清大專區

• 此職位屬於聯發科技modem客戶工程團隊，該團隊任務為與內部研發團隊合作，支援全球一流智能手機客戶的無線通訊技術(包括LTE、5G Sub-6GHz和5G mmWave技術)。 • 此職位主要職責在與客戶合作過程中帶領技術討論，並與內外部不同團隊合作，共同討論並解決客戶問題、滿足需求。 • 此職位需具備深入研究技術問題、了解客戶需求分析與功能開發的能力及良好應變能力。 • This is an exciting role in the MediaTek wireless technology group within the modem customer engineering team working with internal R&D team and support tier-1 global smartphone customers in wireless technologies (LTE, 5G Sub-6GHz, and 5G mmWave technologies) • You will play a key technical role in working with internal and external stakeholders to lead technical discussion and drive customer issues to resolution. • This is a dynamic position that will interact and collaborate with different teams and site location. • Ability to deep dive technical issues, understand customer requirement analysis and feature development. Looking for 4G/5G Modem Protocol / System Engineer with technical breadth in the protocol stack.

加入德微、成就巍巍！ 1.開發潛在客戶，維護及管理原有客戶，達成公司營業目標 2.負責日常客戶聯絡與溝通、提供產品報價、展示，處理帳款回收相關事宜 3.協調客戶與工廠生產計劃 4.察覺客戶交易異常狀況，負責客訴問題之處理 5.相關業務報表分析製作 ※ 此職務需開車公出，須備有汽車駕照及實際上路經驗。

1. Work with design teams to do performance sign off in pre-silicon stage 2. ESL platform and simulation/emulation technology development. 3. Model development (includes behavior modeling/ cycle approximate modeling)

1.PCB 電路及layout 的設計及驗證 2. 客戶端平台之開發驗證

1. LCD Monitor IC相關的韌體開發 2. 影像處理相關應用與支援客戶產品開發 3. LCD Monitor周邊軟體tool開發

1. Work on 3~7nm design implementation, methodology, and sign-off 2. Perform synthesis, DFT, floorplan, clock planning, place and route, timing closure, ECO, IR signoff, and physical verification 3. Manage schedule, resolve design and flow issues, drive methodologies and execution

1、數位收付整合服務審核作業。 2、數位收付、繳費稅相關帳務作業。 3、數位收付營運及帳務流程優化改善建議。 4、跨部門溝通協調、協助處理數位收付營運作業問題。 5、協助防洗風控相關報表作業。 6、落實個資保護及完成主管交辦事項。

• Define GPU compiler software architecture and interfaces. • Development/implement GPU compiler pipeline, linking and various optimizations/transformations. • Collaborate with Driver team, HW team to implement new API & HW features. • Collaborate with Driver team, HW team to improve/tune performance & power consumption. • Execute & deliver to meet milestones/schedules. • Analyze and debug code generation issues. • Construct reliable & trustable relationships across teams internally & externally.

• Work with the architecture/micro-architecture/design teams to do white box testing. • Create testplans based on the micro-architecture document with the design team. • Build, maintain and upgrade testbenches and their components using UVM-based methods. • Build custom BFMs for co-sim based module level verification. • Add assertions and checkers to facilitate verification. • Work with the design team to do module level formal verification. • Create controlled random testcases. Pre-debug and provide debug reports. • Check functional coverage and code coverage.

1. DFT architecture exploration & evaluation for next-gen process node & package technology of MediaTek: * Scan chain insertion & ATPG pattern generation * Pattern validation through simulation & silicon analysis(pass/fail, shmoo, fail log, etc.) * Diagnosis to help manufacture process improvement 2. Co-work with SoC architect, RTL designer, physical design engineer, and package engineer to define best architecture for 3D-IC: * PPA(Performance/Power/Area) impact analysis & mitigation via DFT innovation * Develop & integrate DFT-related RTL design modules to test chip

開發模擬以及PoC測試平台, 工作包括 - 實作分散式運算架構 - 利用Kubernetes container 管理架構 - 實作概念性驗證

Do you want to be part of a smart and passionate team of researchers, advancing artificial intelligence to the next level of end-user experience in their daily lives? MediaTek is seeking driven and brilliant young students to join our efforts by providing Internship placements. We are currently working to expand the frontiers of Deep Learning frameworks for Computer Vision and Natural Language Processing and we hope you can join us! The ideal candidate is open-minded, passionate about learning theory, and looks forward to both practical and challenging problems. • You will be working towards or recently have completed a PhD in a quantitative field such as Computer Science, Mathematics, Physics or Engineering. • You have a good knowledge of the foundations of Deep Learning and Neural Networks, including some experience with Machine Learning frameworks (Tensorflow, PyTorch, JAX) • You are a proficient scientific communicator. You are committed to your goals and working in a team. • You are eager to tackle the state of the art problems in the field. We want your ideas to shine! As a Deep Learning Researcher in our team, you will collaborate with our Researchers and with worldwide colleagues, stay up and above the state of the art, initiate with novel ideas, and develop them into algorithms and applications that make the real difference in everyday devices. You will also push your contribution by publishing at top-tier conferences, such as NeurIPS, ICML, ICLR, CVPR, ACL, ICRA, ACM.

1. WiFi/BT/GPS/FM connectivity IC驗證及系統應用 2. PMIC or PCIe 系統設計及驗證 3. Connectivity 系統性能優化及驗證 4. Connectivity參考電路設計及驗證 5. 協助客戶量產過程時提供技術支援

1. Develop systematic algorithms to alleviate design challenges, including implementation, process what-if assessment, system performance evaluation, in advanced nodes or package 2. Closely work with foundry and EDA vendors to define innovative HPC, Chiplet design methodologies 3. Explore new EDA features and define improvement direction from MTK product requirements

1.Smartphone SLT軟體整合(C/Android) 2.Smartphone SLT量產測試自動化流程改善

1. 數位晶片設計流程與整合 2. 熟悉低功耗的設計流程(和架構)

1. 測試機台操作與管理. 2. 產品品質問題電性分析 3. 跨部門溝通以分析產品故障真因

1. FR-1 平台天線解決方案開發與驗證 2. 使用EM模擬軟體進行天線解決方案性能評估 3. 與跨部門團隊合作開發新MTK平台天線解決方案

1. 規劃量產測試以及量產functin pattern porting 2. 測試以及驗證IC功能，性能，以及功耗等等相關測試 3. 分析測試資料以及釐清相關測試的問題，並分析良率問題以及良率改善建議 4. AVS low power的設計

先進封裝技術開發 1. 先進新產品導入技術開發 (新產片試產規劃, DRC/DRM檢驗, DOE及良率改善規劃, 量產區間及良率分析) 2. 熟悉先進chiplet及3DIC封裝技術開發 3. 晶圓級與面板級先進封裝結構設計