清大專區

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22580&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 台積電，全球半導體技術的領航者，邀請您一同開創未來！在台積，挑戰與成就感並存，而且機會永遠獎勵給有決心與韌性的人! 在自動化的生產線上，設備工程師是能發揮長才與想像力確保高精密和高單價的半導體設備穩定運行的核心。不僅負責設備的維修和保養，還兼具改造半導體設備零件，提升製程良率與機台穩定度。未來工廠 (機器人、AI、物聯網、VR) 正在tsmc發酵，這些都需要設備工程師的創新想法和參與，期待每一位有無限可能的你加入，和我們一起大放光芒。 Responsibilities: 1. Master Nano Diffusion, Thin Film, Lithography, Etching, or Metrology equipment. 2. Sustain and troubleshoot issues with high-tech equipment. 3. Improve and enhance the efficiency and productivity of equipment. 4. Plan and execute the analysis or defect detection projects. 5. Communicate with cross-functional engineers or vendors. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22581&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 智慧製造工程師為創造晶圓產出最大化，滿足客戶交期，為公司帶來營收；身為工廠的第一線管理者，需掌握生產流程，藉由良好且精準派工提升機台生產效率，帶領技術員團隊確保製造流程順暢運行並達成每日的產能目標。 As a global semiconductor technology leader, TSMC is seeking an Intelligent Manufacturing Engineer to join our team. Our commitment to driving manufacturing excellence has led us to integrate artificial intelligence, machine learning, expert systems, and advanced algorithms to build up an intelligent manufacturing environment. Join TSMC, we are the most advanced technology team and connect with the world, as we head towards an unlimited future. We look forward to you joining us! You will be assigned to one of the following five roles according to your interest, experiences, and technical background. Responsibilities: 1. MFG Intelligent Manufacturing Engineer As an Intelligent Manufacturing Engineer, you will be responsible for the development and maintenance of these intelligent manufacturing systems, which are widely used for scheduling and dispatching, employee productivity, equipment productivity, process and equipment control, quality defense, and robotic control. By optimizing quality, productivity, efficiency, and flexibility, you will play a crucial role in driving the success of our manufacturing operations. (1) Smart manufacturing engineers will learn leading artificial intelligence manufacturing technologies worldwide. (2) Big data analysis, improving production efficiency: Through data analysis, identify bottleneck machines and improve machine production efficiency. Breakthrough analysis and dispatching project system, optimize production resources and maximize manufacturing efficiency. (3) Machine learning, creating unlimited possibilities: Utilize cutting-edge machine learning technology to improve the production process and create innovative applications that achieve optimal scheduling and maximize wafer production capacity. 2. CIM Intelligent Manufacturing Engineer (1) Software Developers: Design and develop intelligent manufacturing solutions for factory automation, manufacturing scheduling and dispatching, decision making and engineering analysis. (2) Dispatching Algorithm Developers: Heterogeneous data integration and corresponding solution design and development. (3) Quality Management Engineer: Server maintenance and related setting support including routine upgrades, troubleshooting with AP teams, high-availability architecture, virtual machines solutions, firewall rule, IIS, Nginx, database middle etc. 3. Data Analyst & Data Scientist (1) Application of statistics, machine learning, data mining, pattern recognition and other data analysis by AI techniques. (2) Your main responsibility will be to collect, explore, and extract insights from very large scale structured and unstructured data and explain these insights with the help of data visualization tools to support fab operations. 4. AMHS (Automated Material Handling System) Engineer (1) AMHS (Software) system & AI development/(Hardware) layout design & transport simulation. (2) Enhance System Performance, Quality and Reliability. (3) Coordinate cross-organization AMHS projects. 5. PIDS/WAT (Wafer Acceptance Test) Engineer (1) New WAT tool data matching and release. (2) WAT quality/manufacturing efficiency improvement. (3) WAT tool, recipe, and system management. (4) WAT productivity and quality improvement. (5) WAT tool and systematic issue troubleshooting. 6. PIDS/NTO (New Tape Out) Engineer (1) Handle mask tape out and manufacturing flow creation. (2) Manage projects related to NTO system development and enhancement. 7. Quality Management Engineer (1) Manage audit, defense, and quality systems. (2) To perform data analysis and simulation. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22582&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 廠務工程師為整合各項廠區資源，提供晶圓生產所需之電力、水、氣體、化學品、空調等，為台積高度智慧自動的生產單位，供應最高品質、最穩定的生產作業環境。