交大專區

1. 安全性IP/構架 數位電路設計 2. 低功率數位電路設計 3. IC設計整合流程改善 4. 系統驗證

1. 各種產品類型之封裝設計及規畫。 2. BGA substrate設計及佈局。 3. 與封裝廠合作，完成封裝圖面設計。 4. 先進封裝技術之開發。 5. 封裝設計平台之開發。

1. Delegate for Mediatek in RAN4. 2. Participate the RF system development with RF system team.

對流程開發有興趣與熱忱者, 負責與協助執行系統端PI流程優化, 並導入更前期產品設計階段, 協助產品執行端提高品質與降低風險

1.SoC Chip Top and Infrastructure integration and physical design 2.Participate in SoC design implementation from logic synthesis to physical implementation stage under the latest technology process 3.Participate in SOC/Sub-System design architecture planning, RTL design rule check, Synthesis, DFT/ATPG, LEC, Timing sign-off, Timing ECO

負責分析On-Die Power Integrity, 提出解決方案達成PI Sign-Off Quality，開發並優化Power Integrity分析驗證平台

開發手機/平板SoC模擬及分析平台， 從系統效能，功率消耗，溫度控制...等多重面向分析產品競爭力， 進而從系統角度優化硬體架構及軟體控制策略。

1. 5G modem platform架構設計及相關數位電路設計 2. 整體晶片之clock, reset, bus, 測試模式, 低功耗模式之規劃及設計 3. 晶片量產品質控制方法及流程開發 4. 工作地點:新竹/台北

1. Computing technology roadmap planning and management. 2. Key customer/3rd party/industrial leader partnership management 3. Gaming ecosystem engagement

1. SoC chip integration from RTL to gate level including timing closure and testability 2. Design methodology and integration flow improvement

• Cellular ECO system夥伴關係 • Cellular modem新技術分析與市場技術走向分析 • Cellular ECO system engagement and partnership • Cellular modem new technology investigation and technical marketing

1. 5G modem platform架構設計及相關數位電路設計 2. 整體晶片之clock, reset, bus, 測試模式, 低功耗模式之規劃及設計 3. 由RTL到gate level的platform整合工作, 包含timing收斂及可測試性設計 4. 設計方法及整合流程的改進

1. 先進 5G 智慧型手機 SoC 設計整合 2. 先進製程 IC 設計實現與技術開發 3. 關鍵 IP Modem, DRAMC, ISP RTL-2-GDS technology development

1. Work on 7nm~3nm design implementation, methodology, and sign-off 2. Perform synthesis, DFT, floorplan, clock planning, place and route, timing closure, ECO, IR signoff, and physical verification 3. Manage schedule, resolve design and flow issues, drive methodologies and execution

1.數位晶片設計流程與整合, 包含timing收斂與DFT 2.數位設計流程整合與QC流程優化

This position will be involved in the design methodology development with Foundry and EDA in leading-edge process node: 1. Will work extensively with micro-architects to make best-in-class performance/power/area 2. Will drive RTL-to-GDS flow through synthesis and place-and-route to achieve competitive targets for performance/power/area 3. Will work with multi-functional engineering team to implement and validate physical design on the aspects of timing, power, area, reliability, and test-ability

1) Manage and develop in-house design automation programs 2) Analyze and summarize memory usage profiling 3) Benchmark 3rd party memory IP 4) Co-work with circuit designer for memory compiler development 5) Other technical task assigned from manager

1. 資深SI/PI工程師 2. 晶片開發, PDN/IR分析 3. DDR 介面SI/PI設計 4. 高速Serdes 介面SI/PI設計 5. 客戶技術支持

1. 系統單晶片DFT架構規劃與設計 2. 負責與客戶討論DFT架構，並開發對應的DFT流程 3. Scan/DFT電路設計timing收斂 4. DRC偵錯與DFT設計模擬 5. 測試涵蓋率的改善 6. ATPG pattern產生，偵錯，與量產管理

1. Build-up methodology for SoC system-level modeling and emulation platform (ex. Zebu, PXP) 2. Analyze GPU benchmarks and critical game applications, identify performance bottlenecks from computing system level and provide HW/SW optimizations 3. Explore the best-fit computing system architecture for next generation IP and SoC