交大專區

主要為協助工地主任管理工地及其他交辦事項。 1.負責現場工程進度，協調廠商及材料進出場排程。 2.控管所轄工地之工程進度執行。 3.工地進度請款以及廠商請款查核。 4.與業主、監造、協力廠商協調品質、進度等各項事宜。 5.建築土木相關科系畢業佳 6.熟CAD。 ✅薪資：月薪40000元，依能力調薪(能外縣市工作者尤佳，有太陽能鋼構相關經驗者尤佳) ✅工作時間：排休/日班 ✅應備證照：營造業甲種勞工安全衛生業務主管、汽車駕照

💡【電控人員】我們在尋找你！ 對科技充滿熱情？喜歡動手實現創新想法？加入我們，一起打造頂尖的專用生產機械！💪 🌟 你的每日挑戰 1. 設計並分析專用生產機械的電機系統，與自動化控制密切合作，創造完美運作的機械設備。 2. 安裝、測試和調校設備，確保每件設備性能滿足需求！ 3. 定期維護和保養設備，藉由故障診斷與解決問題，讓專用機械持續高效運作。 4. 根據設計圖組裝機械，並完成精準的電路連接，確保每個細節都妥當無虞。 5. 現場監督機械安裝與調試，展現你的專業完成性能測試和品質管控。 6. 熟練運用電子測試設備，閱讀和掌握電路圖及技術手冊，專注於每一次技術上的突破！ 7. 參與新型專用機械的研發，學習最新技術，讓你的專業不斷升級！ 🚀 我們需要的就是喜愛解決問題並享受挑戰的你！ 準備好迎接這個充滿刺激與成就感的工作了嗎？我們等著你來加入，和我們一起推進機械工藝的未來！✨

1. 解決客戶應用技術問題，並回饋單位。 2. 太陽能安裝設定及系統調適。 3. 太陽能相關工程技術支援。（例如：光伏板安裝工程、通訊線路配置工程、維運工程） 4. 儲能系統維護、保養、安裝設定及系統調適。 5. 設備故障排除、搶修、替換。 6. 監控系統監視。 7. 維運報告製作。

1.使用CNC銑床程式編修及機台操作加工 2.依據圖面要求進行加工程序設定 3.進行加工件的尺寸檢測，確保產品品質 4.定期維護與保養CNC銑床設備 5.完成快速換模系統零組件的加工與檢查 7.協助故障排除與修復，維持設備正常運行

1.操作傳統銑床進行零件加工，熟悉讀圖與尺寸測量 2.定期維護與保養傳統銑床設備 3.完成快速換模系統零組件的加工與加工檢查 4.協助故障排除與修復，維持設備正常運行

機台操作、換料送料、機台維護/保養等。

1.機台操作、換料及送料 2.機台維護、保養及故障排除等。

電動拖板車，電動堆高機，電動運搬設備維修技師

1. 元件產品設計開發及製程開發 2. 相關電子電路應用開發 3. 協同相關部門新產品導入量產及維護 4. 解決客戶應用及技術問題

中部雷射股份有限公司自1988年成立以來，致力於精密機械領域的深耕與創新，產品涵蓋機械零件、自行車部品、建築五金等多元範疇，是台灣技術發展純熟的代表企業之一。我們的產品不僅能提升生活便利，更推動產業進步，致力於打造高品質且具影響力的製造服務，期待您的加入與我們一同邁向更卓越的未來。 1. 設置與操作CNC車床機器，根據技術規範執行精密加工 2. 持續監控生產過程並進行必要調整，進行機器維護及故障排除 3. 進行產品品質檢查，記錄生產相關數據並協助改善製程品質 加入我們，您將擁有： - 三節獎金、績效獎金與輪班及多種津貼 - 員工餐廳、誤餐費補助及員工聚餐機會 - 國內旅遊與自強活動，營造溫暖團隊氛圍 - 全面員工教育訓練，著重專業技能提升 - 健保、勞保及員工團保，完善的安全保障 歡迎有熱忱的您，與我們一同成長，打造精密製造的未來！

1. 進料檢驗作業：負責原料進料檢驗、新樣品測試、判定 2. 成品檢驗作業：負責成品出貨品質檢驗（含COA製作）、判定 3. 製程檢驗作業：負責線上製程中檢驗、判定 4. 客戶服務：負責客戶委託之樣品分析 5. 其他委託檢驗分析事項 6. 配合執行 ISO 9001 / IATF 16949 / ISO 14001 系統的相關事務（含內／外部稽核）

1.高分子材料開發 2.製程設計與開發 3.文獻搜尋及專利申請 4.跨單位溝通及整合

1. 客戶樣品實驗操作 2. 客戶樣品代工操作 3. 實驗委託者窗口聯繫溝通

1.基礎材料研究及探詢未來中長期技術 2.量產品改善、成本改善、特性改善、良率改善。

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=3971&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Act as the IT security Purple team to identify and validate exploitable vulnerabilities for IT continuous improvement ahead of real adversaries. 2. Develop and enable Security Assessment Automation capability for IT security risk assessment. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=451&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Advanced 2.5D and 3D packaging technology development. 2. Design flows, including APR, EM/IR, Thermal, and SI/PI, enablement. 3. Design kits generation and QA. 4. 3DIC solution adoption support with key customers. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=353&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. Responsibilities: 1. Development of world-class cutting-edge technology, and responsible for the success of the A10/A14 technology: (1) Process integration across process modules, including test key design, tape out, device analysis, simulation, model, and robust. (2) Test key designs for design rule validation, electrical modeling, and yield learning. (3) Characterization of state-of-the-art devices, spice targets‘ setting for modelling, occasional bench measurement. (4) Lot handling: periodically serves as on-duty engineer to coordinate device lots‘ handling. 2. Advanced process integration development: integration and baseline sustaining to meet process KPIs on performance/ yield/ reliability/ manufacturability in A10/A14 program. 3. Advanced integration baseline process transfer to volume production. 4. Data analysis to identify the issue and issue owner. 5. Co-work with various teams to evaluate new processes and solve the issue. 6. Routine integration logistic job. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=545&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Hands on SOC chip/ block implementation from gate level netlist to GDS tape-out. 2. Develop IC design methodology 3. Chip tape-out; Design methodology development Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=541&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The Role: Software Engineer, Backend Development at TSMC IT focus on designing the most flexible, scalable backend architecture with optimized performance to support TSMC world-class manufacture, engineering and business systems. The ideal candidate has a highly technical multi-discipline engineering skillset that can push the limits of complex system design at large scale. Responsibilities: 1. Implement the features and services of backend for TSMC software products 2. Develop state-of-the-art code 3. Continue to refactor existing applications 4. Contribute to write tests to ensure software quality 5. Apply software design principles to ensure software quality 6. Ensure sustainability and performance of software applications 7. Willing to learn new IT technologies Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=532&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: Front-end to back-end large scale digital circuit design for system-on-chips and 3DICs, responsible for designing with the state-of-the-art process technologies and developing corresponding CAD flows that explores cutting edge design methodologies and latest EDA tools, either for internal first-in-the-industry testchips or leading customer’s products Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.