清大專區

證券及債券結算交割

須配合例假日排班從事客戶端查修服務等客網單位相關業務工作，及配合相關重點業務 (寬頻、MOD、ICT、SME…等) 推廣與施作。 ** 試用期滿平均月薪40,000~45,000元**(未含依法給予的加班費) 此外，還有依年度績效考核與營運狀況給予調薪及員工酬勞喔!!!! 歡迎符合條件者踴躍應徵！

1.太陽光電專案整體執行進度排定與控管 2.太陽光電專案預算編列及控管 3.太陽光電專案分包計畫製作及各項施工編寫 (彙整文件、整理相關資料，並管理相關文件與檔案) 4.與公司內部各單位間之協調及溝通 5.參與公司定期會議及報告 6.與業主、監造及平行包間之溝通協調 7.參與業主召開之各項會議，標案簡報製作 8.業主與協力商之請付款審核作業報告進度及撰寫報告書

1. 開發潛在客戶，拓展市場，以達成業績目標。 2. 定期拜訪客戶，維繫穩定客戶關係。 3. 負責業務接洽及訂單處理。 4. 負責產品報價及產品展示，處理帳款回收相關事宜。 5. 具良好清晰邏輯做溝通協調、獨立作業能力。 6. 態度積極、有自信、具企圖心、抗壓性高者，歡迎加入我們的行列。 7. 視業務需求狀況配合外地出差 8. 願配合公司發展，調派集團各子公司 ◎工作地點：東南國家 ◎其他福利： 1.供食宿 2.返台假

1. 推廣優惠專案存款，邀請客戶存入新資金。 2. 開發並協助轉介理財客戶、薪轉戶，拓展新客源。 3. 募集信用卡，集團百貨及關企駐點，提供多樣化優質卡別。 4. 開發新通路，維繫經營良好客戶關係。

從事房/信貸等消費金融業務開發與客戶維繫工作。

從事房/信貸等消費金融業務開發與客戶維繫工作。

⇢制定並推動公司整體銷售策略及業務目標達成。 ⇢領導國內外業務團隊，開拓新市場、維護既有客戶關係。 ⇢分析市場趨勢，制定產品行銷及競爭策略。 ⇢與產品、技術、客服等跨部門協作，提升客戶滿意度。 ⇢重大客戶關係管理與關鍵談判。 ⇢協助總管理處規劃公司營收成長藍圖及年度預算設定。 ⊶⊶⊶⊶⊶⊶⊶⊶⊶⊶⊶⊶⊶⊶⊶⊶⊶⊶⊶⊶⊶⊶⊶⊶⊶⊶⊶⊶⊶⊶ ▶職務需求： 大學以上學歷（商學、行銷、國際貿易、工程相關科系尤佳）。 10年以上銷售經驗，5年以上團隊管理經驗。 熟悉半導體產業生態及客戶需求。 優秀的人際溝通與領導能力，具備策略思維與高抗壓性。 能以英文/中文流利溝通。

***Please apply for this position on NXP official website: https://pse.is/8ms2kr Role Purpose Lead the development and optimization of high-voltage (HV) and BCD device architectures. This role requires a deep understanding of device physics and a data-driven approach to ensure industry-leading performance and reliability for power management solutions. Key Responsibilities － Device Development: Lead the architecture design and optimization of HV devices (LDMOS, EDMOS, ESD) on 180nm to 55nm BCD nodes. － Physics Analysis: Analyze and optimize Device Physics parameters, including BV, Rdson, SOA, and reliability (HCI/NBTI). － Simulation & Modeling: Utilize TCAD for 2D/3D process and device simulations to accelerate development cycles. － Device Verification: Define verification plans and execute statistical analysis using JMP for DOE and WAT data. － Design Integration: Work within Cadence environments for layout review and test structure design. － Cross-functional Collaboration: Partner with PI and PE teams to resolve yield, reliability, and manufacturing bottlenecks. Required Qualifications － Experience: Master‘s or Ph.D. in EE, Physics, or related field with 10+ years of semiconductor industry experience. － Technical Expertise: 1. Profound knowledge of Device Architecture and Device Physics. 2. Hands-on experience in 180nm to 55nm BCD process nodes. － Tools: 1. Expertise in TCAD (Sentaurus / Silvaco). 2. Expertise in JMP for statistical data analysis. 3. Proficiency in Cadence (Layout/Virtuoso). Preferred Qualifications (Plus) － Advanced Power Devices: Experience with GaN, SiC, or IGBT development. － Silicon Photonics: Knowledge of Photonics integration and device physics. － Domain Knowledge: 1. Process Integration (PI): Understanding of mask flow and doping profiles. 2. Product Engineering (PE): Experience in CP/FT data correlation and yield enhancement. Competencies － Accountability: Strong ownership of project milestones and outcomes. － Critical Thinking: Ability to identify root causes in complex device failures. － Interpersonal Skills: Effective communication across design and foundry teams. － Data-driven: Committed to objective decision-making through rigorous data analysis.

