交大專區

1.確實推動全方位製程技術研發，以符合客戶產品需求，協助客戶產品開發 2.負責與客戶及FAB各單位之溝通協調，決定工程執行範圍並規劃工程實驗 3.材料分析及元件電性分析，蒐集製程技術相關文獻，並加以整理與報告 4.解決及分析製程及產品重大問題，推動產品量產進度 5.協助主管檢視計劃執行進度工作成果，指導新進工程，並回報工作狀況 6.依Project製程技術開發之工作目標與時程，規劃細部執行計劃

1.Lead the development of advanced RFSOI and RFSOI-3DIC technology platforms for next-generation communication solutions. 2.Design and qualify new process modules and RF device structures to enhance platform capability and performance. 3.Establish and validate new process flows in Design-Start Modules (DSM) for customer-specific applications. 4.Collaborate closely with customers on new product verification, process customization, and technical alignment. 5.Coordinate cross-functional activities from design to qualification, ensuring robust integration and yield performance.

1.Develop and optimize 300mm Silicon Photonics (SiPh) technology platforms, including pluggable modules, co-packaged optics (CPO), and photonic interposer solutions. 2.Collaborate with internal R&D and module engineering teams to define and execute SiPh process flows. 3.Align device and process requirements with customers through technical discussions and solution deep dives. 4.Coordinate with external OSATs and partners for PIC/EIC characterization and packaging integration. 5.Apply DOE, FMEA, and control plan methodologies to ensure robust development and effective risk mitigation across all phases

1.Drive R&D and process integration for 2.5D and 3DIC packaging platforms. 2.Lead the development and qualification of new unit modules and device structures. 3.Establish and validate new process flows in Design Start Modules (DSM) to support custom product platforms. 4.Collaborate directly with customers on product requirements, verification testing, and technical solutions. 5.Apply structured methodologies such as FMEA, DOE, and control plans to optimize performance and mitigate risks.

1.Support new customer product introduction into the FAB, ensuring smooth pilot and tape-out processes. 2.Improve yield and ensure stability in in-line, wafer acceptance test (WAT), and chip probe (CP) results. 3.Define and implement standard operating procedures (SOPs) for production. 4.Collaborate with module engineers to resolve production issues related to yield, reliability, and in-line parameters. 5.Work cross-functionally to develop customized process flows that meet customer need.

1.Monitor in-line process parameters, address abnormalities, and make disposition decisions on lots to ensure smooth production flow. 2.Assist in productivity and yield improvement projects through data analysis and process experiments. 3.Support the establishment and maintenance of key process parameters for semiconductor tools. 4.Evaluate new materials, tools, and methods to enhance manufacturing quality and efficiency.

1.Monitor and resolve in-line SPC (Statistical Process Control) issues, equipment abnormalities, and lot handling in a timely manner. 2.Maintain equipment capability and ensure availability to meet production demand. 3.Collaborate with production and process teams on tool usage for troubleshooting, maintenance, and output. 4.Participate in troubleshooting and quality improvement projects to enhance equipment reliability and production outcomes. 5.Evaluate new equipment, materials, and retrofits to drive performance gains and production efficiency.

1.Conduct TCAD-based research and simulations to explore novel device concepts and architectures. 2.Develop, document and calibrate TCAD simulation decks in collaboration with cross-functional project teams. 3.Execute TCAD design of experiments (DOE) and generate tuning decks to support device optimisation. 4.Design test keys and layout structures for silicon validation, including bench-level electrical measurements and performance analysis. 5.Run structured experiments to fine-tune device parameters while safeguarding long-term reliability.

1.Day to Day monitoring and ownership to timely address in-line defect abnormality escalation, handling and disposition 2.Render support in Production ramp-up, New process implementation and process characterization for project success 3.Evaluate and implement productivity projects for DM Production, Tool and Cost index improvement 4.Define and deploy inspection tool recipes BKM to ensure detection capability 5.Assist in Customer audits on inspection strategy deployment and execution 6.Perform baseline defect improvement

1.New Device Introduction: Perform tape-out/tooling operations for customer design database and achieve the goal of first pilot success. 2.Project coordination: Customer interface and cross department coordination with seamless communications. 3.Manage conference calls, meetings and customer visits with professional presentation skills and logistics arrangement for project success. 4.Project management: Documentation, summary, meeting minutes and ability to recap keynote of meetings for management team review.

1.Work with cross-functional teams from Process Integration, Modelling, PDK, and Design Enablement to develop advanced BCD (Bipolar-CMOS-DMOS) technologies for 300mm fabrication. 2.Lead technical engagement with consumer and automotive customers to understand and define device requirements. 3.Generate BCD active and passive device P-cell layouts based on application specifications. 4.Collaborate with the Modelling team to develop accurate SPICE models. 5.Drive implementation of specialised device features into PDKs and ensure timely communication and technical validation with customers. 6.Enhance BCD device performance to meet evolving application needs.