近年廠務工程師更肩負環境保護與永續的責任，如何精進節水、節能、減碳、環保的廠務運轉技術，更是廠務工程師可以發揮專業與創意的主舞台。 1. Responsible for planning, constructing, operating, and maintaining semiconductor plant facility systems, including risk analysis of facility system operations and supply quality, allocating resources and energy, managing construction safety. 2. Provide a stable facility system, including power, water, gas, chemicals and HVAC, to meet wafer production requirements. 3. Collaborate with other departments to ensure that the facility system operates at the highest level of quality when on duty. 4. Construction management & project coordination. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22584&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: TSMC‘s advanced packaging process is an efficient and high-density packaging technology that mainly targets the demand for high-performance semiconductor components, including microprocessors, graphics processors, artificial intelligence chips, etc. This technology uses advanced 3D stacking technology to vertically stack multiple chips and uses high-density packaging materials to fix them together. This technology can improve the performance of components, reduce power consumption, reduce package size, and increase system integration. TSMC‘s packaging process includes various technologies such as CoWoS, InFO. Among them, CoWoS is a technology that connects different chips through copper wires through silicon interconnect technology to achieve high-frequency and high-speed data transmission. InFO technology directly encapsulates chips on the substrate, connecting chips and substrates through tiny copper wires, achieving a more compact and efficient packaging solution. TSMC‘s advanced packaging process can improve chip performance and production efficiency and meet the packaging technology requirements of modern high-performance electronic products, such as smartphones, artificial intelligence, high-performance computing, and other fields. TSMC‘s advanced packaging organization include Testing R&D Engineer conduct exploratory research in DFT test architecture, evaluating next-gen test technology of several device (logic SOC, HPC, AP, RF, etc.), which used 3D silicon stacking and advanced packaging technologies and closely teamwork with international customer from new product introduction to mass production. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22585&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 品質與可靠性工程師：為守護客戶產品不受任何缺陷影響，建立優良的產品品質與可靠度，以協助客戶在市場上搶得先機、強化競爭力；QR致力於開發領先全球的電子、物理、材料與化學等科學分析專業及可靠度統計量測方法，應用於我們的產線，確保從晶片設計、製程開發、產品量產到封裝測試等階段的品質及可靠度問題皆有完整的解決方案，同時提供最先進的材料與故障分析等服務，成為公司各組織、客戶以及供應商最信任的合作夥伴。 1. Quality and Reliability roles. 2. Failure & TEM analysis, Reliability data analysis with reliability modeling, manufacturing production quality management and reliability assessment, research, and development of new analysis methodology/technique. 3. Customers problem resolving production quality / reliability issues. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22586&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: You will be tasked with one or more of the following responsibilities: 1. Development and integration of Factory Automation Systems. 2. Development and integration of Advanced Technology. 3. Development and integration of Office Automation Systems. 4. Development and integration of Cloud Computing, Kubernetes or Big Data Analytics Systems. 5. Build/Development Scalable Platform for managing container applications. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22588&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Buyer & Planner Job Title：Global Procurement and Supply Planning Professionals (1) Develop and manage world class supplier partnerships with leading sourcing, procurement, supply chain management solutions and deliver continuous improvements in business results, quality, cost, delivery, service and sustainability toward reliable and cost-effective supply chain. (2) Develop procurement strategies and enhance/execute collaborations across diverse suppliers, groups and stakeholders while optimizing the solution for TSMC. (3) Conduct demand forecasting and supply planning to ensure requirements are fulfilled. (4) Manage suppliers to ensure reliable delivery and replenishment. (5) Lead/coordinate cross functional enhancement project(s) for supply chain excellence. You are welcome to apply for the current job openings listed below: A. Global Procurement