式品質 • 撰寫程式文件 • 持續增加測試 • 撰寫 Script 以取代 routine task 任職資格 • 熟悉以下任一(擇一即可) a. Cocos2d-x b. C/C++ c. Cocostudio • 有主動學習並獨立解決問題的能力 • 三年以上軟體工程師之經驗 • 熟悉版本控制軟體 Git, Git Flow • 有透過撰寫測試(Unit test)來改善程式碼品質的經驗 • 擅長溝通協調，會使用不同的方式（如文件，畫圖，敘事）幫助溝通更順暢 加分項目： • 熟悉 Cocos2d-x 與 iOS, Android native 平台串接 API 的流程 • 熟悉 Cocostudio • 熟悉與網路服務之間的整合，Restful API 和 Websocket • iOS, Android native App開發經驗 • 有伺服器相關開發經驗 • 多人即時連線遊戲設計經驗 • 瞭解 DevOps 或服務部署方法和流程，使用過雲端服務經驗，如 AWS, Google cloud • 了解基本 Javascript 語法 5.與後端工程師配合，串接 API，完成產品開發＜br/＞ 6.模組化前端組件，建立前端開發架構，提高前端開發的效率＜br/＞ 7.對前端相關領域技術保持持續關注，用合理的技術方案解決問題＜br/＞

1. Field support to all customers in the Northern part of Taiwan. 2. The field support is to support systems or machines of products. Main task is related to hardware but might involve software troubleshooting in some occasions. 3. On a rotary basis, job holder is required for on-call duty. 4. Obligate to learn new products through daily work and training events； is required to attend training events upon arrangement. 5. Required to participate in customer service meetings, maintain positive relationship with customer contacts. 6. Writes reports on time for the purpose of administration, service events, technical data and improvement. 7. Proactively takes ownership on resolving service problems. 8. Assisting in application and sales to promote products toward customers. 9. Other service which management assign to him.

1. Field support to all customers in the Hsinchu part of Taiwan. 2. The field support is to support systems or machines of products. Main task is related to hardware but might involve software troubleshooting in some occasions. 3. On a rotary basis, job holder is required for on-call duty. 4. Obligate to learn new products through daily work and training events； is required to attend training events upon arrangement. 5. Required to participate in customer service meetings, maintain positive relationship with customer contacts. 6. Writes reports on time for the purpose of administration, service events, technical data and improvement. 7. Proactively takes ownership on resolving service problems. 8. Assisting in application and sales to promote products toward customers. 9. Other service which management assign to him.

1. Tool installation and service support based in Hsinchu office but not limited to work in Hsinchu area. 2. Preventive maintenance on Photo-Mask Equipment. 3. Participate on service review meetings at customer site. 4. On-call duty at night and weekend is required on rotary base. 5. Windows operation system skill is required for tool software update. 6. Obligate to learn new products and training on new tool abroad. 7. Assistance in application and sales to promote products. 8. Other service task assigned by management.

職責要求 - Lead the service team in Taiwan, providing technical support, preventive maintenance, and repairs for lithography and bonding systems. - Ensure high-quality and timely customer service for products, including coaters, developers, and wafer bonders. - Collaborate with the application engineering team to resolve technical issues and optimize equipment performance at customer sites. - Manage and monitor service contracts, warranties, and spare parts inventory to ensure availability and timely service interventions. - Conduct on-site troubleshooting, diagnostics, and repairs, ensuring minimal downtime for customer operations. - Develop and deliver training programs for customers on the use and maintenance of equipment. - Maintain service documentation, track key performance indicators (KPIs), and report on service activities to management. - Work closely with customers to understand their technical challenges and provide proactive solutions. - Coordinate with the global service and support team to share best practices and ensure consistent service quality. 任職資格 - Bachelor‘s degree or Master degree in Engineering field. - Minimum of 5 years of service or technical support experience, preferably within the semiconductor or high-tech equipment industry. - Minimum of 2 years service management proved experience - Strong technical knowledge of semiconductor lithography and bonding processes and equipment. - Proven experience in customer service management and troubleshooting complex technical issues. - Excellent communication and leadership skills, with the ability to lead a team and engage effectively with customers. - Fluent in English and Mandarin, with strong documentation and reporting skills.

• Conduct and complete final acceptance test at customer site. • Establish process and qualify bonding systems with customer. • Collaborate with customer in defining problem statements, analyzing abnormal data, resolving process issues, and improving process conditions. • Provide both on-site and remote applications support to customers. • Participate in customer meetings and maintain positive relationship with customer contacts. • Provide expertise and advice to bonder business unit to help product improvement. • Participate in projects related to new product introduction: definition, characterization, alpha testing, beta testing and customer use case development • Learn new products through daily work and training events; is required to attend training events upon arrangement. • Take ownership of application projects assigned by supervisor. • Other tasks are assigned by supervisor

職責要求 - Lead and manage application engineering teams focusing on lithography and wafer bonding technologies for semiconductor advanced package fabrication. - Provide technical expertise and support to customers in Taiwan regarding the usage and optimization of equipment, including mask aligners, coaters, developers, and wafer bonding tools. - Collaborate with R&D teams to implement customer-specific solutions, improving product performance and enhancing customer satisfaction. - Drive the development and integration of new processes for 3D packaging, TSV (Through-Silicon Via) bonding, and other advanced semiconductor applications. - Conduct customer training sessions, troubleshooting, and technical support to ensure optimal equipment performance. - Oversee process validation and testing, ensuring compliance with industry standards. - Regularly interface with customers to understand their challenges and tailor solutions that meet their needs. - Stay updated on the latest industry trends and technical advancements, ensuring the company‘s offerings remain competitive. 任職資格 - Master’s degree in Engineering related field or Material Science. - Minimum 6 years of experience in semiconductor lithography and bonding processes. - Minimum 3 years of team management experience. - Strong problem-solving skills, with the ability to troubleshoot technical issues in semiconductor processing. - Excellent communication and interpersonal skills to effectively interact with customers and cross-functional teams. - Fluent in English; knowledge of Mandarin is an advantage.

