交大專區

工作內容分為以下兩部分，將依照個人職涯偏好進行分發： 「公共設施維護保養」工作內容： ※負責廠區處理各項機械設備操作維護與異常緊急處理備問題 1.乾燥機與空壓機操作維護。 2.空調箱與冰水機操作維護。 3.管路與機械設備操作維護 。 4.配合現場生產，設備關機與開機。 5.高空、明火、侷限作業。 6.文書及監工管理。 ★ 日班但須依工作需求配合加班及假日出勤 「生產設備維修」工作內容： 1.設備操作、安裝、保養、修護、改善及一、二、三級定期保養檢查實施事項。 2.設備故障排除、異常分析與追蹤改善。 3.設備改造、升級以提升生產效率並確保操作安全。 4.設備導入規劃評估。 ★ 須依工作需求配合加班、輪班及假日出勤

1.設備安裝、測試、維修與保養。 2.設備故障排除、異常分析與追蹤改善。 3.設備改造、升級以提升生產效率並確保操作安全。 4.設備導入規劃評估。

1.建置、管理與維護公司系統 2.C#/.NET開發，繪製winForm介面，SQL SERVER數據庫管理 3.網路管理機制的規劃設計及維護 4.台灣總公司受訓3個月，視工作表現外派 5.此職缺為海外廠職缺，薪資面議

1. 負責CNC車床及銑床機台操作 2. 日常設備維護與作業環境清潔 3. 設備簡易保養與故障排除 4. 其他主管交辦事項

1.產線製程管理（如：物料管理、人員管理、異常回饋及處理）、改善計畫、不良品追蹤。 2.產線設備操作及定期維護保養。 3.主管交辦事項之執行與推動。 ★ 此職務經培訓後，工作時段為兩班輪班制，另有輪班津貼；加班費另計。 ★ 早班07:30-18:30；晚班19:30~5:30

1. 生產線上異常產品之處理，異常機台復機狀態handling。 2. 協助工程實驗排run。 3. 擴散新機台驗機及製程管理。 4. 擴散製程規範編撰建立，配方調整及最佳化。 5. 成熟製程改善及良率提升，維護品質及穩定度。 6. 先進製程導入、產能擴充、品質提升 。 『具工作經驗者，薪資另議』

1.確實推動全方位製程技術研發，以符合客戶產品需求，協助客戶產品開發 2.負責與客戶及FAB各單位之溝通協調，決定工程執行範圍並規劃工程實驗 3.材料分析及元件電性分析，蒐集製程技術相關文獻，並加以整理與報告 4.解決及分析製程及產品重大問題，推動產品量產進度 5.協助主管檢視計劃執行進度工作成果，指導新進工程，並回報工作狀況 6.依Project製程技術開發之工作目標與時程，規劃細部執行計劃

1.Lead the development of advanced RFSOI and RFSOI-3DIC technology platforms for next-generation communication solutions. 2.Design and qualify new process modules and RF device structures to enhance platform capability and performance. 3.Establish and validate new process flows in Design-Start Modules (DSM) for customer-specific applications. 4.Collaborate closely with customers on new product verification, process customization, and technical alignment. 5.Coordinate cross-functional activities from design to qualification, ensuring robust integration and yield performance.

1.Develop and optimize 300mm Silicon Photonics (SiPh) technology platforms, including pluggable modules, co-packaged optics (CPO), and photonic interposer solutions. 2.Collaborate with internal R&D and module engineering teams to define and execute SiPh process flows. 3.Align device and process requirements with customers through technical discussions and solution deep dives. 4.Coordinate with external OSATs and partners for PIC/EIC characterization and packaging integration. 5.Apply DOE, FMEA, and control plan methodologies to ensure robust development and effective risk mitigation across all phases

1.Drive R&D and process integration for 2.5D and 3DIC packaging platforms. 2.Lead the development and qualification of new unit modules and device structures. 3.Establish and validate new process flows in Design Start Modules (DSM) to support custom product platforms. 4.Collaborate directly with customers on product requirements, verification testing, and technical solutions. 5.Apply structured methodologies such as FMEA, DOE, and control plans to optimize performance and mitigate risks.