and Sourcing Professionals - Equipment and Parts/Accessory, General Affairs, Indirect Materials, Facility and Automation, IT. B. Global Supply Planning Professionals - Materials and Parts 2. Logistics Management (LWM & IEB) Job Title：Global Logistics Digital Transformation Engineer (1) Reinforce concrete domain knowledge through daily operations, such as shipment handling and logistics provider management, and review existing processes to identify areas for improvement to achieve excellence in the logistics model. (2) Assist in the development of new fit-for-purpose digital solutions to improve operational efficiency and develop a global logistics network with local regulatory compliance solutions. (3) Lead cross-functional team members to innovate logistics and warehouse processes using leading-edge technology (e.g., ASRS, AGV, robots, B2B data flow, and RPA). (4) Lead team members and implement training programs to develop specialists in global transportation and supply chain management logistics. (5) Lead or coordinate cross-functional enhancement projects for excellence in the logistics model. Please refer to TSMC ESG Spotlight 3. Green Supply Chain (ESG/Auditor) Job Title：Responsible Supply Chain Management Engineer (1) 2+ years of working experience in related fields. (2) Master’s degree or above in Environmental Studies, Economics, Sustainability, Engineering (Civil, Electrical, Mechanical, or General) or related field. (3) Fluent in spoken and written languages skills for both Chinese and English. (4) Strong negotiation skills and ability to lead cross functional projects. (5) Strong understanding of greenhouse gas emissions accounting or reporting standards (e.g., GHG Protocol, SBT, RE100), and experience with corporate Scope 3 reporting and management. (6) Capable of managing large data sets is a plus. You are welcome to apply for the current job openings listed below: A. Logistics Transportation Digital Transformation Engineer B. Supply Chain Logistic Management Engineer Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22573&source=1111&tags=AO+2027_1111 因為期待無限可能，所以選擇台積電！ 台積公司致力於營造一個充滿挑戰、持續學習且充滿樂趣的工作環境，並提供高於業界平均水準的薪酬與福利。加入台積電，您將有機會與世界一流的卓越夥伴共事，透過最先進的製程技術，共同成就改變世界的偉大事業。每一項突破與創新，都凝聚了我們的努力與心血。 2027年台積電預辦登積計畫：招募2027年應屆畢業生與研發替代役 台積電誠摯邀請「志同道合」的您，透過「線上應徵」事先註冊履歷。符合資格者將享有優先面試的機會！參與2027年預聘暨研發替代役熱門職缺，您將可： ▪ 畢業前即拿到聘書 ▪ 與優秀產業菁英共事 ▪ 在國際舞台盡情發揮 截止收件日：2026/10/31 如您對此計畫感興趣，台積電將前往校園辦理徵才活動；活動當天安排畢業校友與同學們互動交流，機會難得，敬請把握。 此外，為同學安排了校園實體與線上說明會，歡迎踴躍報名參加，以便了解公司市場趨勢、組織概況，並掌握求職技巧！ 報名連結請參考官網 建議您根據學習領域與專業，投遞申請以下2~4個職位。符合主管需求者，將會收到面談邀請通知。 ▋歡迎志同道合的你，一起加入台積電 ▋世界上的每一個夢，都由我們來圓夢 Join TSMC: Where Infinite Possibilities Await. At TSMC, we believe in creating a challenging, continuous learning, and enjoyable work environment. We offer competitive compensation and benefits that exceed industry averages. Join us, and you‘ll collaborate with world-class talent, leveraging the most advanced process technologies to achieve breakthroughs that change the world. Every innovation and advancement carry the mark of our dedication. Are you ready to make an impact? We invite like-minded individuals to pre-register and submit resumes online through the 2027 TSMC RDSS&AO Program. Qualified applicants will receive priority interview opportunities! We are organizing both on-campus recruitment and online information sessions. We encourage you to sign up for the upcoming events to gain insights into the market trends, organizational overview, and master essential interview skills. Registration Link: Please refer to the career website Please apply online for this Campus Recruitment Event. If you already have preferred job openings, you may additionally apply for 2 to 4 positions from the list below. ▋2027 台積電預辦登積計畫熱門職缺 2027 TSMC RDSS&AO Recruitment Hot Jobs : (Please refer to the job in the career website for the details for each job below): R&D (研究與發展組織) 1-1 Research and Development Engineer (R&D) 1-2 Design and Technology Platform Engineer (DTP) 1-3 Specialty Engineer (Specialty) 1-4 Advanced Packaging Technology Development (APTD) Operations (營運組織) 2-1 Process Integration Engineer (PIE) 2-2 Process Engineer (PE) 2-3 Equipment Engineer (EQ) 2-4 Intelligent Manufacturing Engineer (IMC/MFG) 2-5 Facility Engineer (FAC) 2-6 Product Engineer (PE) 2-7 Advanced Packaging Technology and Service Engineer (APTS) 2-8 Quality & Reliability Engineer (Q&R) 2-9 E-Beam Operation Engineer (EBO) Corporate Business (策略暨支援組織) 3-1 Information Technology Engineer (IT) 3-2 Corporate Planning Organization (CPO) 3-3 Materials Management (MM) 3-4 Human Resources (HR)

