清大專區

1 負責 Service Team 的人員與流程管理 2 負責 Service Team 整體服務品質的控制 3 負責所有客戶訂閱之服務的設定，包含服務的上線、驗收測試、異動、優化、調較與終止 4 負責所有客戶訂閱之服務的故障排除，包含對上游的支援請求與進度追蹤 5 負責所有客戶訂閱之服務的例行檢查 6 處理工單與維護工單系統 7 回應並執行或轉出客戶的服務請求 8 產出客戶所需之定期報告並舉行客戶例行會議

從事房/信貸等消費金融業務開發與客戶維繫工作。

1.負責櫃台各項存匯作業及相關金融商品推廣 2.具銀行存匯工作經驗或金融業相關經驗 ※具金融相關證照及銷售服務特質者優先錄取，商學相關科系尤佳

1.使用者端電腦暨周邊設備問題諮詢、安裝及故障排除。 2.相關文件報表彙整。 3.其他主管交辦(臨時)事項。 4.因應客戶為政府機關，須配合機關上下班時間出勤 5.維護紀錄文件與作業日誌彙整報顯製作

1. 機構設計開發 / 元件搭配 / 自動化整合以及BOM建立 2. 須熟悉繪圖軟體 Solidworks / Auto CAD... 3. 需出國短期裝機支援, 英文能力佳 4. 專案開發獎金

Please also apply through: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Tape-Out-Engineer_R-10063230 Role Overview, Responsibilities, and Qualifications The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes. Key Responsibilities 1. Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing. 2. Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors. 3. Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability. 4. Ensure all deliverables conform to foundry requirements. 5. Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement. Qualifications 1. Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred). 2. Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows. 3. Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines. 4. Willingness to work with flexible working hours to support critical Tape-outs. Effective communication in English for collaborating across technical teams. This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.

Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/APAC-Foundry-Operations-Senior-Principal-Engineer_R-10062827 Job Description The APAC Foundry Operation team works with foundry partners on technologies which are evaluated and/or subjected to production. The key areas of responsibility of the jobholder are: - Lead the release and transfer of process options at foundries. - Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process - Lead and steer the projects towards timely completion to support NXP business needs. - Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc. The requirement fulfilling the job: - Bachelor or MSc in physics, material engineering or electrical engineering. In-depth knowledge of semiconductor physics, process development and manufacturing. - ＞10 years of experience with semiconductor process integration, working in foundries’ production or development teams. - Hands on experience in being a lead; leading teams with responsibilities in development, transfer or production projects. - All rounded knowledge on process integration, product testing, reliability testing, tapeouts, device physics will be needed in the discharge of duties as a project/ integration lead. - Good communication skills. - Pro-active working attitude, creative, pragmatic, enterprising and result driven. - Having the ability to influence and steer a discussion. - Familiar in managing/working with foundries, maximizing leverage from foundries.

Job Responsibilities - To be the owner for manufacturing test on the released products. - Responsible for test program introduce to mass production - Responsible for NPI (after R-gate released) test data analysis and feedback to BL/PETE if any improvement needed - To be the owner for duplicated test hardware by performing debug and qualification, MSC (Gage R&R) analysis and release report - Responsible for 1st line hold lot disposition, including low yield, QA fail .......etc - To initial and work with related process owners on testing processes, documentation, and best practices - Participate in or drive test automation initiatives when applicable Required Qualifications - 3+ years of experience as a Test Engineer - Solid understanding of software/system testing methodologies - Familiarity with Linux environments and command-line operations - Experience with machine language (e.g., Java, C++) - Experience in system, embedded, hardware, or manufacturing testing - Strong analytical and problem-solving skills - Strong sense of ownership and responsibility for product quality English communication, reading, writing