1.Support new customer product introduction into the FAB, ensuring smooth pilot and tape-out processes. 2.Improve yield and ensure stability in in-line, wafer acceptance test (WAT), and chip probe (CP) results. 3.Define and implement standard operating procedures (SOPs) for production. 4.Collaborate with module engineers to resolve production issues related to yield, reliability, and in-line parameters. 5.Work cross-functionally to develop customized process flows that meet customer need.

1.Monitor in-line process parameters, address abnormalities, and make disposition decisions on lots to ensure smooth production flow. 2.Assist in productivity and yield improvement projects through data analysis and process experiments. 3.Support the establishment and maintenance of key process parameters for semiconductor tools. 4.Evaluate new materials, tools, and methods to enhance manufacturing quality and efficiency.

1.Monitor and resolve in-line SPC (Statistical Process Control) issues, equipment abnormalities, and lot handling in a timely manner. 2.Maintain equipment capability and ensure availability to meet production demand. 3.Collaborate with production and process teams on tool usage for troubleshooting, maintenance, and output. 4.Participate in troubleshooting and quality improvement projects to enhance equipment reliability and production outcomes. 5.Evaluate new equipment, materials, and retrofits to drive performance gains and production efficiency.

1.Conduct TCAD-based research and simulations to explore novel device concepts and architectures. 2.Develop, document and calibrate TCAD simulation decks in collaboration with cross-functional project teams. 3.Execute TCAD design of experiments (DOE) and generate tuning decks to support device optimisation. 4.Design test keys and layout structures for silicon validation, including bench-level electrical measurements and performance analysis. 5.Run structured experiments to fine-tune device parameters while safeguarding long-term reliability.

1.Day to Day monitoring and ownership to timely address in-line defect abnormality escalation, handling and disposition 2.Render support in Production ramp-up, New process implementation and process characterization for project success 3.Evaluate and implement productivity projects for DM Production, Tool and Cost index improvement 4.Define and deploy inspection tool recipes BKM to ensure detection capability 5.Assist in Customer audits on inspection strategy deployment and execution 6.Perform baseline defect improvement

1.New Device Introduction: Perform tape-out/tooling operations for customer design database and achieve the goal of first pilot success. 2.Project coordination: Customer interface and cross department coordination with seamless communications. 3.Manage conference calls, meetings and customer visits with professional presentation skills and logistics arrangement for project success. 4.Project management: Documentation, summary, meeting minutes and ability to recap keynote of meetings for management team review.

1.Work with cross-functional teams from Process Integration, Modelling, PDK, and Design Enablement to develop advanced BCD (Bipolar-CMOS-DMOS) technologies for 300mm fabrication. 2.Lead technical engagement with consumer and automotive customers to understand and define device requirements. 3.Generate BCD active and passive device P-cell layouts based on application specifications. 4.Collaborate with the Modelling team to develop accurate SPICE models. 5.Drive implementation of specialised device features into PDKs and ensure timely communication and technical validation with customers. 6.Enhance BCD device performance to meet evolving application needs.

1. AI + 通訊跨領域研究 2. 整合通訊及感測技術研究 3. B5G/6G 非地面網路或衛星通訊相關領域研究

1. 參與部門研究、專案管理與跨部門溝通協作 2. 針對生成式 AI（含大型語言模型，LLM）、分散式通訊中介層（如 ROS 2、DDS）以及工業控制系統（ICS）的架構環境，開展前瞻性資安威脅研究與防護技術研發 3. 將研究成果轉化為學術論文或專利 4. 探索並驗證資安防護技術應用的可行性，轉化為實際的技術方案 5. 持續追蹤與分析前沿技術發展趨勢，評估其在資安領域的應用潛力

主要進行以下範疇之研究或專案(實際將依能力與興趣) 1.量子計算相關實驗或理論分析 (任何物理系統，例如：冷原子或離子、超導量子系統、量子點、光子、矽晶體等等） 2.原子物理背景相關 - 雷射冷卻、原子捕捉、雷射光譜等等 3.量子力學相關計算與模擬 - Mathematica/Python/Matlab 4.雷射穩頻相關技術 5.數位控制 - FPGA 程式撰寫 6.數位資料擷取 - 針對實驗系統撰寫相關控制程式 7.數位或類比電路設計 8.微米或奈米級半導體元件製程相關經驗 9.計算電磁相關模擬計算 - COMSOL 或是 ANSYS HFSS 10.計算機系統與架構 11.語言程式編譯、作業優化排程、人機操作介面撰寫