清大專區

Please also apply through: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Tape-Out-Engineer_R-10063230 Role Overview, Responsibilities, and Qualifications The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes. Key Responsibilities 1. Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing. 2. Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors. 3. Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability. 4. Ensure all deliverables conform to foundry requirements. 5. Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement. Qualifications 1. Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred). 2. Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows. 3. Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines. 4. Willingness to work with flexible working hours to support critical Tape-outs. Effective communication in English for collaborating across technical teams. This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.

Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/APAC-Foundry-Operations-Senior-Principal-Engineer_R-10062827 Job Description The APAC Foundry Operation team works with foundry partners on technologies which are evaluated and/or subjected to production. The key areas of responsibility of the jobholder are: - Lead the release and transfer of process options at foundries. - Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process - Lead and steer the projects towards timely completion to support NXP business needs. - Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc. The requirement fulfilling the job: - Bachelor or MSc in physics, material engineering or electrical engineering. In-depth knowledge of semiconductor physics, process development and manufacturing. - ＞10 years of experience with semiconductor process integration, working in foundries’ production or development teams. - Hands on experience in being a lead; leading teams with responsibilities in development, transfer or production projects. - All rounded knowledge on process integration, product testing, reliability testing, tapeouts, device physics will be needed in the discharge of duties as a project/ integration lead. - Good communication skills. - Pro-active working attitude, creative, pragmatic, enterprising and result driven. - Having the ability to influence and steer a discussion. - Familiar in managing/working with foundries, maximizing leverage from foundries.

***Please upload English resume onto our official platform: https://reurl.cc/qpRoqg Job Description - To work with operation/maintenance to ensure production smoothly. - To assist action confirmations with system monitors. - To work with Engineers for yield improvements from the study of stable plasma cleaning as the leading indicator. Job Qualification: - Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structures - Bachelor‘s or Master‘s student in Material/Science/Electronic Engineering or related - Available to work at least 3 days/week. - Good verbal and written English communication skills - MS Office or Programming skill - Self-motivated, results oriented, willing and eager to learn, proactive attitude

***Please upload English resume onto our official platform: https://reurl.cc/Em0W00 Job Description - To work with IT and Equipment/Production team for MMS (Machine Maintenance Solution) spare part and tool management system build up - To assist Automation project of introducing AMHS (Automatic Material Handling System) for product transportation from wire bond stage to molding stage. Qualifications: - The candidate must be pursuing a Bachelor’s or Master’s degree in Mechanical/Electronic Engineering or related. - Available to work 3 days/ week. - Good verbal and written English communication skills - MS Office, AutoCAD or Programming skill - Self-motivated, results oriented, willing and eager to learn, proactive attitude

Job Description -　Main contact window with business lines (BLs) to deliver a high quality and manufacturable product for IC test production, meeting or exceeding the required time to market or product cost. -　Take lead of new product introduction (NPI) for IC test -　To coordinate with related BLs (business line) and align with wafer/final test factories to prepare the product transfer -　To improve new product introduction procedure to enable smooth product transfer -　To reduce risk and impact to customers and factories, escalation management, e.g. reduce risk and impact by right and timely escalation -　To ensure no gap on test tooling availability Facilitate IC test data review and process for planning forecast, take responsibility on test technical data (and improvement plan) in time and accuracy -　To follow up test improvement projects, hold lots, progress of New Product Introduction, test buy off…etc. -　Process of Test Engineering Notice and Enovia ECO Requirement -　Bachelor degree (or above), Engineering background is preferred. -　Excellent communication skills (English/Mandarin, TOEIC＞600) -　Good logic thinking -　Be familiar with MS Office tool -　1 yrs experience in IC testing or related working experience is preferred