- People management and leading a department to achieve team target. The main tasks of the department shown as below: - MRP planning implementation - Conduct material planning including BOM parts, Bulk materials, consumable parts and others. - SAP material master data set up, maintain and trouble shoot - Demand and Supply investigation to ensure the resources are able to meet customer demand - Securing all planned resource for production will be ready on time - Execute production plan with consideration of all resource constrains. (such as material, manpower, tools and facility) - Consolidate the need from production and coordinate with procurement team to ensure the material on-time delivery from supplier to factory. - Proactively to drive and find out the solution for material shortage to minimize production progress impact. - Conduct reverse logistics for parts repair / rework whenever needed. - Controls inventory level and facilitates the provision of necessary material and components - Managing and control the part introduction and phase out activities within Engineer Change process - Warehouse management and dispatch activity - Continuous improvement / Lean production introduction and implementation for logistics flow - Identifying risks and drive actions for mitigation - Other tasks assigned by supervisor

職責要求 • Demonstrate your expertise for trouble shooting and design mechatronic system per DSC lithography product roadmap. • Possess strong DOE ability for system error analysis and execute test plan. • Involved in NPI project to MFG team for new system, feature and technology. Perform trouble shooting, technical support and process improvements to fulfill the goal of production output. • Involved in CIP and maintenance project for mature product. • Initiate and validate engineering changes and familiar with ERP system for document management. • Strong mindset and experience of risk assessment, cost evaluation and cross function cooperation. 任職資格 Requirements: • Experienced in designing electrical system of an automation machine covering component survey, cost evaluation, schematic planning, system integration. • Familiar with CAD and drawing PDM tool (AutoCAD, E3, etc). • Background of PLC or related PC based coding skill. • Good ERP concept and BOM maintenance experience. • Fluent in English speaking and writing. • More than 3 years working experience. Characteristic: • Teamwork: Able to working in a cross function and international environment. • Self-learning: Able to collect information to improve your knowledge pool, and also help the growth of the team by sharing knowledge. • Proactive: Willing to tackle with technical challenges and the mindset of seeking solutions for continuous improvement. • Planning: Result oriented thoughts for assigned task and project.

- Set-up, trouble-shoot and fine-tune an assembled Exposure Equipment - Test all functions and collect corresponding data, and interpret them correctly - Set-Up System according to specification and procedure. Test and verify accomplished tasks. - Identify systematic problems and provide solutions based on a data-driven approach. - Initiate and implement continuous improvement-projects to improve quality, reliability and safety and to reduce costs.

- Assemble according to schematics and procedure. Test and verify accomplished tasks. - Identify systematic problems and provide solutions based on a data-driven approach. - Initiate and implement continuous improvement-projects to improve quality, reliability and safety and to reduce costs. - Other tasks assigned by supervisor

- Assemble according to schematics and procedure. Test and verify accomplished tasks. - Identify systematic problems and provide solutions based on a data-driven approach. - Initiate and implement continuous improvement-projects to improve quality, reliability and safety and to reduce costs. - Other tasks assigned by supervisor

工作任務： - 在無塵室環境中執行機台測試和故障排除。 - 支援生產過程改善、精實製造和產品品質改進。 品質： - 根據既定規格生產機台。 - 觀察和報告系統問題，並支持解決方案以避免缺陷影響後續流程。 - 促進產品和過程的質量改進。 - 並在所有工作區域應用和遵循5S標準。 生產： - 根據既定程序製造機台。 - 解決在組裝過程中出現的技術問題、促進產品和過程的改進、樹立榜樣，帶領團隊成員。 - 了解從組裝到產出的整體過程，並在專業領域內作為問題解決的參考依據。 技能： - 獲取足夠的知識以完善系統，包括新產品和既有產品。 - 具備各模組與整個系統和其他（子）系統之間關聯性的相關知識及概念。 - 通過尋求解決方案和從部門任務中提出的想法來支持良好的團隊合作。 計劃： - 協調生產計劃中的生產活動，並掌握實際生產情況和進展。 - 密切控制生產工具、材料和設備的使用。 其他： - 完成主管指派的其他任務。

職責要求 • Design tasks for devices and equipment for semiconductor manufacturing • Design according to customer’s configuration and specification • Creation of drawings, schematics, documents, parts lists and materials in SAP • Production support in the assembly, purchasing support for technical queries • Creation and technical evaluation of self-developed concepts and designs • Creation of risk assessments, assembly and installation instructions, calculations and designs • Involved in ECR (Engineering Change Requests) and CIP (Continued Improvement Projects) • Design must be in compliance with national and international regulations and standards. • Communicate with our counterpart-location in Germany. • Other tasks are assigned by your supervisor. 任職資格 • Master Degree in Electrical Engineering • Minimum of 5 years’ experience in similar position • Experience using CAD ZUKEN e3 or a similar CAD Software • Experience using SAP • Experience using MS Office • Very good English skills • Excellent communication skills in both, verbal and writing • Ideally Semiconductor Equipment Experience

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