清大專區

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16566&source=1111&tags=AO+2026_1111 Description : At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development productivity/quality.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16565&source=1111&tags=AO+2026_1111 Description : R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. Responsibilities: 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16564&source=1111&tags=AO+2026_1111 因為期待無限可能，所以選擇台積電！ 台積公司致力於營造一個充滿挑戰、持續學習且充滿樂趣的工作環境，並提供高於業界平均水準的薪酬與福利。加入台積電，您將有機會與世界一流的卓越夥伴共事，透過最先進的製程技術，共同成就改變世界的偉大事業。每一項突破與創新，都凝聚了我們的努力與心血。 2026年台積電預辦登積計畫：招募2026年應屆畢業生與研發替代役 台積電誠摯邀請「志同道合」的您，透過「線上應徵」事先註冊履歷。符合資格者將享有優先面試的機會！ 參與2026年預聘暨研發替代役熱門職缺，您將可： ▪ 畢業前即拿到聘書 ▪ 與優秀產業菁英共事 ▪ 在國際舞台盡情發揮 截止收件日：2025/10/31 如您對此計畫感興趣，台積電將前往校園辦理實體行動徵才車活動；活動當天不僅請您喝咖啡，並安排畢業校友與同學們互動交流，機會難得敬請把握機會。校園場次與報名資訊請參考官網（如未報名成功，也歡迎至現場和台積人資互動，現場投遞履歷，還可抽《限量》積星神秘小禮！） 此外，我們特別為同學安排了校園徵才實體與線上說明會，歡迎踴躍報名參加，以便了解公司市場趨勢、組織概況，並掌握求職技巧！報名連結：請參考官網 建議您根據學習領域與專業，投遞申請以下2~4個職位。符合主管需求者，將會收到面談邀請通知。 ▋歡迎志同道合的你，一起加入台積電 ▋世界上的每一個夢，都由我們來圓夢 Because we believe in endless possibilities, we choose TSMC! TSMC offers a wide variety of fulfilling experience and opportunities across our organization in many different locations. By joining TSMC, you will work with the high-performing teams in the industry and achieve your full potential through a comprehensive and systemized learning program here. We are devoted to achieving technology advancement, pursuing manufacturing excellence, and optimizing customer service. 2026 TSMC Advanced Offer and R&D Substitute Service Program Welcome to submit your resume via our application systems and apply to the following vacancies : 2026 TSMC Advanced Offer(AO) and R&D Substitute Service Program (RDSS). You will then be able to: • Get the offer before graduation. • Work with professional experts in the industry. • Fulfill yourself on the world stage. Application Deadline: October 31, 2025 Attending Campus Recruitment events with TSMC to enjoy a coffee with the industry experts to find out what suit you the best. For campus event schedule and registration details, please refer to TSMC career website (even if you are unable to register successfully, feel free to visit our booth and have a chat with us.) Submit your resume now, and gain a chance to win a limited TSMC’s gift! We’re also organizing a series of 〝TSMC Campus Recruitment Online Briefing Session〝, where you can find out more about industry trend, career opportunities, and life at TSMC. Registration link: Please refer to the career website We’re also organizing a series of 〝TSMC Campus Recruitment On-Site & Online Briefing Session〝, where you can find out more about industry trend, career opportunities, and life at TSMC. Registration link: Please refer to the career website We recommend you applying for two to four positions based on your academic background and professional expertise. If your qualifications meet the position requirements, you will receive an invitation for interviews. ▋Join TSMC｜Together, We Grow ! 2026 TSMC AO&RDSS Recruitment Job (Please refer to the job in the career website for the details for each job below): R&D (研究與發展組織) 　1-1 Research and Development Engineer (R&D) 　1-2 Design and Technology Platform Engineer (DTP) 　1-3 Specialty Engineer (Specialty) 　1-4 Integrated Interconnect & Packaging Engineer (IIP) Operations (營運組織) 　2-1 Process Integration Engineer (PIE) 　2-2 Process Engineer (PE) 　2-3 Equipment Engineer (EQ) 　2-4 Intelligent Manufacturing Engineer (IMC/MFG) 　2-5 Facility Engineer (FAC) 　2-6 Product Engineer (PE) 　2-7 Advanced Packaging Technology and Service Engineer (APTS) 　2-8 Quality & Reliability Engineer (Q&R) 　2-9 Module Associate Engineer (MAE) Corporate Business (策略暨支援組織) 　3-1 Information Technology Engineer (IT) 　3-2 Corporate Planning Organization (CPO) 　3-3 Materials Management Engineer (MM) 　3-4 Human Resources Specialist (HR) 【履歷填寫重點提醒】 1. 請務必優先填寫完成「畢業學校、畢業年份、就讀科系」後再更新履歷細節資訊，在系統資料送出後，您仍可以在收到面試邀請前持續更新內文。 2. 請詳細填寫履歷資料，包括學歷、專業關鍵字及自傳等內容；若您非外籍人士，除專業關鍵字外，其他欄位請以全中文填寫即可。 3. 自傳與專業關鍵字欄位有字數限制(1000字)，請確認字數是否符合要求，以免導致網頁無法成功送出。 4. 若履歷欄位為下拉式選單，當找不到合適內容時，可點選「其他」手動資料送出。 更多2026預聘暨研發替代役招募活動，請密切關注台積電FB粉絲專頁@加入台積 共創奇蹟 【Notes for Resume Submission】 1. Please prioritize completing the 〝Graduation School, graduation year and major〝 sections when submitting your resume. You can continue to update the content before receiving an interview invitation after the system data has been submitted. 2. Please click “Apply” and provide detailed resume information, including your education level, profession (with keywords that best describe your domain expertise) and autobiography, etc. If you are not a foreigner, please fill out the form (except for the keywords) in Mandarin. 3. Please make sure that the total work counts of your autobiography and keywords (domain description) are within a maximum of 1,000 characters respectively to prevent technical issues. 4. If a resume field is presented as a dropdown menu and you cannot find a suitable option, you may select 〝Other〝 and manually submit the required information. For more information about the 2026 Advanced Offer (AO) and R&D Substitute Service Program (RDSS), please follow our TSMC Facebook fan page@加入台積 共創奇蹟

