清大專區

證券及債券結算交割

1.key-in。 2.協助處理行政工作及主管主辦事項。

1、IoT／網通產品WiFi Router、Network Device 硬體架構規劃與電路設計開發 2、MCU電路設計與整合 3、WiFi／Ethernet 電路設計與高速訊號規劃 4、BLE與無線通訊介面設計 5、PCB設計與Layout協作電路佈線與驗證 6、EMI / EMC / RF 測試與問題分析改善 7、樣品驗證與量產導入

IC 半導體承載盤(Tray)結構設計與繪製

【澄果科技股份有限公司】 澄果科技深耕電子測試產業二十餘年，專注於提供PCB、IC載板及高階電子產品完整的測試解決方案。我們不僅代理世界級高科技測試設備，更以技術整合及專業服務創造價值。我們是一個熱愛挑戰、充滿創新精神的團隊！如果您也熱衷於技術研發與突破，那您將會在這裡找到屬於自己的職涯舞台！✨💡🔧 主要職責： 1. 帶領工程部團隊，進行工作規劃與分配，確保專業高效運作。 2. 與跨部門及國內外合作夥伴協作，共同完成專案執行和目標達成。 3. 設計教育訓練計畫，提升團隊技能，打造專業菁英隊伍。 4. 負責ISO相關文件的管理與執行，確保符合品質標準與安全規範。 5. 整合資源，主持並追蹤內部會議，驅動專案進度。 6. 制定設備維護計劃，進行效能評估及技術優化。 7. 引進新設備，進行可行分析與導入規劃，提升製造效率。 8. 針對軟硬體設備異常，提供即時技術支援與解決方案。 9. 發掘新技術，持續進行製程改良及技術創新。 加入澄果科技，您將享受以下福利與成長機會： - 三節獎金、加班費、年終獎金及豐厚津貼 - 全方位教育訓練與職涯培育，提供技術深造及國際交流機會 - 彈性特休假、員工體檢、優質保險及多樣性補助津貼 - 鼓勵創新與合作的企業文化，打造互信共享的工作環境 我們期待與擁有豐富管理與技術經驗的您攜手並進，為PCB製造創新注入新動力！😊立即加入我們，一起創造更美好的技術藍圖！

負責弱電.監控.網路.防盜.門禁.通信工程相關現場施工，需可自己獨立作業。

1.有高頻CABLE/光纖CABLE或FFC高頻排線等產品設計。 2.熟悉USB4/PCIe6/6G等相關標準。 3.熟悉各項高頻產品驗證及相關測試設備的使用。 4.熟悉傳輸線原理。 5.相關經驗2年以上。 6.電子相關科系畢。

月休9天，試用期38K，升正40K，獎金另計，享勞健保 .團保、三節獎金、年度分紅、年終獎金、員工旅遊、婚喪喜慶津貼、提供員工健康檢查、員購優惠、員工聚餐、年度春酒摸彩活動、年度特休、提撥勞退6％、生日禮金 【工作內容】 1.電信門號專案介紹講解及銷售 2.手機操作 3.3C相關服務 4.代送維修 5.客戶諮詢...等服務 6.須具備通信經驗 【獎金福利】 1.每月通話費補助$650元、員購優惠。 2.工作獎金無上限，正式人員平均月獎金1-4萬元。 3.每日工作時間超過正常工時皆計加班費。 4.三節獎金、年度分紅、年終獎金、員工旅遊、婚喪喜慶津貼、提供員工健康檢查、員購優惠、員工聚餐、年度春酒摸彩活動、年度特休、提撥勞退6％、生日禮金。 5.完善之教育訓練、培訓課程及晉升管理制度，升遷不侷限年資、而是注重能力。

Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/APAC-Foundry-Operations-Senior-Principal-Engineer_R-10062827 Job Description The APAC Foundry Operation team works with foundry partners on technologies which are evaluated and/or subjected to production. The key areas of responsibility of the jobholder are: - Lead the release and transfer of process options at foundries. - Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process - Lead and steer the projects towards timely completion to support NXP business needs. - Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc. The requirement fulfilling the job: - Bachelor or MSc in physics, material engineering or electrical engineering. In-depth knowledge of semiconductor physics, process development and manufacturing. - ＞10 years of experience with semiconductor process integration, working in foundries’ production or development teams. - Hands on experience in being a lead; leading teams with responsibilities in development, transfer or production projects. - All rounded knowledge on process integration, product testing, reliability testing, tapeouts, device physics will be needed in the discharge of duties as a project/ integration lead. - Good communication skills. - Pro-active working attitude, creative, pragmatic, enterprising and result driven. - Having the ability to influence and steer a discussion. - Familiar in managing/working with foundries, maximizing leverage from foundries.

Role Summary: The NVM Reliability team is responsible for characterizing, modeling, and enabling next-generation Non-Volatile Memory technologies, enabling new product creation company-wide. Job Responsibility: －Interface with foundries and other external suppliers of technology and IP to assess reliability margin to product applications. －Establish qualification requirements for new technology and product introduction. －Perform rigorous statistical analysis of reliability characterization data. －Enable high reliability during volume production by working with product groups to address risk areas. －Support business groups with customer requests for technical information, including reliability characterization results, risks assessments, and consultation on issues. －Communicate study conclusions and recommendations to internal and external teams. Job Qualification: －Bachelor‘s, Masters, or Doctoral degree in Electrical Engineering, Applied Physics, or equivalent, with 10 years of industry experience. －Experienced in data processing and analysis (e.g. Python, JMP, Matlab, Exensio). －Software development experience, such as familiarity with microcontroller software development (C/C++) is desired. －Interest in statistics and solid-state device fundamentals, especially as applied to emerging non-volatile memory technologies like MRAM and RRAM. －Must be curious, proactive, and detail-oriented. －Able to work in a team environment, communicate effectively in English and Mandarin, and solve problems.

