清大專區

[Job Description] 1. Responsible for the daily maintenance, servicing, and stable operation of production equipment. 2. Handle equipment malfunctions, analyze anomalies, and troubleshoot issues. 3. Implement equipment performance improvements to enhance production efficiency and equipment utilization rates. [Requirements] Degree in a STEM-related field; no prior experience required. [Work Schedule] Must be willing to work a 4-shift, 2-rotation schedule. Day shift: 07:30–19:35; Night shift: 19:30–07:35. [Salary] Based on a 20-day work month: Day shift NT$50,000–55,000; Night shift NT$60,000–65,000 (includes shift allowances and overtime pay). [Special Notes] Mandarin proficiency at TOCFL Level A2 or above is preferred.

[Job Description] 1. Responsible for process planning, monitoring, and routine maintenance. 2. Conduct analysis of process anomalies and implement corrective actions. 3. Optimize process parameters to improve yield, production efficiency, and stability. 4. Execute projects for introducing new processes and materials, as well as enhancing process capabilities. [Requirements] Degree in a science or engineering-related field; no prior experience required. [Special Notes] Mandarin proficiency at TOCFL Level A2 or above is preferred.

【工作說明】 1. 負責廠區機電、空調、水務等公用系統之工程管理、維護保養及改善，確保系統穩定運轉。 2. 執行設備異常分析、真因追查、預防保養、年度歲修及改善專案，持續提升設備可靠度與運轉效能。 3. 維護工程相關文件（SOP、SPEC、保養紀錄等），配合跨部門協作及節能、成本優化等專案推動。 【應徵條件】 電機、機械、冷凍空調、環工、能源等相關科系，將依專長調整工作任務

【工作說明】 1.負責人員管理、教育訓練及工作績效評估 2.追蹤現場物料領用與耗材管控，維持作業環境之 5S 標準 3.即時反映機台故障與品質瑕疵，填寫生產日報表與異常記錄 4.掌握品質管理、異常處理，提昇良率 【上班時間】 固定早班/晚班 日班:07:30-19:35；夜班:19:30-7:35 【薪資條件】 以工作20天計算，早班50,000~55,000元、夜班60,000~65,000元(含輪班津貼及加班費)

1.開發北美區域市場潛在客戶/維護既有客戶 2.外銷變壓器、電抗器、配電盤及GIS等相關設備 3.設備詢報價/客戶議價/交期交涉/客戶驗收/外銷出口安排 4.客戶來廠接洽/短期海外出差客戶訪銷 5.工作地點: 桃園市大園區*1或台北市中山區*1