Role Summary: The NVM Reliability team is responsible for characterizing, modeling, and enabling next-generation Non-Volatile Memory technologies, enabling new product creation company-wide. Job Responsibility: －Interface with foundries and other external suppliers of technology and IP to assess reliability margin to product applications. －Establish qualification requirements for new technology and product introduction. －Perform rigorous statistical analysis of reliability characterization data. －Enable high reliability during volume production by working with product groups to address risk areas. －Support business groups with customer requests for technical information, including reliability characterization results, risks assessments, and consultation on issues. －Communicate study conclusions and recommendations to internal and external teams. Job Qualification: －Bachelor‘s, Masters, or Doctoral degree in Electrical Engineering, Applied Physics, or equivalent, with 10 years of industry experience. －Experienced in data processing and analysis (e.g. Python, JMP, Matlab, Exensio). －Software development experience, such as familiarity with microcontroller software development (C/C++) is desired. －Interest in statistics and solid-state device fundamentals, especially as applied to emerging non-volatile memory technologies like MRAM and RRAM. －Must be curious, proactive, and detail-oriented. －Able to work in a team environment, communicate effectively in English and Mandarin, and solve problems.

***Please apply for this position on NXP official website: https://pse.is/8ms2kr Role Purpose Lead the development and optimization of high-voltage (HV) and BCD device architectures. This role requires a deep understanding of device physics and a data-driven approach to ensure industry-leading performance and reliability for power management solutions. Key Responsibilities － Device Development: Lead the architecture design and optimization of HV devices (LDMOS, EDMOS, ESD) on 180nm to 55nm BCD nodes. － Physics Analysis: Analyze and optimize Device Physics parameters, including BV, Rdson, SOA, and reliability (HCI/NBTI). － Simulation & Modeling: Utilize TCAD for 2D/3D process and device simulations to accelerate development cycles. － Device Verification: Define verification plans and execute statistical analysis using JMP for DOE and WAT data. － Design Integration: Work within Cadence environments for layout review and test structure design. － Cross-functional Collaboration: Partner with PI and PE teams to resolve yield, reliability, and manufacturing bottlenecks. Required Qualifications － Experience: Master‘s or Ph.D. in EE, Physics, or related field with 10+ years of semiconductor industry experience. － Technical Expertise: 1. Profound knowledge of Device Architecture and Device Physics. 2. Hands-on experience in 180nm to 55nm BCD process nodes. － Tools: 1. Expertise in TCAD (Sentaurus / Silvaco). 2. Expertise in JMP for statistical data analysis. 3. Proficiency in Cadence (Layout/Virtuoso). Preferred Qualifications (Plus) － Advanced Power Devices: Experience with GaN, SiC, or IGBT development. － Silicon Photonics: Knowledge of Photonics integration and device physics. － Domain Knowledge: 1. Process Integration (PI): Understanding of mask flow and doping profiles. 2. Product Engineering (PE): Experience in CP/FT data correlation and yield enhancement. Competencies － Accountability: Strong ownership of project milestones and outcomes. － Critical Thinking: Ability to identify root causes in complex device failures. － Interpersonal Skills: Effective communication across design and foundry teams. － Data-driven: Committed to objective decision-making through rigorous data analysis.

The key areas of responsibility of the jobholder are: - Collaborate closely with foundries, NXP technology teams, and business lines to qualify and release advanced FinFET processes. - Provide technical leadership in semiconductor device physics, especially in FinFET architecture and behavior. - Interface with internal and external stakeholders on critical development and transfer projects. - Lead and steer projects to meet timelines and business objectives. - Make key decisions on process integration, balancing technical, logistical, and strategic factors. - Support NTI process transfers within foundries and NXP joint ventures Requirements / preferences: - Bachelor‘s or Master‘s degree in Electrical Engineering, Physics, or related field. - Minimum 10 years of experience in semiconductor device engineering, with a strong focus on advanced logic/RF devices. - Proven hands-on experience with HKMG and FinFET technologies in production or development environments. - Deep understanding of semiconductor device physics, especially HKMG and FinFET. - Strong analytical skills in yield enhancement and electrical data analysis. - Fluent in English and Mandarin. - Demonstrated leadership in development, transfer, or ramp-up projects. - Excellent communication and influencing skills. - Proactive, pragmatic, and results-driven mindset. - Experience working with foundries and leveraging external manufacturing capabilities .