1. 維護 ISO 9001 / IATF16949 等品質管理系統要求，建立與維護品質管理文件（含程序書、作業指導書、記錄表單），定期檢視文件符合實際作業並執行內部稽核稽查 2. 依據公司品質標準與客戶要求，制定、修訂與維護品質檢驗規範，並提供給相關單位執行 3. 與研發、製造、採購單位共同制定新產品導入品質管制計畫，如檢驗項目、抽樣計畫、可靠度測試計畫，以及試產階段不良分析與改善追蹤 4. 依客訴案件與退貨資料，進行失效分析與問題分類，彙整 8D 報告或品質分析報告，回覆客戶並追蹤改善方案執行成效與關鍵品質指標 5. 針對生產製程中發生的不良品與異常狀況，進行問題解析，運用 5Why、魚骨圖等手法找出 root cause，並提出矯正與預防對策 6. 建立並追蹤品質相關統計數據（如不良率、客訴率、供應商品質績效），運用統計手法（如管制圖、趨勢分析）進行製程能力分析，提出品質改善專案並定期向主管報告進度

1.物流分檢機維修保養、設備之操作，並維持機台正常運作。 2.設備故障排除及異常。處理 3.設備零、配件更換。 4.並依照屬性排除問題確保設備穩定性。 5.機台生產時追蹤並記錄設備狀況並分析、回饋給相關人員進行修正。 6.上班模式做2休2，每兩個月輪調日夜班。。 7.夜班將提供津貼5000元。

1.受理現場使用者的資訊問題（電腦、筆電、印表機、FAX、掃描器等） 2.軟體安裝、更新及設定（Windows / Office / 內部系統） 3.電腦硬體故障診斷與零件更換（RAM、硬碟、主機板等） 4.各類電腦設備建置、汰換、配置 5.印表機維護 / 碳粉更換 / 故障排除 6.承辦人交辦事項 7. 08:00-18:00彈性上班,需配合輪值到22:00。 *此職缺為約聘職

1. 設定、檢修網路、無線設備。 2. 維護網路管理機制。 3. 線上處理USER端L3、L2及AP問題，少數須前往現地端。 *此職缺為約聘職

1、對外線路及大內網網路流量監控 2、GSN線路斷線處理 3、防火牆申請單處理 4、網通設備設定檔備份/漏洞修補 5、CDN監控及管理 6、WAF監控及站台設定 7、外部憑證管控及置換 8、DNS設定調整、IP配發 9、有線/無線網路異常排錯 10、協助資安事件調查 11、協助系統異常排錯 12、臨時交辦事項及會議 13、每月月報彙整 14、配合資安稽核資料整理 15、災害演練、復原演練 16、周末VPN巡檢 *此職缺為約聘職

1.辦理本專案範圍設備維修工作，設備如屬保固期間者，須協助故障排除及叫修原保固廠商，具備機房維護、伺服器管理、網路管理、資訊安全設備管理，2年（含）以上相關工作經歷證明。 2.辦理有關系統管理、網路管理、資安設備管理、硬體維護、軟體系統維運操作、機房設施管理、機房備份服務及資產管理（含設備資訊資產標識）等事項。 3.監控、偵測並記錄整體系統軟硬體效能與系統資源使用狀況，依規定定期呈報相關報表及統計資料。 4.辦理本院機房網路整線及清點服務，包含更新機房網路拓樸圖並協助現有設備及網點之異動工作。 5.提供機櫃配置圖及系統架構圖繪製與維護服務。 6.承辦人交辦事項。 7.本缺需輪班，做四休四。 *此職缺為約聘職

1.系統、網路、資安及虛擬化環境管理 辦理與協助系統、網路、資安設備、虛擬化環境管理等作業。具備 Windows Server 系統與 Active Directory（AD）管理實務經驗。 具備下列任一相關證照者尤佳： PaloAlto 防火牆相關證照 Check Point 防火牆相關證照 Cisco CCNA 認證 Fortinet NSE 認證 VMWare 虛擬化相關證照 2.設備技術支援與故障排除 提供專案範圍內設備之諮詢、問題檢定、故障排除、設定調整及技術協助。 3.新購設備導入與 POC 測試支援 協助新增或採購設備之安裝、設定、使用支援及 POC（概念驗證）測試作業。 4.系統韌體與軟體更新管理 辦理或協助資訊設備之韌體、軟體修補程式（Patch）之評估、安裝與版本升級服務。 5.效能監控與定期報表提出 監控、偵測並記錄整體系統軟硬體效能及資源使用狀況，定期製交報表與統計資料。 *此職缺為約聘職