美光將於校園博覽會當天，同步進行現場面談，也歡迎直接攜帶紙本履歷至美光攤位，如有安排現場面試也請攜帶身分證明文件喔! Be Micron, Be the World. 美光看見您的未來！為職業生涯選定最好的起跑點，美光積極尋找優秀人才，無論性別、國籍或科系，邀請你一同發揮創新力量，讓我們發掘你的無限潛能。台灣美光提供多元文化的工作環境給想要接軌國際舞台的你，歡迎加入美光，為自己的職涯開創無限可能。 ★ 美光校園徵才 - 有機會獲得美光Offer的加速管道：越早投遞，機會越大！ - 校園徵才現場面談場次: 美光將與用人主管於校園徵才博覽會當天直接前往校園，省去找工作的舟車勞頓！ ★ 校園招募對象： 1. 大學/研究所畢業兩年內或2026-2027 應屆畢業生 2. 工作經驗兩年內的學長姐也非常歡迎哦! ★ 校園招募職類： 製程工程、設備工程、品質工程、軟體工程、智慧製造、廠務工程、工業工程、產品工程、產品工程測試職類等。更多職缺請搜尋 tw.micron.com/careers ★ 應徵準備資料： 中/英文履歷自傳，如有相關作品歡迎列入履歷中或另附專案簡報(1-2頁) ★ 工作地點： 苗栗銅鑼科學園區 台中市后里區三豐路4段369號(中科后里科學園區) 桃園市龜山區復興三路667號(華亞科技園區) 台南市安南區科技一路36號(台南科技工業區) ★ 校園博覽會/美光企業日場次 Campus Job Fairs/ Micron Day (所有場次皆開放現場面試! All sessions have on-campus interview) 2026/03/19 【東海大學 Tunghai University】美光企業日 Micron Day 2026/03/24 【勤益科技大學 National Chin-Yi University of Technology】美光企業日 Micron Day 2026/03/26 【台中科技大學 National Taichung University of Science and Technology】美光企業日 Micron Day 2026/03/27 【台灣科技大學 National Taiwan University of Science and Technology】美光企業日 Micron Day 2026/03/31 【高雄科技大學 National Kaohsiung University of Science and Technology】美光企業日 Micron Day ★校園說明會場次 Career Talk 2026/03/19 【東海大學 Tunghai University】 2026/03/24 【勤益科技大學 National Chin-Yi University of Technology】 2026/03/26 【台中科技大學 National Taichung University of Science and Technology】 2026/03/27 【台灣科技大學 National Taiwan University of Science and Technology】 2026/03/31 【高雄科技大學 National Kaohsiung University of Science and Technology】 ★ Micron 2026 Campus Bonus! – the earlier you apply, the earlier you get Micron’s offer! http://micron.az1.qualtrics.com/jfe/form/SV_9KWYO0VgBHqyKea ★ Jobs for New College Graduates: Process Engineering, Equipment Engineering, Quality Engineering, IT/SMAI, Facility Engineering, Industrial Engineering You can also search for Micron‘s latest recruiting information on Jobs at Micron. ★ Required documents for application: English resume and autobiography, transcripts for all semesters, related projects (collect in a PDF with words and pictures). ★ Work Location: Tongluo:(Tongluo Science Park) Taichung: No. 369, Section 4, Sanfeng Road, Houli District, Taichung City (Zhongke Houli Science Park) Taoyuan: No. 667, Fuxing 3rd Road, Guishan District, Taoyuan City (Huaya Science and Technology Park) Tainan: No. 36, Keji 1st Road, Annan District, Tainan City (Tainan Technology Industrial Park)

負責控制室的電機、機械操作、設備品檢以及維修之工作

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19516&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Building world-class cloud-native infrastructure and scaling to high-volume production are crucial for enabling TSMC‘s global growth. We are seeking a highly motivated engineer to join our global service team in supporting TSMC fabrication facilities worldwide. The ideal candidate is disciplined, customer-focused, possesses excellent language skills, demonstrates strong problem-solving abilities, has great attention to detail, is an effective communicator, thrives in a fast-paced environment, and is adaptable to evolving challenges. Responsibilities: 1. Develop a thorough understanding of IT products to effectively resolve issues faced by TSMC employees when using IT systems and services. 2. Identify and diagnose IT system or service abnormalities, working collaboratively with system sponsors to troubleshoot and resolve system failures. 3. Deliver professional and customer-oriented support to enhance user satisfaction with IT systems and services, while providing constructive feedback to IT product owners to drive continuous system quality improvements. 4. Collaborate with the team to ensure efficient resolution of incidents and maintain seamless operations. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

1. 負責半導體製造設備的信號線路拉設、管路銜接、製程管路保溫等工作。 2. 協助提升半導體製造設備的效率和穩定性，推動生產工藝的改善工作。 3. 與其他相關部門或廠商進行溝通，處理半導體製造設備相關問題。 4. 參與半導體製造設備相關專案的執行和推進。 5. 需要進行外派工作。 半導體產業是目前全球經濟發展最快速的產業之一，而半導體設備工程師是這個產業中非常重要的一份子。在這份工作中，你將負責協助維護和提升半導體製造設備的效率和穩定性，進一步推動半導體產業的發展，也將有機會接觸到最前沿的技術。 歡迎具備相關經驗和資格的求職者加入我們的團隊，一同為半導體產業發展貢獻自己的力量。

