清大專區

Job Description -　Main contact window with business lines (BLs) to deliver a high quality and manufacturable product for IC test production, meeting or exceeding the required time to market or product cost. -　Take lead of new product introduction (NPI) for IC test -　To coordinate with related BLs (business line) and align with wafer/final test factories to prepare the product transfer -　To improve new product introduction procedure to enable smooth product transfer -　To reduce risk and impact to customers and factories, escalation management, e.g. reduce risk and impact by right and timely escalation -　To ensure no gap on test tooling availability Facilitate IC test data review and process for planning forecast, take responsibility on test technical data (and improvement plan) in time and accuracy -　To follow up test improvement projects, hold lots, progress of New Product Introduction, test buy off…etc. -　Process of Test Engineering Notice and Enovia ECO Requirement -　Bachelor degree (or above), Engineering background is preferred. -　Excellent communication skills (English/Mandarin, TOEIC＞600) -　Good logic thinking -　Be familiar with MS Office tool -　1 yrs experience in IC testing or related working experience is preferred

Job Responsibilities - To be the owner for manufacturing test on the released products. - Responsible for test program introduce to mass production - Responsible for NPI (after R-gate released) test data analysis and feedback to BL/PETE if any improvement needed - To be the owner for duplicated test hardware by performing debug and qualification, MSC (Gage R&R) analysis and release report - Responsible for 1st line hold lot disposition, including low yield, QA fail .......etc - To initial and work with related process owners on testing processes, documentation, and best practices - Participate in or drive test automation initiatives when applicable Required Qualifications - 3+ years of experience as a Test Engineer - Solid understanding of software/system testing methodologies - Familiarity with Linux environments and command-line operations - Experience with machine language (e.g., Java, C++) - Experience in system, embedded, hardware, or manufacturing testing - Strong analytical and problem-solving skills - Strong sense of ownership and responsibility for product quality English communication, reading, writing

***Please apply for this position on NXP official website: https://pse.is/8ms2kr Role Purpose Lead the development and optimization of high-voltage (HV) and BCD device architectures. This role requires a deep understanding of device physics and a data-driven approach to ensure industry-leading performance and reliability for power management solutions. Key Responsibilities － Device Development: Lead the architecture design and optimization of HV devices (LDMOS, EDMOS, ESD) on 180nm to 55nm BCD nodes. － Physics Analysis: Analyze and optimize Device Physics parameters, including BV, Rdson, SOA, and reliability (HCI/NBTI). － Simulation & Modeling: Utilize TCAD for 2D/3D process and device simulations to accelerate development cycles. － Device Verification: Define verification plans and execute statistical analysis using JMP for DOE and WAT data. － Design Integration: Work within Cadence environments for layout review and test structure design. － Cross-functional Collaboration: Partner with PI and PE teams to resolve yield, reliability, and manufacturing bottlenecks. Required Qualifications － Experience: Master‘s or Ph.D. in EE, Physics, or related field with 10+ years of semiconductor industry experience. － Technical Expertise: 1. Profound knowledge of Device Architecture and Device Physics. 2. Hands-on experience in 180nm to 55nm BCD process nodes. － Tools: 1. Expertise in TCAD (Sentaurus / Silvaco). 2. Expertise in JMP for statistical data analysis. 3. Proficiency in Cadence (Layout/Virtuoso). Preferred Qualifications (Plus) － Advanced Power Devices: Experience with GaN, SiC, or IGBT development. － Silicon Photonics: Knowledge of Photonics integration and device physics. － Domain Knowledge: 1. Process Integration (PI): Understanding of mask flow and doping profiles. 2. Product Engineering (PE): Experience in CP/FT data correlation and yield enhancement. Competencies － Accountability: Strong ownership of project milestones and outcomes. － Critical Thinking: Ability to identify root causes in complex device failures. － Interpersonal Skills: Effective communication across design and foundry teams. － Data-driven: Committed to objective decision-making through rigorous data analysis.