你對系統維運、故障排除與 Infrastructure 有熱情嗎？ 如果你喜歡解決問題、享受系統恢復正常的成就感，歡迎加入我們！ 無經驗可，公司提供完整培訓，歡迎想投入 IT 維運領域的你 ！ 加入我們，一起守護關鍵系統穩定運作，成為獨當一面的維運工程師！ ▍工作內容 ◎ 處理 SCADA / OT 系統故障與事件 ◎ 依 SLA 分級執行事件回應與排除 ◎ 執行系統巡檢與預防性維護 ◎ 協助系統更新與版本管理 ◎ 支援現場與遠端技術處理 ◎ 建立維運技術紀錄、異常回報與改善追蹤 ▍我們希望你 ◎ 對IT及OT維運與系統管理有興趣 ◎ 喜歡研究問題並找出解法 ◎ 願意學習新技術與持續成長 ◎ 具 Windows Server 或 Infrastructure 基礎概念者佳 ◎ 具廠務或工控相關背景者佳 ▍加入我們，你可以獲得 ◎ 完整教育訓練與實務經驗累積 ◎ 接觸 SCADA / OT 與企業級系統維運環境 ◎ 學習事件處理、系統維護與 Troubleshooting 能力 ◎ 培養 Infrastructure 與系統管理實戰經驗 ◎ 與團隊一起解決問題、持續成長 ◎ 成為獨當一面的維運工程師

🧭【工作內容 — 詳細說明】 📣 一、廣告名單+介紹人名單+開發 • 優質名單提供： 公司主動提供廣告洽詢名單、舊客戶轉介紹及合作管道，讓您入職即有客群。 • 個人品牌經營： 鼓勵運用公司提供的行銷素材，自由發揮創意經營個人流量（如：社群、自媒體），打造個人專業形象。 ☎️ 二、了解客戶狀況與需求 •與客戶電話溝通，了解其資金需求、收入、負債、信用狀況。 •以親切、專業的方式建立信任關係，為後續評估打下基礎。 📄 三、資料蒐集與初步評估 •電話或LINE引導客戶準備申辦文件 •根據不同條件，主管會全方位評估適合的金融產品類型 💬 四、方案說明與客戶溝通 •根據評估結果，告知客戶方案內容。 •說明不同方案的優缺點，協助客戶辦理，選擇最合適的方案。 •維護良好客戶關係，確保後續滿意度與轉介紹。

🧭【工作內容 — 詳細說明】 📣 一、廣告名單+介紹人名單+開發 • 優質名單提供： 公司主動提供廣告洽詢名單、舊客戶轉介紹及合作管道，讓您入職即有客群。 • 個人品牌經營： 鼓勵運用公司提供的行銷素材，自由發揮創意經營個人流量（如：社群、自媒體），打造個人專業形象。 ☎️ 二、了解客戶狀況與需求 •與客戶電話溝通，了解其資金需求、收入、負債、信用狀況。 •以親切、專業的方式建立信任關係，為後續評估打下基礎。 📄 三、資料蒐集與初步評估 •電話或LINE引導客戶準備申辦文件 •根據不同條件，主管會全方位評估適合的金融產品類型 💬 四、方案說明與客戶溝通 •根據評估結果，告知客戶方案內容。 •說明不同方案的優缺點，協助客戶辦理，選擇最合適的方案。 •維護良好客戶關係，確保後續滿意度與轉介紹。

1.依進貨檢驗 SOP 執行進貨檢驗作業，確認物料符合規格及品質要求 2.完整填寫進貨檢驗紀錄表，確保檢驗數據及判定結果正確、完整 3.依出貨檢驗 SOP 執行出貨檢驗作業，確認產品符合出貨品質要求 4.完整填寫出貨檢驗紀錄表，確保檢驗資料及判定結果正確、完整 5.依功能檢驗 SOP 執行產品功能檢驗，並完整填寫功能檢驗紀錄表 6.及時發現、判定及回報產品品質異常，避免不良品流入後續製程或客戶端 7.依不良品處理程序執行異常品管控，開立品質異常處理單，完成不良品標示及退回倉庫作業 8.品質異常發生時，主動與採購、業助及相關單位進行橫向溝通協調，並追蹤異常處理進度 9.每日確認物料實際到貨時間並登錄 IQC 待驗項目表，確保待驗資訊即時、完整 10. 維護 IQC 待驗項目表及相關追溯資料，確保物料待驗、檢驗及入庫狀態資訊正確 11.主管交辦事項

1、應具備政府大型專案資訊系統開發及建置經驗 2、熟悉python語言，並使用Django框架為獨立開發 3、熟悉LLM領域、大數據應用、系統監控架構 4、醫療資訊互通標準(Healthcare Interoperability) 5、主管依職務範圍指派之工作