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16579&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Our key responsibilities include: 1. We ensure customers‘ demands are well satisfied in the rapid market, win customer trust, enhance operation efficiency and reach profit maximization. 2. We drive for business effectiveness to bring world changing innovation into reality. 3. Our resources, production and demand planning, pricing, and system integration team develop flexible planning and provide quick responsiveness to coordinate needs between factories and customers. 4. We seek individuals who meet the following criteria: (1) Possess experience in Business, Industrial Engineering, Computer Science, Information Systems, Information Science, or Semiconductor Industry. (2) Have skills in logic thinking and communication, learning agility, and business acumen. Opening roles for you: 1. Account PC Planner 2. Fab Production Control Planner 3. Fab Rationalization Engineer 4. Operation Resources Planning Engineer 5. DevOps Engineer 6. ML/AI Engineer 7. Corporate Planning Associate For detailed job description, please refer to: https://careers.tsmc.com/careers/JobDetail?jobId=16579&source=1111&tags=AO+2026_1111 Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16580&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: Opening roles for you: 1. Global Procurement and Supply Planning Professionals 2. Global Logistics Digital Transformation Engineer 3. Responsible Supply Chain Management Engineer 4. Supply Chain Auditor 5. Resource Recovery Management Engineer For detailed job description, please refer to: https://careers.tsmc.com/careers/JobDetail?jobId=16580&source=1111&tags=AO+2026_1111 Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16588&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We are looking for an experienced IT Specialist to support the digital transformation of our corporate finance systems. This role requires a hands-on technologist with solid software development skills and a strong understanding of treasury operations and AI/ML integration. Key responsibilities include: 1. Design, develop and enhance the IT infrastructure within Finance Division. 2. Work closely with finance teams to understand needs and deliver technical solutions. 3. Develop and maintain code in Java, JavaScript, and SQL environments. 4. Integrate AI/ML models into finance systems for predictive analytics and automation. 5. Ensure system security, scalability, and compliance with financial regulations. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16346&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We are looking for a technical manager who is excited to join a growing group of diverse talents responsible for driving novel memory solutions for the leading-edge AI and HPC chips. You will be part of a memory solution team developing high-density memory macro, complex analog, and chip interface circuits for advanced memory technology. We have crafted a team of outstanding engineers stretching around the globe. If you have the dream to develop new technologies and have the real impact on the future of AI compute, this is the ideal position for you. Responsibilities: 1. Lead the designs of memory architecture, memory, analog and digital circuits, and test chip, ensuring they meet the performance, power, and area specifications. 2. Provide technical leadership in areas like memory read/write circuits, analog biasing circuits including LDO and charge pump, design-for-test (DFT), function verification, and memory chip integration. 3. Collaborate closely with technologists and customers to define PPA specifications, architecture, and design of memory circuits. 4. Demonstrate hands-on expertise in designing memory circuit blocks and utilizing EDA tools for timing, power, signal integrity, EM/IR analysis, static timing, and noise analysis. 5. Drive design verification and implement quality assurance methodologies for memory IP. 6. Define silicon test plans and provide support for post-silicon bring-up and debugging in collaboration with test teams. 7. Manage design projects by planning and organizing design resources, while addressing customer/client requests and events as they arise. 8. Work closely with cross-functional teams across global locations to ensure successful project execution. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16306&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Responsible for leading a group of designers to perform R&D works to evaluate PPA of circuit-level novelties and tapeout proof-of-concept chips. 2. Coordinate with multifunctional teams across Device, Circuit, and System in R&D. 3. Collaborate with external university and industry partners on research topics. 4. Convert results of innovative research into patents and publications. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16023&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Advanced Packaging‘s mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider. Responsibilities: 1. Advanced panel level packaging development for CoPoS technology. 2. Exploratory panel level packaging process/material/tool development for new applications. 3. Process stability/manufacturability improvement for yield and reliability qualification. 4. Responsible for transferring the process/material/tool for mass production. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15646&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Be responsible for establishing a R&D line, including tool evaluation and process development. 2. Enhance tooling capabilities to meet the demands of advanced packaging products. 3. Establish a standardized methodology for process development and characterization of panel manufacturing processes. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15353&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Advanced Packaging‘s mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider. Responsibilities: Act as first line guardian of TSMC world class chip manufacturing process. Ensure the stable quality of wafers output by monitoring and adjusting process parameters to enhance machine efficiency. 1. Develop and maintain baselines, including setting up recipes. (1) Improve the stability and accuracy of metrology recipes to enhance yield and reliability qualifications. (2) Responsible for transferring metrology solutions to volume manufacturing. 2. Employ cutting-edge technology to 3DIC metrology, including SoIC, CoWoS, InFO, and Panel. (1) Leverage your analytical abilities to improve metrology performance, guaranteeing high yield and device efficiency. (2) Identify challenges, formulate methodologies, propose solutions, and new metrology evaluation plans. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