***Please upload English resume onto our official platform: https://reurl.cc/1bbx6m Job Descriptions - The selected candidate will participate in Wi-Fi/BT software/firmware design , implementation, integration, validation and maintenance phases for standard based and non-standard based Wi-Fi/BT/BLE products for IOT and automotive markets. - Lead/participate in complex feature integrations/enhancements, Wi-Fi/BT/BLE SoC bring up, and technical issue solving. - Research, design and develop cutting edge technologies for industrial features and IEEE/WFA/BT/BLE spec. Ranging from Wi-Fi enterprise access point, embedded clients and other wireless technologies. - Participate the full life cycle of IC – spec designing, pre-silicon validation, chip bring-up, software development, customer engaging and supporting. Support customers remotely or onsite as needed. Qualifications - MS in EE, CE, or CS. - Proficient in C programming language. - Experience on Linux / Android programming is a plus - Knowledge on real-time OS (FreeRTOS / ThreadX) programming is a plus - Knowledge of ARM assembly is a plus - Team player and excellent interpersonal, communication and writing skills - Independent, self-motivated and willing to learn

Please apply for this position on NXP official website: https://pse.is/836k2a Job Responsibilities: APAC Central Competence Team works with external foundries to ensure stable chip supply for business lines across NXP. The primary responsibility of this role is to locally drive the lead products ramp up under new technology introduction (NTI). The key areas of responsibility of the jobholder are: 1. Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process 2. Front end process safe launch owner. Closely work with foundries at ramp up phase and drive for manufacturability and yield improvement. 3. Interface with key customers on critical projects. 4. Lead and steer the projects towards timely completion to support NXP business needs 5. Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc Requirements / preferences: 1. Bachelor or MSc in physics or electrical engineering. 2. ＞10 years of experience with front-end IC process integration, working in foundries’ production or development teams 3. In-depth knowledge of IC devices and processes. FinFET and NVM knowledge is a plus. 4. Strong understanding of yield enhancement techniques and data analysis 5. Must be fluent in English and Mandarin 6. Hands on experience in being a lead; leading teams with responsibilities in development / transfer projects or production ramp up. 7. Good communication skills. Having the ability to influence and steer a discussion 8. Pro-active working attitude, creative, pragmatic, enterprising and result driven. 9. Familiar in managing/working with foundries, maximizing leverage from foundries

工作內容： 1.進料檢驗及檢驗紀錄填寫。 2.製程巡檢及檢驗紀錄填寫。 3.出貨檢驗及製作出貨報告。 4.製程不合格品複檢及檢驗紀錄填寫。 5.檢驗紀錄保管。 6.主管交辦工作事項。 歡迎對半導體及紅外熱成像產品領域有興趣、重視細節且具責任感的你加入我們的品檢團隊，一同守護產品品質，強化客戶在監控、安全檢查、工業及醫療等應用上的信賴。期待您的加入，請立即投遞履歷。

1. 國內外各飯店專案相關業務。 2. 國內外客戶售後服務英文連繫工作。 3.能配合海外出差或參展。 4.團隊合作無業績壓力。 5.主管交辦事項。

1.圖面設計/製作 2.現場管路設計 3.空間管理與協調 4.電腦操作：MS-office、熟AutoCAD 2D及Revit

1. 參與每日施工工具箱會議 2. 現場監工 3. 工程請購、發包作業 4. 專案相關報表製作

公司新進產品研究及教育訓練,客戶設備檢測送修維護

開發與撰寫LED燈串使用的控制器 需要有較高的EQ與工作能量

照明產品相關知識 照明產品銷售經驗 照明光源專業知識 電力配置相關技能 電力電機技師證照 照明設計案件實績 AUTOCAD 繪圖技能 無經驗請勿投遞