清大專區

【Job Purpose 】 Responsible for inbound and outbound SCM operations including supply planning of finished products and key components, inventory management, warehousing, and transportation to ensure supply of product while minimizing excess risks. 【Key Responsibilities】 • Supply Management for Mass Production -Compose product demand plans of finished products and keep it rolling to EMS supplier on weekly basis according to demand plan update from account sales & internal sales. -Compose “Consigned Component” demand plans according to finished product demands and keep them rolling as internal input for component preparation. -Drive supply plans from EMS suppliers to assure abundant and timely supply of finished products. -Reconcile demand/supply gap with necessary expedition efforts. -Monitor demand trend and submit proactive alert of over/under-supply and finished goods/component inventory adjustment. • Supply Management for NPI Sample Build -Manage material preparation and physical build of NPI sample to assure timely sample completion and delivery. -Communicate with RD and PM to acquire clear build requirement (Design, Quantity…etc.). -Review BOM with EMS during design phase, submit early alert of potential supply shortfall and advocate the need for alternate sources. • Logistics & Physical Distribution -Monitor and assure timely products movement from ODM/EMS to customer sites. -Logistics routing planning and optimization with forwarders to assure best delivery lead-time and costs to final destinations • Compliance -Work with R&E department to ensure compliance with supply chain activities standards and regulation • Report & Data Maintenance -Compose and submit regular reports concerning supply chain operation -Data input into system that meets the company‘s inventory control needs through transportation of raw materials, component parts and/or finished goods followed by supervisors. • Continuous Improvement -Execute continuous improvement actions for process and procedures -Recognize and recommend operational improvements.

【Job Purpose】 維持電子工程部門日常運作，協助電子工程師日常工作 【Key Responsibilities】 • 新產品備料，工程樣品管理 • 協助產品失效分析 • 實驗數據與生產數據統計 • 工程儀器操作，產品測試，工程樣品驗證 • 工程進度追蹤，會議記錄 • 實驗室管理，設備維護

職務內容: 1. Ethernet NIC產品開發或產品規劃 2. 內部專案進度管理，資源之協調 3. 客戶關係維持及提升及產品推廣執行 所需條件 1. 碩士以上;電機工程、電信工程、電子工程、資訊工程相關科系畢業為主 2. 具5年以上IC Design House 或相關產業之產品應用及客戶推廣經驗 3. 具5年以上PM及市場推廣工作經驗者佳 4. 英文聽說讀寫流利者佳

1.負責機弱電類物料&工程 詢比價，時時瞭解市場價格資訊。協助對下合約製作與用印。 2.建立/更新/維護管理相關文件檔案（如：合約 訂購單 領用單 廠商建檔)ERP系統及固定報表製作。 3.廠商介面&請款作業，更新供應商資訊。 4.原物料或設備送審，驗收等程序， 5.對上請款跟催與發票開立申請，與幹部共參與業主會議， 6.主管其他交辦事項。 *案件類型:建案與公家機電工程等

1. 儲能系統高低壓電力、機電自動控制、弱電監控、消防設備等盤體規畫設計。 2. 機電圖面繪製、檢討、整合和修改及工程施工協調。 3. 具有電力盤體及弱電盤體規劃之經驗。機電工程品質管控、成本預算控制、現場監督、時程掌握、驗收測試。 4. 具有高壓電池系統或是PCS等開發或產品應用經驗尤佳 5. 儲能或充電站案場驗收測試、調整及維護支援。 6. 儲能系統專案時程規劃、追蹤專案進度、跨部門協調等工作，協助確保各專案如期上線並管控品質 7. 其他主管交辦事項

職位職責： 1.根據公司的資安策略，執行技術層面的安全措施。 2.設計並實施系統安全架構，包括網路分段、存取控制等。 3.利用先進的安全資訊和事件管理（SIEM）工具，進行即時威脅偵測和分析。 4.定期進行漏洞掃描，評估系統弱點，並協調修補工作。 5.開發和維護安全自動化腳本，提高安全操作效率。 6.監控資安事件，使用技術工具進行入侵檢測和應急響應。 7.為其他IT團隊提供安全相關的技術諮詢和指導。 資格要求： 1.學歷：學士學位或同等資格，資訊安全、電腦科學或相關領域優先考慮。 2.經驗：至少2年以上的技術層面資安工作經驗。 3.認證：CEH、Security+(有證照者優先考慮)。 技術技能： 1.深入了解網路安全架構和協議 2.熟悉至少一種程式語言（如Python、Go） 3.熟悉常見的資安工具（如Nmap、Wireshark、Metasploit） 4.了解雲端安全概念和實踐（AWS、Azure或GCP） 5.解決能力：卓越的問題解決和分析能力，能夠應對複雜的技術資安挑戰。 6.學習精神：對資安趨勢和新技術保持敏感，並具備不斷學習的精神。

