交大專區

1. Package design and planning of various product. 2. Design & layout of BGA substrate. 3. Co-work with package houses for package design 4. Development of advanced package technology. 5. Package design platform development.

The candidate will design, supervise layout, help characterize transceiver front-end circuits for WiFi and Bluetooth production.

In a flexible and supportive environment, one of your major responsibilities is to push the state of the art of learning theory. Furthermore, through collaboration with worldwide colleagues, you will have the rare opportunity to apply advanced Deep Learning theories to novel application areas such as AI-designed IC and General Intelligence Conversation. We welcome all ML/DL backgrounds, including computer vision, speech and NLP, and robotics.

1. CoWoS和2.5D封裝技術開發 2. 3D封裝技術開發 3. CPC/CPO封裝技術開發 4. 封裝技術整合和NTO管理

1. 先進製程技術製程開發 2. 先進封裝技術開發

負責PCIe軟體開發，硬體功能驗證，以及量產support. 1. FPGA/SoC 驗證 2. Linux/RTOS/Window PCIe driver 開發 3. 軟硬體問題分析與解決 4. 系統規格討論 5. 客戶問題支援

Fully accountable with the team to deliver highly competitive ARM based CPU IP. Implementation skill required ranged from RTL, synthesis, DFT, Floorplan, Placement, CTS, Routing, Timing Closure, and physical verification.

In a flexible and supportive environment, one of your major responsibilities is to push the state of the art of learning theory, to obtain insights beyond mythical theories as well as to apply the right solution to novel application areas such as AI-designed IC and General Intelligence Conversation. Furthermore, you shall actively engage with worldwide colleagues and academics to nurture and build a collaborative and effective R&D environment. We welcome all ML/DL backgrounds, including computer vision, speech and NLP, and robotics.

負責開發和維護微控制器單元（MCU）的底層軟體架構與實作， 此職位需要對 CPU 與低階系統軟體開發有深入了解。 - 設計、開發和優化 MCU 的軟體，包括初始化程式碼、驅動程式和外設庫。 - 與硬體工程師合作，確保軟體與 MCU 硬體正確整合。 - 處理穩定度與能耗相關問題並提供及時解決方案。 - 與韌體開發人員密切合作，支援在 MCU 平台上的應用程式開發。

1. Design and RTL implementation of SoC debug modules 2. Integration and verification of debug components (e.g., trace, monitor, access port) 3. Debug signal capture, trace, and analysis for SoC platforms 4. Support SoC debug flow and issue localization 5. Collaborate with cross-functional teams to optimize debug performance 6. Documentation and test specification for SoC debug features 7. Location: Taipei/Hsinchu

Requirements Elicitation, Requirements Analysis, and Architectural Design - Analyze product requirements from customer - Discuss the expectations and requests with customer - Agree or reject the requirements - Make architectural design proposals

負責 SoC／系統層級的效能與功耗分析、優化。 與硬體、韌體、軟體、架構等團隊合作，推動效能與功耗改善方案。 針對系統瓶頸進行深入分析，提出有效的優化解決方案。 參與 DVFS、低功耗設計、系統資源管理等技術的開發與調教。 針對 Windows 平台，優化 Windows PPM（Processor Power Management）設定，提升系統效能與功耗表現。 分析並調教 Windows Power Management 相關設定，確保系統在各種使用情境下達到最佳效能與最低功耗。 撰寫技術報告與文件，並提供內部團隊及客戶技術支援。

1. Responsible for high-speed UCIE development, including architecture definition, verification, and customer support (familiar with architecture, firmware, debugging, optimization, and testing tasks). 2. Define architecture and specifications through simulations. ( Matlab ) 3. Develop test automation. 4. Collaborate with the team to establish system prototypes and optimize performance. 5. Achieve product integration for clients and support mass production.

1. CPU system design and performance analysis 2. System bus architecture and integration 3. IP and system verification 4. Debug Architecture related IP design and integration

1. Familiar with HSIO spec (PCIE, USB, UFS, DP, ...etc) and system usage scenario 2. Familiar with Windows and Android OS 3. Experienced with PC south bridge design 4. Experienced with PC USB host chipset design

1. 負責開發及維護 USB host/device driver。 2. 分析並解決跨平台及多裝置的 USB 相容性問題。 3. 提供客戶 USB 技術支援及服務。 4. 能接受必要的出差安排。

1. Work with design teams to do performance sign off in pre-silicon stage 2. ESL platform and simulation/emulation technology development. 3. Model development (includes behavior modeling/ cycle approximate modeling)

1.PCB 電路及layout 的設計及驗證 2. 客戶端平台之開發驗證

1. LCD Monitor IC相關的韌體開發 2. 影像處理相關應用與支援客戶產品開發 3. LCD Monitor周邊軟體tool開發

1. Work on 3~7nm design implementation, methodology, and sign-off 2. Perform synthesis, DFT, floorplan, clock planning, place and route, timing closure, ECO, IR signoff, and physical verification 3. Manage schedule, resolve design and flow issues, drive methodologies and execution