1.開發東協區域市場潛在客戶/維護既有客戶 2.外銷變壓器、電抗器、配電盤及GIS等相關設備 3.設備詢報價/客戶議價/交期交涉/客戶驗收/外銷出口安排 4.客戶來廠接洽/短期海外出差客戶訪銷 5.工作地點: 桃園市大園區*1或台北市中山區*1

1.開發日本區域市場潛在客戶/維護既有客戶 2.外銷變壓器、電抗器、配電盤及GIS等相關設備 3.設備詢報價/客戶議價/交期交涉/客戶驗收/外銷出口安排 4.客戶來廠接洽/短期海外出差客戶訪銷 5.工作地點: 桃園市大園區*1或台北市中山區*1

於-成廠區以及工區-執行以下工務： 1.出工人員之人數清點及工具箱會議主持。 2.執行廠區相關作業申請。 3.出席參與及廠區各項規定宣導。 4.施工現場巡檢、稽核，防止不安全行為及動作。

1. Design, develop, and maintain ETL / ELT data pipelines, including data ingestion, parsing, transformation, validation, and export. 2. Modularize, standardize, and automate existing script-based or manual processes, and define clear pipeline interfaces, dependencies, and processing flows. 3. Establish monitoring, logging, error handling, retry, failure recovery, and data validation mechanisms to ensure pipeline reliability and data quality. 4. Analyze and optimize data processing performance, reliability, and scalability. 5. Collaborate with Database Engineers and Automation / DevOps Engineers to integrate databases, NAS / file storage, and workflow orchestration platforms. 6. Create and maintain relevant architecture, interface, operation, and troubleshooting documentation.

1. 至科技廠、工廠及企業客戶現場執行設備安裝與建置作業。 2. 網路線佈設、設備接線及施工整理。 3. 設定設備網路參數（IP、Gateway、DNS等）。 4. 執行設備功能測試。 5. 處理現場設備異常及基本故障排除。 6. 填寫施工紀錄、驗收文件及服務報告。 7. 配合專案需求至外縣市或客戶廠區出差施工。