- Ensure compliance with Taiwan electrical regulations, SEMI standards, and safety codes. 負責廠區電力系統之運轉、維護及管理，確保符合台灣電業法規、SEMI規範及相關安全要求。 - Manage and maintain facility electrical systems, including: High/low voltage distribution (HV/LV), Switchgear, transformers, UPS, and generators. 負責廠務電力系統設備之日常管理與維護，包括：高低壓配電系統（HV/LV）/ 開關設備（Switchgear）/ 變壓器（Transformer）/ UPS不斷電系統 / 緊急發電機系統（Generator） - Proficient in AutoCAD for electrical drawings and single line diagrams 繪製及維護電力系統圖面，包含 AutoCAD 電氣圖及單線圖（Single Line Diagram）。 - Strong knowledge of high-voltage power systems, including: Protective relay operation, Single line diagram development and interpretation, Familiar with motor control systems. 負責高壓電力系統規劃、操作與分析，包括：保護電驛（Protective Relay）設定與應用 / 單線圖建立與判讀 / 馬達控制系統（Motor Control System）管理與改善 - Handle emergency response for power-related incidents and recovery planning. 處理廠區電力異常事件，執行緊急應變、故障排除及復電計畫。 - Ensure power reliability and quality to support critical manufacturing tools 確保廠區關鍵電力系統穩定運作，維持生產設備供電可靠度與電力品質。 - Monitor and improve system performance, capacity, and efficiency. 監控電力系統運轉績效，持續改善系統容量、可靠度與能源使用效率。 - Lead preventive maintenance (PM), especially annual electricals PM activity and troubleshooting for power systems. 規劃及執行預防保養（PM）作業，包含年度高低壓停電保養、設備點檢及電力系統故障分析。 - Coordinate power system upgrades, expansions, and projects 負責電力系統擴充、升級及改善專案規劃與執行。 - Support new tool installation(Hook-up) and capacity ramp-up planning. 配合產線及機台建置需求，執行廠務配電規劃、Hook-up二次配支援及產能擴充評估。 - Analyze power consumption and drive energy-saving initiatives. 分析廠區用電數據，推動節能改善專案及能源管理措施，提升整體能源使用效率。 Qualifications: - Bachelor‘s degree or above, preferable in Electrical Engineering 大學以上學歷，電機工程、電力工程等相關科系尤佳。 - At least 3+ years of experience in industrial or semiconductor facilities. 具 3 年以上廠務電力系統、工業配電系統或半導體廠務相關工作經驗。 - Relevant certifications is a plus. (Electrical Engineer license, HV certification, etc.) 具電機技師、高壓電工作業相關證照者優先。 - Familiar with PLC operation and basic control logic is a plus. 熟悉 PLC 操作及基礎控制邏輯者佳。 - Experience in Energy Management Systems (EMS), such as ISO 50001, and HVAC systems is a plus. 具能源管理系統EMS(Energy Management System)或 ISO 50001 能源管理系統導入經驗者佳。 - Experience in facility utility systems such as central air conditioning and chilled water systems is preferred. 具 中央空調、冰水系統等廠務公用系統經驗者佳。 - Experience in facility operations within semiconductor Assembly & Test (A&T) plants is highly preferred. 具半導體封裝測試廠（Assembly & Test）廠務經驗者尤佳。

***Please apply for this position on NXP official website: https://pse.is/8ms2kr Role Purpose Lead the development and optimization of high-voltage (HV) and BCD device architectures. This role requires a deep understanding of device physics and a data-driven approach to ensure industry-leading performance and reliability for power management solutions. Key Responsibilities － Device Development: Lead the architecture design and optimization of HV devices (LDMOS, EDMOS, ESD) on 180nm to 55nm BCD nodes. － Physics Analysis: Analyze and optimize Device Physics parameters, including BV, Rdson, SOA, and reliability (HCI/NBTI). － Simulation & Modeling: Utilize TCAD for 2D/3D process and device simulations to accelerate development cycles. － Device Verification: Define verification plans and execute statistical analysis using JMP for DOE and WAT data. － Design Integration: Work within Cadence environments for layout review and test structure design. － Cross-functional Collaboration: Partner with PI and PE teams to resolve yield, reliability, and manufacturing bottlenecks. Required Qualifications － Experience: Master‘s or Ph.D. in EE, Physics, or related field with 10+ years of semiconductor industry experience. － Technical Expertise: 1. Profound knowledge of Device Architecture and Device Physics. 2. Hands-on experience in 180nm to 55nm BCD process nodes. － Tools: 1. Expertise in TCAD (Sentaurus / Silvaco). 2. Expertise in JMP for statistical data analysis. 3. Proficiency in Cadence (Layout/Virtuoso). Preferred Qualifications (Plus) － Advanced Power Devices: Experience with GaN, SiC, or IGBT development. － Silicon Photonics: Knowledge of Photonics integration and device physics. － Domain Knowledge: 1. Process Integration (PI): Understanding of mask flow and doping profiles. 2. Product Engineering (PE): Experience in CP/FT data correlation and yield enhancement. Competencies － Accountability: Strong ownership of project milestones and outcomes. － Critical Thinking: Ability to identify root causes in complex device failures. － Interpersonal Skills: Effective communication across design and foundry teams. － Data-driven: Committed to objective decision-making through rigorous data analysis.