The key areas of responsibility of the jobholder are: - Collaborate closely with foundries, NXP technology teams, and business lines to qualify and release advanced FinFET processes. - Provide technical leadership in semiconductor device physics, especially in FinFET architecture and behavior. - Interface with internal and external stakeholders on critical development and transfer projects. - Lead and steer projects to meet timelines and business objectives. - Make key decisions on process integration, balancing technical, logistical, and strategic factors. - Support NTI process transfers within foundries and NXP joint ventures Requirements / preferences: - Bachelor‘s or Master‘s degree in Electrical Engineering, Physics, or related field. - Minimum 10 years of experience in semiconductor device engineering, with a strong focus on advanced logic/RF devices. - Proven hands-on experience with HKMG and FinFET technologies in production or development environments. - Deep understanding of semiconductor device physics, especially HKMG and FinFET. - Strong analytical skills in yield enhancement and electrical data analysis. - Fluent in English and Mandarin. - Demonstrated leadership in development, transfer, or ramp-up projects. - Excellent communication and influencing skills. - Proactive, pragmatic, and results-driven mindset. - Experience working with foundries and leveraging external manufacturing capabilities .

Please also apply through: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Tape-Out-Engineer_R-10063230 Role Overview, Responsibilities, and Qualifications The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes. Key Responsibilities 1. Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing. 2. Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors. 3. Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability. 4. Ensure all deliverables conform to foundry requirements. 5. Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement. Qualifications 1. Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred). 2. Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows. 3. Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines. 4. Willingness to work with flexible working hours to support critical Tape-outs. Effective communication in English for collaborating across technical teams. This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.

Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/APAC-Foundry-Operations-Senior-Principal-Engineer_R-10062827 Job Description The APAC Foundry Operation team works with foundry partners on technologies which are evaluated and/or subjected to production. The key areas of responsibility of the jobholder are: - Lead the release and transfer of process options at foundries. - Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process - Lead and steer the projects towards timely completion to support NXP business needs. - Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc. The requirement fulfilling the job: - Bachelor or MSc in physics, material engineering or electrical engineering. In-depth knowledge of semiconductor physics, process development and manufacturing. - ＞10 years of experience with semiconductor process integration, working in foundries’ production or development teams. - Hands on experience in being a lead; leading teams with responsibilities in development, transfer or production projects. - All rounded knowledge on process integration, product testing, reliability testing, tapeouts, device physics will be needed in the discharge of duties as a project/ integration lead. - Good communication skills. - Pro-active working attitude, creative, pragmatic, enterprising and result driven. - Having the ability to influence and steer a discussion. - Familiar in managing/working with foundries, maximizing leverage from foundries.

- Data analysis to ensure handler work on baseline. Ex. MCBA, index time, temperature control and HW interface maintenance 資料分析確保機台運作在基準條件, 包含作動不順, 作動時間, 溫度控制, 及機台介面維護 - SOP, OCAP, PM document creation. 建立標準化流程,異常處理文件,及保養維護文件 - Responsible for the performance of handler. 負責機台性能及相關報告 - Handle the improvement project on handler. 持續進行機台的改善計畫 - Management recipes of handler and spare parts 機台參數管理及備品管理 - Provide technology and operation training to shift assistant engineer and operators in manufacture lines to support production smoothly. 訓練助理工程師與作業員以利生產線順利運作 - Co-work with worldwide handler team for evaluation/improvement 與其他機台團隊跨國合作, 導入評估, 問題改善