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22574&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : Come and join an innovative and challenging team, where groundbreaking ideas shape the future of semiconductor technology. As an R&D Engineer, you will work on advanced technology development, such as exploratory research in advanced device architectures, device and process integration for manufacturability, advanced module process development, as well as the evaluation of novel materials, equipment, and processes. Responsibilities: 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration For Device Engineers: (1) Transistor Architecture & Design: Pioneering device design for advanced nodes. (2) Advanced Characterization: Defining the parameters of technological progress by characterizing state-of-the-art devices, establishing SPICE modeling targets, and conducting bench electrical measurements (I-V, C-V). (3) Simulation & Modeling: Utilizing TCAD (Technology Computer-Aided Design) and HSPICE to simulate device characteristics, optimize performance, and fortify model integrity. (4) Test Key Design: Crafting precision test key designs to facilitate accurate electrical modeling, design rule validation, and comprehensive device characterization. (5) Customer design enablement: Providing SPICE Model. For Integration Engineers (or Process Integration Engineers) : (1) Process Flow Integration: Integrating devices across various process modules (Lithography, Etch, Thin Films/Epi, Diffusion, CMP) to build a robust, manufacturable baseline for yield and device learning. (2) Experimentation & Lot Handling: Designing advanced Experiments (DOE) to meet device KPIs. Periodically serving as the on-duty engineer to coordinate and handle device lots in the R&D fab. (3) Yield & Reliability Learning: Conducting big data analysis (using JMP, Python, or custom iEDA tools) to identify process design weaknesses, hardware issues, or yield detractors. (4) Technology Transfer: Transitioning the proven, optimized advanced integration baseline process from the R&D phase to fab for high-volume manufacturing. 3. Module R&D Engineer (1) Pioneer Next-Generation Technologies: Research and develop advanced processes, novel materials, next-generation tooling, and cutting-edge computational/simulation methodologies for leading-edge semiconductor nodes. (2) Drive High-Impact Innovation: Deliver highly manufacturable, stable, and cost-effective process technologies. Optimize device physics and performance to meet stringent yield, reliability, and qualification standards. (3) Bridge Lab-to-Fab Scaling: Lead the technology transfer of advanced processes and hardware solutions from R&D phase to High-Volume Manufacturing (HVM) fabs, witnessing your research scale into global production. 4. R&D Process Center (1) PE: Develop advanced module process, optimizing stability and manufacturability to ensure high yield and reliability. Transfer processes and tools to volume manufacturing while collaborating with cross-functional teams and external suppliers to drive leading-edge module integration. Additionally, manage day-to-day operations, troubleshoot equipment, and mentor technicians to sustain operational excellence. (2) EE: Manage advanced semiconductor equipment (Diffusion, Thin Film, Lithography, or Etching) by performing warm-ups, troubleshooting, and efficiency enhancements. Plan and execute defect detection projects to analyze performance while collaborating closely with cross-functional engineers and vendors to ensure optimal equipment productivity and stability. (3) MFG: Oversee daily IC foundry operations, managing work schedules, direct labor, and cross-functional collaboration (PE/PIE/EQ) to ensure consistent service delivery. Drive productivity, manage multiple projects with overlapping deadlines, and analyze data to keep operations running smoothly. Additionally, contribute to process improvements and maintain robotic/detection systems to meet customer and business objectives.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22575&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development. productivity/quality. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22576&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel process/device/product developing for Specialty technologies. 2. Process Integration/Module, Device Analysis/Simulation, Modeling, Test-chip design tape out and WAT/Bench measurement system developing. 3. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22578&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們確保晶片的品質、持續提升良率，提供給客戶具有競爭力且高品質的晶片，讓電子產品不但先進且效能穩定；製程整合工程師為半導體製造中的重要協調者，需要與客戶溝通了解客製化的晶片應用需求，再將訊息帶回廠內，與各工程單位合作。良率精進工程師監控晶片的良率與缺陷，使用量測機台監測晶片的缺陷，找出可能的問題，再與製程解決問題。 1. A highly motivated individual with a strong technical background and capabilities to develop and sustain process technologies for logic, flash memory, and specialty products. 2. Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 3. Be responsible for sustaining ownership such as day-to-day operations, troubleshooting equipment and mentoring technicians. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22579&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們在第一線負責晶片製造過程，改善機台製程參數的設定，提升良率並讓機台每單位時間產出增加，也降低生產成本；半導體製程可大致分為四大模組，大致流程順序為薄膜沈積、黃光微影製程、溼式與乾式蝕刻、熱製程與離子摻雜(擴散)。 1. To be responsible to drive leading edge process/device/advanced packaging development and optimization of CMOS/Flash/Specialty devices to meet scaling, performance, reliability, and manufacturability requirements. 2. Identify and solve IC process and device problems. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22580&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 台積電，全球半導體技術的領航者，邀請您一同開創未來！在台積，挑戰與成就感並存，而且機會永遠獎勵給有決心與韌性的人! 在自動化的生產線上，設備工程師是能發揮長才與想像力確保高精密和高單價的半導體設備穩定運行的核心。不僅負責設備的維修和保養，還兼具改造半導體設備零件，提升製程良率與機台穩定度。未來工廠 (機器人、AI、物聯網、VR) 正在tsmc發酵，這些都需要設備工程師的創新想法和參與，期待每一位有無限可能的你加入，和我們一起大放光芒。 Responsibilities: 1. Master Nano Diffusion, Thin Film, Lithography, Etching, or Metrology equipment. 2. Sustain and troubleshoot issues with high-tech equipment. 3. Improve and enhance the efficiency and productivity of equipment. 4. Plan and execute the analysis or defect detection projects. 5. Communicate with cross-functional engineers or vendors. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.