***Please apply for this position on NXP official website: https://pse.is/8ms2kr Role Purpose Lead the development and optimization of high-voltage (HV) and BCD device architectures. This role requires a deep understanding of device physics and a data-driven approach to ensure industry-leading performance and reliability for power management solutions. Key Responsibilities － Device Development: Lead the architecture design and optimization of HV devices (LDMOS, EDMOS, ESD) on 180nm to 55nm BCD nodes. － Physics Analysis: Analyze and optimize Device Physics parameters, including BV, Rdson, SOA, and reliability (HCI/NBTI). － Simulation & Modeling: Utilize TCAD for 2D/3D process and device simulations to accelerate development cycles. － Device Verification: Define verification plans and execute statistical analysis using JMP for DOE and WAT data. － Design Integration: Work within Cadence environments for layout review and test structure design. － Cross-functional Collaboration: Partner with PI and PE teams to resolve yield, reliability, and manufacturing bottlenecks. Required Qualifications － Experience: Master‘s or Ph.D. in EE, Physics, or related field with 10+ years of semiconductor industry experience. － Technical Expertise: 1. Profound knowledge of Device Architecture and Device Physics. 2. Hands-on experience in 180nm to 55nm BCD process nodes. － Tools: 1. Expertise in TCAD (Sentaurus / Silvaco). 2. Expertise in JMP for statistical data analysis. 3. Proficiency in Cadence (Layout/Virtuoso). Preferred Qualifications (Plus) － Advanced Power Devices: Experience with GaN, SiC, or IGBT development. － Silicon Photonics: Knowledge of Photonics integration and device physics. － Domain Knowledge: 1. Process Integration (PI): Understanding of mask flow and doping profiles. 2. Product Engineering (PE): Experience in CP/FT data correlation and yield enhancement. Competencies － Accountability: Strong ownership of project milestones and outcomes. － Critical Thinking: Ability to identify root causes in complex device failures. － Interpersonal Skills: Effective communication across design and foundry teams. － Data-driven: Committed to objective decision-making through rigorous data analysis.

1.案件設計執行：依客戶或內部設計需求，完成案件的電路板/載板佈線（Layout）設計。 2.除錯與優化 (Debug)：協助設計案件的除錯與問題分析，確保設計符合規範。 3.新技術開發支援：協助新型機台測試載板的研發與規格開發。 4.案件討論：參與內部案件技術討論，與設計、測試團隊密切溝通，優化整體設計流程。 ★歡迎電子電機相關科系之應屆畢業生，或曾有Layout相關經驗之求職者投遞 ★若您非相關科系畢業，但具備基礎電路學之概念，也歡迎投遞 【薪資說明】 1.本職缺薪資範圍係以大學學歷(相關科系)初估，含設計獎金月薪平均可達4萬以上，且有資格領取超額獎金之人員保證年年調薪。 2.本公司鼓勵多產多得，除每半年依產出計算點數並發放獎金外，每年再依點數達成狀況進行調薪。

1.了解客戶並建議如何訂定還款計畫及減輕付款負擔，提高客戶處理意願。 2.積極負責有耐心且可承受工作壓力，追求績效主動積極不輕易放棄，擅長電話溝通。 3.能了解並更新債務人資料進行電話催款。 4.對各融資/資產案件熟悉。優先考慮電話催收或客服、行銷、市調相關經驗者。 5.法律關係資料蒐集、分析研究並對債務人提出訴訟或強制執行需求。 6.願意融入團隊合作及願意發表意見，自我管理能力佳，正面樂觀的工作態度且樂於參與討論。

1. 工程人力物力管理 2. 工程監工及進度管控 3. 工程請/放款資料建立查核 4. 測試作業 5.一般行政作業 6. 主管交辦事項

1.圖面設計/製作 2.現場管路設計 3.空間管理與協調 4.電腦操作：MS-office、熟AutoCAD 2D及Revit

1.圖面設計/製作 2.現場管路設計 3.空間管理與協調 4.電腦操作：MS-office、熟AutoCAD 2D及Revit

照明產品相關知識 照明產品銷售經驗 照明光源專業知識 電力配置相關技能 電力電機技師證照 照明設計案件實績 AUTOCAD 繪圖技能 無經驗請勿投遞

1.上班地點:主要桃園市 2.工作內容 (1)開發潛在客戶，拓展市場，以達成業績目標 (2)定期拜訪客戶，維繫穩定客戶關係 (3)負責國內業務接洽及訂單處理 (4)負責產品報價及產品展示，並處理帳款回收相關事宜 (5)充分理解公司業務及行業特點，結合客戶要求以制定個別方案 (6)場勘，簡報，建議客戶如何規劃案場，解決客戶相關問題 (7)維護既有客戶，開發新客戶，並推展業務 (8)弱電工程相關工作經驗2-3年者

1.零售通路商品績效管理 2.通路行銷資源規劃與整合 3.通路行銷方案成效分析 4.通路會員經營與行銷管理 5.商品SPI上下架進銷存管理 6.門店促銷方案規劃與整合 7.商圈/社群/團購促銷方案規劃與整合 8.專案活動/專案商品行銷管理 9.商品獎金預算規劃與執行 10.商品輔銷資源規劃 加分條件: 1.具同業經驗佳 2.具數據分析/跨部門溝通能力 3.熟Office文書作業軟體 4.大學畢業/多益400分以上尤佳 5.具邏輯能力、市場敏感度及快速反應能力

1.可擴廠規劃公設、簡易設備維修。 2.具管理工作相關經驗。