***Please upload English resume onto our official platform: https://reurl.cc/1bbx6m Job Descriptions - The selected candidate will participate in Wi-Fi/BT software/firmware design , implementation, integration, validation and maintenance phases for standard based and non-standard based Wi-Fi/BT/BLE products for IOT and automotive markets. - Lead/participate in complex feature integrations/enhancements, Wi-Fi/BT/BLE SoC bring up, and technical issue solving. - Research, design and develop cutting edge technologies for industrial features and IEEE/WFA/BT/BLE spec. Ranging from Wi-Fi enterprise access point, embedded clients and other wireless technologies. - Participate the full life cycle of IC – spec designing, pre-silicon validation, chip bring-up, software development, customer engaging and supporting. Support customers remotely or onsite as needed. Qualifications - MS in EE, CE, or CS. - Proficient in C programming language. - Experience on Linux / Android programming is a plus - Knowledge on real-time OS (FreeRTOS / ThreadX) programming is a plus - Knowledge of ARM assembly is a plus - Team player and excellent interpersonal, communication and writing skills - Independent, self-motivated and willing to learn

1. 操作與維護防火牆和各式網路資安設備 2. 處理資安事件通報 3. 配合主管交辦事項 特別歡迎緯育 TibaMe 的人才加入，一起邁向資安的成就高峰！

1.電信業務營運策略規劃 2.直營/經銷/企客通路電信業務管理 3.年度電信業務指標達成管理(行動/固網) 4.終端商品銷售規劃與管理(綑綁/空機) 5.通路佣金/獎勵/帳務規劃與管理 6.原廠/系統商例行業務對接與維繫 7.申裝品質管理與業務支援 8.新業務發展執行能力(5G/IOT) 9.各項電信業務代理合約管理 10.電銷業務管理與佣獎規劃 加分條件: 1.具同業經驗佳 2.具數據分析/跨部門溝通能力 3.熟Office文書作業軟體 4.大學畢業/多益400分以上尤佳 5.具邏輯能力、市場敏感度及快速反應能力

1.零售通路營運策略規劃 2.通路門市營運分析與發展(實體/OMO) 3.通路行銷企劃與銷售資源整合 4.年度預算目標規劃與達成管理 5.通路業務獎金辦法規劃與管理 6.通路人員規章與考核管理(選育用留) 7.作業品質管理、流程優化與系統需求統籌 8.店格策略與櫃位坪效管理 9.新展店/原址優化/移閉點管理 10.門店店務/庶務管理規範與統籌 加分條件: 1.具同業經驗佳 2.具數據分析/跨部門溝通能力 3.熟Office文書作業軟體 4.大學畢業/多益400分以上尤佳 5.具邏輯能力、市場敏感度及快速反應能力

1.零售通路商品績效管理 2.通路行銷資源規劃與整合 3.通路行銷方案成效分析 4.通路會員經營與行銷管理 5.商品SPI上下架進銷存管理 6.門店促銷方案規劃與整合 7.商圈/社群/團購促銷方案規劃與整合 8.專案活動/專案商品行銷管理 9.商品獎金預算規劃與執行 10.商品輔銷資源規劃 加分條件: 1.具同業經驗佳 2.具數據分析/跨部門溝通能力 3.熟Office文書作業軟體 4.大學畢業/多益400分以上尤佳 5.具邏輯能力、市場敏感度及快速反應能力

1.PLC系統開發與維護： 負責Keyence(KV系列)、Beckhoff(TwinCAT)之程式Ladder/ST編寫與除錯。 2.運動控制整合： 負責伺服馬達、步進馬達之參數調校及多軸運動控制(Motion Control)。 3.人機介面 (HMI) 設計： 規劃與撰寫 Proface, Keyence, Delta 等人機介面流程與操作畫面。 4.電控硬體查修： 具備基本電路查修能力。 5.跨部門溝通與交辦事項執行。

1、機構/機械設計 2、實驗規劃與測試 3、技術文件撰寫 4、ISO文件撰寫 5、應用材料及新技術評估