品質計畫執行： 依據工程契約、規範製作並推動實施品質計畫。 內部稽核與把關： 監督施工各階段的合規性，執行品質抽查與內部稽核。 缺失矯正追蹤： 負責品管統計分析，並針對工程缺失提出預防及矯正措施。 工作待遇：將依學經歷進行敘薪。

負責公司 BI 儀表板、Self-Service BI 推廣、ETL / ELT 資料整合、資料治理、資料 API 串接、數據中台維運，以及GenAI、AI Agent 與企業知識庫等 AI 應用開發與導入，協助企業建立穩定、可信任且具備 AI 應用能力的數據服務平台。 ※工作待遇：將依學經歷進行敘薪。

1.執行結構CAE分析，提供設計風險評估與改善設計建議 2.參與振動衝擊試驗，負責問題分析並提供解決方案 ※依學經歷、工作年資敘薪

1.執行結構CAE分析，提供設計風險評估與改善設計建議 2.參與振動衝擊試驗，負責問題分析並提供解決方案 3.帶領團隊成員，進行研發議題研究與報告 ※依學經歷、工作年資敘薪

1. 專案管理與團隊領導：主導 Notebook 專案開發流程（從概念到量產），控管開發時程（NPI Schedule）與設計品質。 2. 技術審核與風險控管：負責機構設計之關鍵審核（Technical Gatekeeping），針對轉軸、窄邊框、結構強度等高風險領域進行預判與防堵。 3. 跨部門協作與溝通：擔任技術決策核心，協調 ID、EE、Thermal 及 PM，解決系統配置與設計衝突。 4. 供應商管理與成本控制：管理模具 NRE 與零件單價，主導新製程（如 RHCM、鎂合金壓鑄）的供應商開發與量產良率談判。 5. 流程優化與人才培訓：導入 AI 與自動化設計工具，負責團隊績效考核、技術傳承（Lessons Learned）與新人指導。 ※依學經歷、工作年資敘薪

1.針對NB/PC產品進行前期熱模組細部設計與評估 2.NB熱模組測試規劃，提供實驗數據結果 3.進行issue debug以確保產品品質 4.執行研發階段驗證產品功能,以確保產品功能之完整性 ※依學經歷、工作年資敘薪

1.伺服器高速/多層板 PCB layout 設計 2.依據 SPEC 設定並執行佈線規則 3.產生 PCB 生產底片並負責和 PCB 廠商溝通相關問題 ※依學經歷、工作年資敘薪

1.Manage the development of multiple projects. 2.Lead the design and implementation of BIOS/UEFI, prioritizing Reliability, Availability, and Serviceability to enhance overall system performance. 3.Provide technical leadership to the team, introducing and implementing best practices to optimize development processes. 4.Collaborate with clients to gather and analyze project requirements, and conduct thorough risk assessments to identify potential challenges. 5.Coordinate collaboration across various departments to achieve the project goal.

1.負責 Server DC Power 電源架構規劃、設計開發與專案執行，確保產品開發進度符合時程需求。 Responsible for Server DC Power architecture planning, design development, and project execution to ensure product schedules are achieved. 2.主導 DC Power 開發相關工作，包含電源方案設計、驗證與問題分析，確保專案執行與開發效率。 Lead DC Power development activities, including power solution design, validation, and issue debugging, to ensure project execution and development efficiency. 3.與 EE、Layout、Thermal、SI、FW、ME、Vendor 及客戶密切合作，確保電源方案符合產品規格與客戶需求。 Collaborate closely with EE, Layout, Thermal, SI, FW, ME, vendors, and customers to ensure power solutions meet product specifications and customer requirements. 4.負責電源設計品質與風險控管，包含 design review、debug、validation、量產導入與可靠度驗證。 Manage power design quality and risk control, including design review, debugging, validation, mass production implementation, and reliability verification. 5.熟悉並評估 Server 電源技術與市場趨勢，導入具競爭力的電源解決方案。 Analyze Server power technology and market trends to develop competitive power solutions. 6.負責關鍵電源零組件與方案評估，包含 Hot Swap、eFuse、Multi-phase VR、POL與LDO 等。 Evaluate key power components and solutions, including Hot Swap, eFuse, Multi-phase VR, POL and LDO-related designs. 7.協助跨部門技術溝通與客戶技術對應，推動專案順利量產。 Support cross-functional technical communication and customer engagement to ensure successful project execution and mass production. ※依學經歷、工作年資敘薪