The key areas of responsibility of the jobholder are: - Collaborate closely with foundries, NXP technology teams, and business lines to qualify and release advanced FinFET processes. - Provide technical leadership in semiconductor device physics, especially in FinFET architecture and behavior. - Interface with internal and external stakeholders on critical development and transfer projects. - Lead and steer projects to meet timelines and business objectives. - Make key decisions on process integration, balancing technical, logistical, and strategic factors. - Support NTI process transfers within foundries and NXP joint ventures Requirements / preferences: - Bachelor‘s or Master‘s degree in Electrical Engineering, Physics, or related field. - Minimum 10 years of experience in semiconductor device engineering, with a strong focus on advanced logic/RF devices. - Proven hands-on experience with HKMG and FinFET technologies in production or development environments. - Deep understanding of semiconductor device physics, especially HKMG and FinFET. - Strong analytical skills in yield enhancement and electrical data analysis. - Fluent in English and Mandarin. - Demonstrated leadership in development, transfer, or ramp-up projects. - Excellent communication and influencing skills. - Proactive, pragmatic, and results-driven mindset. - Experience working with foundries and leveraging external manufacturing capabilities .

- Data analysis to ensure handler work on baseline. Ex. MCBA, index time, temperature control and HW interface maintenance 資料分析確保機台運作在基準條件, 包含作動不順, 作動時間, 溫度控制, 及機台介面維護 - SOP, OCAP, PM document creation. 建立標準化流程,異常處理文件,及保養維護文件 - Responsible for the performance of handler. 負責機台性能及相關報告 - Handle the improvement project on handler. 持續進行機台的改善計畫 - Management recipes of handler and spare parts 機台參數管理及備品管理 - Provide technology and operation training to shift assistant engineer and operators in manufacture lines to support production smoothly. 訓練助理工程師與作業員以利生產線順利運作 - Co-work with worldwide handler team for evaluation/improvement 與其他機台團隊跨國合作, 導入評估, 問題改善

***Please upload English resume onto our official platform: https://reurl.cc/1bbx6m Job Descriptions - The selected candidate will participate in Wi-Fi/BT software/firmware design , implementation, integration, validation and maintenance phases for standard based and non-standard based Wi-Fi/BT/BLE products for IOT and automotive markets. - Lead/participate in complex feature integrations/enhancements, Wi-Fi/BT/BLE SoC bring up, and technical issue solving. - Research, design and develop cutting edge technologies for industrial features and IEEE/WFA/BT/BLE spec. Ranging from Wi-Fi enterprise access point, embedded clients and other wireless technologies. - Participate the full life cycle of IC – spec designing, pre-silicon validation, chip bring-up, software development, customer engaging and supporting. Support customers remotely or onsite as needed. Qualifications - MS in EE, CE, or CS. - Proficient in C programming language. - Experience on Linux / Android programming is a plus - Knowledge on real-time OS (FreeRTOS / ThreadX) programming is a plus - Knowledge of ARM assembly is a plus - Team player and excellent interpersonal, communication and writing skills - Independent, self-motivated and willing to learn

Please apply for this position on NXP official website: https://pse.is/836k2a Job Responsibilities: APAC Central Competence Team works with external foundries to ensure stable chip supply for business lines across NXP. The primary responsibility of this role is to locally drive the lead products ramp up under new technology introduction (NTI). The key areas of responsibility of the jobholder are: 1. Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process 2. Front end process safe launch owner. Closely work with foundries at ramp up phase and drive for manufacturability and yield improvement. 3. Interface with key customers on critical projects. 4. Lead and steer the projects towards timely completion to support NXP business needs 5. Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc Requirements / preferences: 1. Bachelor or MSc in physics or electrical engineering. 2. ＞10 years of experience with front-end IC process integration, working in foundries’ production or development teams 3. In-depth knowledge of IC devices and processes. FinFET and NVM knowledge is a plus. 4. Strong understanding of yield enhancement techniques and data analysis 5. Must be fluent in English and Mandarin 6. Hands on experience in being a lead; leading teams with responsibilities in development / transfer projects or production ramp up. 7. Good communication skills. Having the ability to influence and steer a discussion 8. Pro-active working attitude, creative, pragmatic, enterprising and result driven. 9. Familiar in managing/working with foundries, maximizing leverage from foundries