***Please upload English resume onto our official platform: https://reurl.cc/9WEqOV NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 45,000 employees in more than 35 countries. Opportunity Join a world class team working on state of the art Tier 1 automotive products. NXP‘s Highly Profitable Business Line Advanced Power Solutions is seeking experienced Mobile Power Analog Designers. We engage directly with the most visible and successful mobile companies. Site Job Description Working in the Power Delivery group of the Advanced Power Solutions business line, candidate will be part of a team developing fast charging and power delivery solutions for mobile applications. Task and responsibilities - Responsible for technical executions from block design, verification, and validation for mixed signal integrated circuits, Guarantee the technical deliverables of his jobs in terms of quality and performance; - This includes system definition, block architecture, circuit design, simulation and layout. All aspects require good engineering skills together with analysis, creativity, collaboration and customer interaction. - Must have strong expertise in analog design theory and device physics, and be capable of applying these to original and novel techniques that can provide significant value. - Write articles for technical publications and conferences, and provide email and phone support for assigned products. - Documentation for design reviews and design notes, layout guidance, and other cell design activities. - Our work culture encourages engineering innovation and creativity. Engineers are expected to file patents, publish papers or technical articles and to maintain awareness of current technical developments. Design engineers are part of a team and interact globally and locally with customers, design partners, product, test and packaging engineers, program management, quality, and business teams. Qualifications - Candidate needs to hold a minimum of a B.S. degree in electrical engineering. M.S. degree is preferred. - At least 10 years direct experience designing analog and mixed-signal transistor level circuitry for power management applications. - Ability to design traditional analog MOS and BJT circuits such as bandgap references, amplifiers, oscillators, detection circuits, linear LDO and switching regulators. - Ability to design multiphase DC-DC switching converter and experienced in current balance circuit. - Knowledge in digital controlled loop design. - Other desirable skills include experience with mixed-signal design tools and flow, reading and writing Verilog AMS models.

1.零售通路發展策略規劃 2.通路門市營運分析與發展(實體&OMO) 3.通路商品管理與銷售資源整合 4.年度預算目標規劃與達成管理 5.通路櫃位管理與店格策略 6.系統需求統籌與流程管理 7.通路業務獎金辦法規劃與管理 8.通路人員選育用留與作業品質管理

1. 負責機能材料產品之銷售及新產品開發 2. 產品送樣、報價、量產等與客戶端連繫及相關業務聯繫 3. 定期報告銷售進度及市場說明 4. 掌握產品設計時程及產量狀況 5.具英文或日文專長

OQC檢驗作業 檢驗資料/紀錄維護 (電腦操作)

1.協助程式設計師撰寫程式碼。 2.程式撰寫自我測試。 3.協助產製應用軟體操作手冊。 4.協助應用軟體偵錯修繕。

1.工具機及生產設備的開發圖面設計 2.可獨立作業 3.會3D建模(SOLIDEDGE) 4.有油壓氣壓設備知識

1. 遊戲產品的自動化測試規劃 (QE plan)。 2. 各遊戲產品測試的 SOP 建立、調整與管理。 3. 新遊戲產品的自動化程式編寫與維護。 4. 遊戲產品測試案例 (Test Case) 編寫與維護。 5. 遊戲產品自動化測試。 6. 遊戲產品表現面 (手動+工具) 測試。 7. 遊戲產品的 BUG 追蹤。 8. 定期遊戲品質報告之彙整與提交。 9. 各項跨部門會議之參與以及問題之追蹤。

1.遊戲軟體程式設計 2.網路伺服器程式設計 3.伺服器維護 4.伺服器管理後台程式設計 5.具好奇心, 工作熱忱、樂於學習與成長、喜歡參與開發及討論

1. 客戶端的產品售前規劃、POC技術支援。 2. 客戶端安裝建置導入、教育訓練。 3. 產品操作、更新技術文件撰寫製作。 4. 經銷商、客戶端的產品教育訓練。 5. 代理及協銷產品的技術支援。 6. 其他主管交辦事項。

1. 推廣優惠專案存款，邀請客戶存入新資金。 2. 開發並協助轉介理財客戶、薪轉戶，拓展新客源。 3. 募集信用卡，集團百貨及關企駐點，提供多樣化優質卡別。 4. 開發新通路，維繫經營良好客戶關係。

從事房/信貸等消費金融業務開發與客戶維繫工作。

從事房/信貸等消費金融業務開發與客戶維繫工作。