1.金控共同行銷 2.投信相關業務 3.主管交辦事項 4.熟悉EXCEL函數、SQL、SAS者佳

公司約訪, 組織規劃辦理投研活動, 客戶聯繫及服務, 資料整理撰寫及發送

1.熟悉 C# 程式語言，並具備 .NET Core / .NET Framework 的實際開發經驗。 2.具備 RESTful API 設計與開發經驗。 3.熟悉關聯式資料庫 MS SQL。 4.對於自動化工作流程有高度熱情，並具備 n8n 工具的使用經驗。 5.具備 AI應用知識與專案經驗，例如：OpenAI API，Github Copilot，Vibe Coding。 6.具備良好的邏輯思維、系統分析與問題解決能力。 7.樂於團隊合作，並具備良好的溝通能力。

1.負責WndowsForm程式維護及需求開發 2.3年以上C#及WndowsForm 開發經驗 3.熟悉MS SQL、StoredProcedure開發 4.能使用Python語言產生Excel報表 5.具證券金融商品知識、風控系統經驗尤佳 6.具有持續學習新技術改善系統的熱情，並樂於在團隊中分享知識和經驗

1.針對海外市場(美、港、陸、日)出具市場資訊 2.針對全球總經進行分析評論 3.協助公司晨會報告 4.支援分公司複委託市場講師 5.協助主管專案業務

1.協助分公司複委託業務推廣 2.協助分公司進行客戶陪訪 3.協助分公司教育訓練 4.協助總公司交辦之業務事項

1.有價證券受託買賣及各項金融商品之推廣。 2.提供投資理財商品的諮詢服務。 3.拜訪與服務客戶。 4.開發新客源。 福利制度： ◎員工旅遊補助 ◎勞、健保 ◎退休金提列 ◎生日禮金 ◎婚喪補助 ◎三節禮金 ◎健康檢查

1.負責客戶品質客訴 2.不良品分析及提供分析報告 3.客戶服務 4.廠內改善措施的執行確認

1.根據一般理財客戶需求及風險接受狀況，建議及銷售既有金融理財各項商品，以達成個人業務目標。 2.隨時掌握股市與經濟資訊脈動，定期檢視客戶資產組合，適時推薦最適合之金融商品與服務，並適時處理業務轉介，以深耕客戶關係並達成業務目標 3.執行各項理財專案或行銷活動，以達成銷售預定目標