證券及債券結算交割

1、IoT／網通產品WiFi Router、Network Device 硬體架構規劃與電路設計開發 2、MCU電路設計與整合 3、WiFi／Ethernet 電路設計與高速訊號規劃 4、BLE與無線通訊介面設計 5、PCB設計與Layout協作電路佈線與驗證 6、EMI / EMC / RF 測試與問題分析改善 7、樣品驗證與量產導入

1.協助廠內設備軟體修改及測試 2.製造設備軟體設計開發 3.專案管理

1設備組立&配管作業。 2.設備組立問題處理與紀錄。 3.客戶端零組件安裝保養。 4.組裝環境&工具管理維護。 5.設備零組件管理。 6.設備零組件進貨檢查管理。 7.設備出機前置作業。 8.設備交機作業。 9.部門制式文書表格資料撰寫。 10.參加外部課程訓練。 11.主管交辦事項處理。

1.成品外觀檢驗，確認產品品質符合各項相關規範。 2.成品功能與電性測試，確保產品正常運作。 3.檢驗結果紀錄與品質報表整理。 4.異常品判定、回報與追蹤處理。 5.配合生產進度進行加班作業。 6.完成主管交辦之品質相關事項。

負責弱電.監控.網路.防盜.門禁.通信工程相關現場施工，需可自己獨立作業。

1.協助客戶設備安裝/維護/調整 2.維持客戶設備在廠營運及現場故障排除 3.協助編寫機台故障報告及說明問題原因 4.協助客戶端機台修改線路及機構安裝調整

1.協助客戶設備安裝/維護/調整 2.維持客戶設備在廠營運及現場故障排除 3.協助編寫機台故障報告及說明問題原因 4.協助客戶端機台修改線路及機構安裝調整

1.產品銷售及B2B客戶服務,新市場之開發 2.報價,送樣,確認交易規格,異常貨款催收 3.客訴的基本處理 4.與客戶端共同work新規格(客製品) 5.客戶VS原廠聯繫與溝通 6.Maintain客戶，對產品之銷售及客戶服務 *另有季達標獎金、業務用手機配發、公司業務用車 *公司重視教育訓練、創造學習文化，希望您是樂於學習的 *發明家科技官網：https://www.invnitech.com

1.代理商品銷售推廣 2.市場銷售計劃執行 3.商品銷售整合支援服務 4.配合公司工作規劃要求

【熟練AI應用的行銷專員】我們在等你！ 是時候在LED產業的舞台上一展設計與創意的才華了！📣 💡 加入我們 1. 打造公司的專業形象，設計型錄、海報、DM、展覽素材、Banner等迷人視覺平面設計 2. 精準支援社群媒體，設計行銷素材，讓品牌在線上也能大放異彩 3. 靈活運用設計與多媒體軟體，像AI和PS一樣得心應手，還能處理動畫與影音製作 4. 積極支持跨部門需求或臨時任務，用設計與動畫為團隊解決問題 💻 核心技能 熟悉排版、平面設計和美術編輯，能獨立完成任務，還有出色的色彩運用與視覺感受，絕對是我們的理想人選！✨ 🌟 我們希望 你可以附上相關作品，並清楚標註熟練使用的軟體，讓我們一眼就感受到你的專業與創意！

1. 遊戲產品的自動化測試規劃 (QE plan)。 2. 各遊戲產品測試的 SOP 建立、調整與管理。 3. 新遊戲產品的自動化程式編寫與維護。 4. 遊戲產品測試案例 (Test Case) 編寫與維護。 5. 遊戲產品自動化測試。 6. 遊戲產品表現面 (手動+工具) 測試。 7. 遊戲產品的 BUG 追蹤。 8. 定期遊戲品質報告之彙整與提交。 9. 各項跨部門會議之參與以及問題之追蹤。

1.遊戲軟體程式設計 2.網路伺服器程式設計 3.伺服器維護 4.伺服器管理後台程式設計 5.具好奇心, 工作熱忱、樂於學習與成長、喜歡參與開發及討論