1.協助處理工程方面事務 2.統計彙整製程及設備相關生產指標 3.負責機台簡易異常排除及調機 4.協助工程師進行產品及製程異常時的處置 5.協助建立機台端 Recipe 及 RCMS 6.協助工程師參與工程改良改善之運作

1.執行全方位製程掌控，整合各Module建立process flow 2.產品良率維持/提昇，以降低客戶die cost，提高客戶滿意度 3.滿足客戶需求品質issue分析/解決，即時改善異常 4.熟知 55/65/90nm process尤佳 * 聯華電子股份有限公司(UMC)與United Semiconductor Japan Co., Ltd. (USJC)為關係企業，本職缺係為USJC所設，候選人錄取後將先與UMC簽約，於台灣完成專業訓練並取得日本工作簽證後，後續依集團計畫安排與USJC簽約並轉任日本三重工作。

1.製程的日常維護作業 2.良率的改善與提昇 3.製程的最適化設計 4.新技術的應用、開發與製程控制 5.熟知 55/65/90nm process尤佳 * 聯華電子股份有限公司(UMC)與United Semiconductor Japan Co., Ltd. (USJC)為關係企業，本職缺係為USJC所設，候選人錄取後將先與UMC簽約，於台灣完成專業訓練並取得日本工作簽證後，後續依集團計畫安排與USJC簽約並轉任日本三重工作。

1.機台與設備的日常保養與維護 2.機台與設備的故障排除 3.維持產線的正常運轉 * 聯華電子股份有限公司(UMC)與United Semiconductor Japan Co., Ltd. (USJC)為關係企業，本職缺係為USJC所設，候選人錄取後將先與UMC簽約，於台灣完成專業訓練並取得日本工作簽證後，後續依集團計畫安排與USJC簽約並轉任日本三重工作。

1.先進元件設計及開發 2.先進元件特性開發 3.電腦輔助元件設計 4.Testkey 設計及分析 5.先進元件設計與開發 6.元件電性分析 7.利用先進製程增進元件特性 8.Test Key 設計及分析

QA roles in In process quality assurance or Incoming Quality assurance Responsible in QA functions and to maintain Quality Management System (QMS), 1. Process control : 1.1 Statistic process control/Process change management / FMEA / Control Plan review to ensure all case are fulfill UMC QA or international standard requirement; 1.2 System and procedure enhancement 2. IQA : manage process raw material quality and supplier management for production stability. 2.1 incoming material non-conformance handling 2.2 new material /supplier qualification 2.3 Supplier management: audit, rating, improvement etc. 2.4 systems maintain 3. Participate in project for productivity, daily job & work process improvement & quality system enhancement

Ever wondered what powers your phone, laptop, or even your future? We’re UMC, and our team from Singapore is excited to meet you at our Taiwan Campus Career Talk and Career Fair! Hear directly from our Singapore-based engineer about building a rewarding career through mentorship, hands-on learning, and the latest semiconductor technology. Discover how integrated circuits and wafers are made, and get an insider’s look at advanced manufacturing. Whether you’re new to tech or planning your next move, this is your chance to see how UMC empowers employees to grow in one of the world’s most impactful industries. Explore exciting career opportunities in Singapore—a global hub for innovation and technology. Bring your curiosity and questions—take the first step toward engineering your future with UMC in Singapore! Take the first step toward precision-engineering your future. ★Opening Vacancies: (1) Process Engineer (2) Equipment Engineer (3) Process Integration Engineer (4) Facilities Engineer (5) Technology Development Engineer (6) Manufacturing Engineer ★ 2026 Campus Career Talk and Career Fair Timetable: 3/6 陽交大企業說明會 (12：20-13：10) 3/7 台大博覽會 (09：30-16：30) 3/9 台大企業說明會 (15：40-16：40) 3/10 北科企業說明會 (16：10-17：00) 3/12 成大企業說明會 (20：00-20：50) 3/14 陽交大博覽會 (10：00-16：00) 3/15 成大博覽會 (10：00-15：00) 3/17 台科企業說明會 (15：30-16：20) 3/18 清大企業說明會 (18：00-18：50) 3/19 北科博覽會 (11：00-16：00) 3/21 清大博覽會 (10：00-16：00) 3/22 中央博覽會 (09：30-15：30)

1. Accountable owner for specific integrated technology development 2. Deliver specific integrated process to achieve the Manufacturable In_line criteria 3. Deliver specific Integrated process to achieve the Manufacturable WAT criteria 4. Deliver specific Integrated process to achieve the process reliability Criteria 5. Deliver specific Integrated process to achieve the manufacturable CP yield 6. Deliver specific Integrated process to achieve the product reliability criteria. 7. Setup specific Integrated process Patent and KM 8. Coaching junior engineer

At UMC, your growth is engineered for resilience. We combine long-term stability with non-linear, adaptable career paths, giving you the opportunity to make real impact, while growing with purpose. With our newly expanded Fab and facilities in Singapore, we’re investing in a future-ready workforce equipped to lead in the world’s most advanced manufacturing environments. With us, you can expect at UMC: • Career Resilience: Be part of a stable, values-led company with a track record of supporting our people, even in uncertain times • Growth that Fits You: Explore flexible development paths, cross-functional opportunities, and internal mobility • Meaningful Impact: Help deliver technologies that power everything from AI to smart mobility and sustainable innovation Main Responsibilities You’ll lead work that powers the day-to-day technologies behind modern life, from mobility and connectivity to smart systems and sustainable design. As a Quality Assurance Engineer (Customer) in our team, you will: •Plan and execute SPC management with statistical method/tools •Manage process stability and capability index and drive Fab improvements •Production line big data analysis to pre-alert potential risk •Take a leading role or actively participate in projects aimed at continuous improvement of the quality system and/or optimization of daily tasks •Perform other assignments as directed by the manager, such as cross-site activities, coaching junior team members, etc