【AITE】(Automation Infrastructure and Tools Engineering) team: provide automation & tools solution to support server design, validation and MFG production. (1) BMC/BIOS/HW/performance test tools and automation (2) MFG L6/L10/L11 etc. test solution (3) Automation test platform development 工作內容: 1.負責伺服器診斷軟體與自動化測試工具開發，支援 Design Validation（DV）與 Manufacturing（MFG）需求。 2. 開發與維護 X86 Server 平台診斷工具、自動化測試程式與 Validation Framework。 3. 設計與實作 Diagnostic Features、Test Scripts 與 Validation Utilities。 4. 執行系統除錯（Debugging）、問題分析（Troubleshooting）與 Root Cause Investigation。 5. 分析 Server 平台相關問題，包括 CPU、DIMM、NIC、GPU、Switch、Storage、NVMe 等系統模組。 6. 持續優化自動化測試效率、軟體品質與開發流程。 7. 帶領小型開發團隊，掌握專案時程、交付品質與問題收斂。 8. 與硬體、韌體、Validation、Manufacturing 團隊跨部門合作，快速定位與解決問題。 9. 支援量產環境之問題分析、測試改善與軟體優化。 ※依學經歷、工作年資敘薪 Job Description: 1. Develop server diagnostic software and automation tools to support Design Validation (DV) and Manufacturing (MFG) environments. 2. Develop and maintain diagnostic tools, automation test programs, and validation frameworks for X86 server platforms. 3. Design and implement diagnostic features, test scripts, and validation utilities. 4. Perform system debugging, troubleshooting, and root cause investigation. 5. Analyze server platform issues related to CPU, DIMM, NIC, GPU, Switch, Storage, NVMe, and related subsystems. 6. Continuously improve automation efficiency, software quality, and development productivity. 7. Lead small development teams and manage project execution, delivery quality, and issue closure. 8. Collaborate with hardware, firmware, validation, and manufacturing teams to resolve technical issues efficiently. 9. Support production issue analysis, test optimization, and software enhancement.

1. 負責智慧型裝置產品之主動式（Active Cooling）與被動式（Passive Cooling）散熱方案設計與優化。 2. 參與 RFP/RFQ 階段的 Thermal Solution 規劃，包含可行性評估、效能分析及成本估算。 3. 使用 FloTHERM / Ansys Icepak 建立熱模型，執行熱模擬分析與設計優化。 4. 規劃並執行產品熱測試與驗證，分析 Thermal Performance、進行 Root Cause Analysis，並推動問題改善。 5. 建立及維護 Thermal 相關技術文件，包括 PTS、Thermal Test Plan、Thermal Design Guide 等。 6. 與跨功能研發團隊合作，並研究與評估新型散熱技術、材料及 Thermal Solution，推動未來產品應用 == English == 1. Responsible for the design and optimization of active and passive cooling solutions for smart device products. 2. Participate in RFP/RFQ-stage thermal solution planning, including feasibility assessment, performance evaluation, and cost estimation. 3. Build thermal models and perform thermal simulation, analysis, and design optimization using FloTHERM / Ansys Icepak. 4. Plan and execute thermal testing and validation, analyze thermal performance, conduct Root Cause Analysis, and drive issue resolution and improvement. 5. Develop and maintain thermal-related technical documentation, including PTS, Thermal Test Plans, and Thermal Design Guides. 6. Collaborate with cross-functional engineering teams to research and evaluate new thermal technologies, materials, and thermal solutions for future product applications.

【Key Responsibilities】: • Develop and maintain the QA strategy for assigned SW projects in coordination with Quality Manager • Create, maintain and ensure the execution of the QA Plan for the project • Define, monitor and report quality KPIs at SW and ML model level • Prepare the quality status report highlighting non-conformities and quality risks to project management • Define escalation process to ensure identified non-conformities are addressed and resolved effectively • Perform internal gap analysis at SW and ML level to assess compliance with A-SPICE processes • Conduct work product reviews, audits and process compliance checks within the project • Collaborate with engineering and supply chain teams to resolve quality-related issues and implement corrective and preventive actions • Support project teams in preparing for internal and/or external ASPICE assessments for SW and ML • Facilitate lessons learned sessions and collaborate closely with software and ML engineering teams to implement A-SPICE process improvements and ensure alignment with functional safety standards • Ensure proper documentation and traceability across the development lifecycle, particularly for the SUP.1 process • Support the definition and refinement of the Product Development Process in alignment with organizational and project-specific quality requirements • Serve as the quality interface with Mandarin-speaking engineering teams and OEM counterparts, facilitating alignment on quality requirements and findings

1、產品分析報告 2、新產品導入 3、測試程式撰寫、維護 4、異常分析及處理 5、良率改善 6、報表製作及工程分析

1. 協助總經理處理各項業務專案 2. 負責追蹤業務或專案執行進度，計劃推動與時程控管 3. 負責追蹤重要客訴執行進度 4. 有國外大型客戶開發成功經驗尤佳 5. 有業務主管管理業務人員經驗尤佳 6. 有開關與端子產業經驗尤佳 7. 有電機、電子、機械背景尤佳 8. 熟悉進出口業務 9. 須精通英文